Intel Corporation
Manufacturing Process Engineer
U.s. Army Research Laboratory Jan 2008 - Jan 2009
Electronic Engineer
Education:
University of Florida 2006 - 2010
Doctorates, Doctor of Philosophy, Electronics Engineering, Philosophy
University of Florida 2003 - 2006
Masters, Electronics Engineering
University of Florida 1999 - 2003
Bachelors, Electronics Engineering
Skills:
Manufacturing Mems Semiconductors Electrical Engineering Matlab Engineering Electronics Engineering Management Testing Spc Lean Manufacturing Statistical Process Control
David Patrick Arnold - Gainesville FL, US Israel Boniche - Rio Rancho NM, US Christopher David Meyer - Bethesda MD, US Sivaraman Masilamani - Northborough MA, US
Assignee:
University of Florida Research Foundation, Inc. - Gainsville FL
International Classification:
H01L 35/32 H01L 35/34
US Classification:
136224, 136201
Abstract:
The subject invention pertains to thermoelectric power generation. According to certain embodiments, a stack of silicon-micromachined chips can be connected to form a cylindrical heat exchanger that enables a large, uniform temperature difference across a radially-oriented thermopile. Each layer in the stack can comprise two thermally-isolated concentric silicon rings connected by a polyimide membrane that supports patterned thermoelectric thin films. The polyimide membrane can be formed by selectively etching away the supporting silicon, resulting in thermally-isolated inner and outer rings. In operation, hot gas can flow through a finned central channel, and an external cross flow can enhance heat transfer to ambient to keep the outer surfaces cool. The resulting temperature gradient across the thermopile generates a voltage potential across the open ends due to the Seebeck effect. When connected to a load, current flows, and electrical power is supplied by the generated voltage potential caused by the temperature gradient.