Jack X Chen

US Patent:

7479236, Jan 20, 2009

Filed:

Dec 18, 2006

Appl. No.:

11/612355

Inventors:

Jack Chen - Fremont CA, US
Ben Mooring - Austin TX, US
Stephen J. Cain - Travis TX, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

G01L 21/30
G05B 15/00

US Classification:

216 59, 216 58, 700121, 713155

Abstract:

A method for calculating a process center for a chuck in a processing chamber is provided. The method includes generating pre-processing and post-processing measurement data points, which is perform by measuring thickness of a film substrate at a set of orientations and a set of distances from a geometric center of the substrate. The method also includes comparing the pre-processing and post-processing measurement data points to calculate a set of etch depth numbers. The method further includes generating etch profiles for the set of orientations. The method yet also includes extrapolating a set of radiuses, which is associated with a first etch depth, from the etch profiles. The method yet further includes generating an off-centered plot, which is a graphical representation of the set of radiuses versus the set of orientations. The method more over includes calculating the process center by applying a curve-fitting equation to the off-centered plot.

US Patent:

7486878, Feb 3, 2009

Filed:

Dec 18, 2006

Appl. No.:

11/612370

Inventors:

Jack Chen - Fremont CA, US
Ben Mooring - Austin TX, US
Stephen J. Cain - Travis TX, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

G03B 15/00
G03B 15/03
G03B 17/00
G01R 13/26

US Classification:

396 5, 396155, 396419, 438 14

Abstract:

A bevel inspection module for capturing images of a substrate is provided. The module includes a rotational motor, which is attached to a substrate chuck and is configured to rotate the substrate chuck thereby allowing the substrate to revolve. The module further includes a camera and an optic enclosure, which is attached to the camera and is configured to rotate, enabling light to be directed toward the substrate. The camera is mounted from a camera mount, which is configured to enable the camera to rotate on a 180 degree plane allowing the camera to capture images of at least one of a top view, a bottom view, and a side view of the substrate. The module yet also includes a backlight arrangement, which is configured to provide illumination to the substrate, thereby enabling the camera to capture the images, which shows contrast between the substrate and a background.

US Patent:

7575638, Aug 18, 2009

Filed:

Feb 2, 2007

Appl. No.:

11/701854

Inventors:

Jack Chen - Fremont CA, US
Yunsang Kim - Monte Sereno CA, US
Gregory S. Sexton - Fremont CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B05B 5/025
C23C 16/00
C23F 1/00
H01L 21/306

US Classification:

118624, 118715, 118723 E, 118723 R, 1563453, 15634544, 15634545, 15634546, 15634547

Abstract:

Positional relationships are established in a process chamber. An upper electrode is configured with a first surface to support a wafer, and an electrode has a second surface. A linear drive is mounted on the base and a linkage connected between the drive and the upper electrode. Linkage adjustment defines a desired orientation between the surfaces. The linear drive and linkage maintain the desired orientation while the assembly moves the upper electrode with the surfaces moving relative to each other. An annular etching region defined between the electrodes enables etching of a wafer edge exclusion region extending along a top and bottom of the wafer. Removable etch defining rings are configured to define unique lengths along each of the top and bottom of the wafer to be etched. Positional relationships of the surfaces enable limiting the etching to those unique lengths of the exclusion region.

US Patent:

7718542, May 18, 2010

Filed:

Aug 25, 2006

Appl. No.:

11/510309

Inventors:

Yunsang Kim - Monte Sereno CA, US
Andrew Bailey, III - Pleasanton CA, US
Jack Chen - Fremont CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

H01L 21/302

US Classification:

438725, 438706, 438 73, 134 12

Abstract:

A method for etching a bevel edge of a substrate is provided. A patterned photoresist mask is formed over the etch layer. The bevel edge is cleaned comprising providing a cleaning gas comprising at least one of a CO, CO, CH, H, NH, CHFand a combination thereof, forming a cleaning plasma from the cleaning gas, and exposing the bevel edge to the cleaning plasma. Features are etched into the etch layer through the photoresist features and the photoresist mask is removed.

US Patent:

7981307, Jul 19, 2011

Filed:

Oct 2, 2007

Appl. No.:

11/866392

Inventors:

Jack Chen - Fremont CA, US
Iqbal Shareef - Fremont CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B44C 1/22
H01L 21/00

US Classification:

216 67, 216 58, 438706, 438710, 134 11, 134 2, 134 2218

Abstract:

A method for etching a bevel edge of a substrate in a processing chamber is provided. The method includes flowing an inert gas into a center region of the processing chamber defined above a center region of the substrate and flowing a mixture of an inert gas and a processing gas over an edge region of the substrate. The method further includes striking a plasma in the edge region, wherein the flow of the inert gas and the flow of the mixture maintain a mass fraction of the processing gas substantially constant. A processing chamber configured to clean a bevel edge of a substrate is also provided.

US Patent:

8131875, Mar 6, 2012

Filed:

Nov 26, 2007

Appl. No.:

11/945233

Inventors:

Jack Chen - Belmont CA, US
Rupen Chanda - San Francisco CA, US

Assignee:

Adobe Systems Incorporated - San Jose CA

International Classification:

G06F 15/16
G06F 3/00

US Classification:

709246, 707E17121, 709203, 715744

Abstract:

Systems and methods, including computer software implementations, involve identifying a first set of device capabilities associated with an electronic device. The first set of device capabilities include one or more device capabilities. A description of the first set of device capabilities is provided to a remote source, and a first device profile identifier is received from the remote source. The first device profile identifier is associated with the first set of device capabilities. The first device profile identifier is stored on the electronic device, and the received first device profile identifier is included in a communication to the remote source.

US Patent:

8135485, Mar 13, 2012

Filed:

Sep 24, 2008

Appl. No.:

12/237155

Inventors:

Jack Chen - Fremont CA, US
Ben Mooring - Austin TX, US
Stephen J Cain - Travis TX, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

H01L 21/00
G06F 19/00
G05B 19/418
G05B 15/00
B44C 1/22
G06K 9/00

US Classification:

700114, 438 6, 700108, 700117, 700121, 700171, 700245, 700248, 700275, 216 37, 382153

Abstract:

A method for aligning a substrate to a process center of a support mechanism is provided. The method includes determining substrate thickness after substrate processing at a plurality of orientations and at a plurality of radial distances from a geometric center of the substrate. The method also includes deriving a set of process rate values from substrate thickness and process duration. The method further includes creating for a process rate an off-centered plot, which represents a substantially concentric circle whose points are a circumference of the off-centered plot having substantially the first process rate. The method yet also includes applying a curve-fitting equation to the off-centered plot to determine a set of parameters. The method yet further includes teaching a set of robot arms the set of parameters, thereby enabling the set of robot arms to align another substrate that is supported by the support mechanism with the process center.

US Patent:

8185242, May 22, 2012

Filed:

May 7, 2008

Appl. No.:

12/116897

Inventors:

Scott Wong - Sunnyvale CA, US
Jeffrey Lin - Hsinchu, TW
Jack Chen - Fremont CA, US
Benjamin W. Mooring - Cedar Park TX, US
Chung Ho Huang - San Jose CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

G06F 19/00
G06F 17/00
G05B 19/18
G05B 15/00
G05B 19/00

US Classification:

700254, 700114, 700245, 700264, 901 3, 901 40, 901 46

Abstract:

Methods and systems to optimize wafer placement repeatability in semiconductor manufacturing equipment using a controlled series of wafer movements are provided. In one embodiment, a preliminary station calibration is performed to teach a robot position for each station interfaced to facets of a vacuum transfer module used in semiconductor manufacturing. The method also calibrates the system to obtain compensation parameters that take into account the station where the wafer is to be placed, position of sensors in each facet, and offsets derived from performing extend and retract operations of a robot arm. In another embodiment where the robot includes two arms, the method calibrates the system to compensate for differences derived from using one arm or the other. During manufacturing, the wafers are placed in the different stations using the compensation parameters.

Author:

Jack Chen

ISBN #:

0025246305

Author:

Jack Chen

ISBN #:

0025246402

Author:

Jack Chen

ISBN #:

0025246607

Author:

Jack Chen

ISBN #:

0062501402

Author:

Jack Chen

ISBN #:

0809305844

Author:

Jack Chen

ISBN #:

0859690717