Yun B Kim

US Patent:

8117080, Feb 14, 2012

Filed:

Apr 11, 2011

Appl. No.:

13/083902

Inventors:

Sung Wan Ban - Tujunga CA, US
Yun Hee Kim - Tujunga CA, US

International Classification:

G06Q 30/00

US Classification:

705 261

Abstract:

This invention relates to a pooling method for an auction existing in a social network system wherein bidding back-up friends who provided the best bidder or raffle winner with bidding money, bidding ticket, or raffle ticket are compensated. The compensation is proportional to the amount of bidding money provided, and the order of the winner and the bidding back-up friend. The pooling method for an auction bid in a social network system comprises the steps of: providing users with bidding money, building a bidding back-up friendship among the users, providing the users with bidding tickets, providing one user's bidding money or bidding ticket to his bidding back-up friend who participates in an auction, and best bidder wins the auction and his bidding back-up friends are compensated.

US Patent:

20170079144, Mar 16, 2017

Filed:

May 18, 2015

Appl. No.:

15/311125

Inventors:

- Oakland CA, US
Dae Kang - Los Angeles CA, US
Yun Soung Kim - San Diego CA, US
Mridu Sinha - La Jolla CA, US

International Classification:

H05K 3/00
H05K 3/46
H05K 3/02
H05K 3/06
H05K 1/02
H05K 1/11

Abstract:

Disclosed are methods for fabrication of flexible circuits and electronic devices in cost effective manner that can include integration of submicron structures directly onto target substrates compatible with industrial microfabrication techniques. In one aspect, a method to fabricate an electronic device, includes depositing an electrically conductive layer on a processing substrate including a weakly-adhesive interface layer on a support substrate; depositing an insulating layer on the conductive layer to attach to the conductive layer; forming a circuit on the processing substrate by etching selected portions of the conductive layer based on a circuit design; and producing a flexible electronic device by attaching a flexible substrate to the formed circuit on the processing substrate and detaching the circuit and the flexible substrate from the interface layer, in which the flexible electronic device includes the circuit attached to the flexible substrate.

Author:

Yun Ku Kim

ISBN #:

3631496605