Simon L Wilson

US Patent:

20080284798, Nov 20, 2008

Filed:

May 6, 2008

Appl. No.:

12/116056

Inventors:

Steven Todd Weybrew - Portland OR, US
Brian Ellis - San Diego CA, US
Baback Elmieh - Carlsbad CA, US
Simon Wilson - Dacono CO, US

Assignee:

QUALCOMM Incorporated - San Diego CA

International Classification:

G09G 5/00

US Classification:

345630, 345629

Abstract:

In general, the present disclosure describes various techniques for overlaying or combining a set of rendered graphics surfaces onto a single graphics frame. One example device includes a first processor that selects a surface level for each of a plurality of rendered graphics surfaces prior to the device outputting any of the rendered graphics surfaces to a display. The device further includes a second processor that retrieves the rendered graphics surfaces, overlays the rendered graphics surfaces onto a graphics frame in accordance with each of the selected surface levels, and outputs the graphics frame to the display.

US Patent:

20080143737, Jun 19, 2008

Filed:

Dec 12, 2007

Appl. No.:

11/955239

Inventors:

Steven Todd Weybrew - Portland OR, US
Simon Wilson - Dacono CO, US
Brian Ellis - San Diego CA, US

Assignee:

QUALCOMM INCORPORATED - San Diego CA

International Classification:

G09G 5/02

US Classification:

345592

Abstract:

An apparatus, method, and computer program product for applying transparency to a rendered surface. The apparatus comprises a graphics processor configured to render a surface, wherein a transparency parameter is associated with the surface, the transparency parameter defining a blending process. The apparatus further includes a display processor configured to blend the rendered surface in accordance with the transparency parameter. Preferably, the transparency parameter is an EGL surface attribute.

US Patent:

20080143749, Jun 19, 2008

Filed:

Dec 12, 2007

Appl. No.:

11/955218

Inventors:

Steven Todd Weybrew - Portland OR, US
Simon Wilson - Dacono CO, US
Brian Ellis - San Diego CA, US

Assignee:

QUALCOMM INCORPORATED - San Diego CA

International Classification:

G09G 5/00

US Classification:

345649

Abstract:

An apparatus, method, and computer program product for rotating a rendered surface. The apparatus includes a graphics processor configured to render a surface, wherein a display orientation parameter is associated with the surface, the display orientation parameter defining a rotation process. The apparatus further includes a display processor configured to rotate the rendered surface in accordance with the display orientation parameter. Preferably, the display orientation parameter is an EGL surface attribute.

US Patent:

20080143760, Jun 19, 2008

Filed:

Dec 12, 2007

Appl. No.:

11/955253

Inventors:

Brian Ellis - San Diego CA, US
Steven Todd Weybrew - Portland OR, US
Simon Wilson - Dacono CO, US
Baback Elmieh - Carlsbad CA, US

Assignee:

QUALCOMM INCORPORATED - San Diego CA

International Classification:

G09G 5/02

US Classification:

345698, 345660

Abstract:

An apparatus, method, and computer program product for scaling a rendered surface. The apparatus includes a graphics processor configured to render a surface at a source resolution, wherein a scaling parameter is associated with the surface, the scaling parameter defining the source resolution and a destination resolution. The apparatus further includes a display processor configured to scale the rendered surface to the destination resolution. Preferably, the scaling parameters are EGL surface attributes.

US Patent:

20210360787, Nov 18, 2021

Filed:

May 18, 2020

Appl. No.:

16/877405

Inventors:

- Hsinchu, TW
Simon Wilson - San Jose CA, US

International Classification:

H05K 1/11
H05K 7/14
H05K 1/02
H01L 23/00
H05K 7/10
H05K 3/34

Abstract:

A method is provided for mounting a semiconductor IC to a substrate without a socket or solder. The method includes disposing a guide structure on the substrate. The substrate has multiple contact pads disposed thereon. The substrate also has multiple nuts formed therein for connecting to one or more bolts. The method also includes placing the semiconductor IC inside the guide structure such that the semiconductor IC makes contact with the contact pads. A top plate is disposed on the semiconductor IC. Further, the top plate and the semiconductor IC are fastened to the substrate.

Author:

Simon Wilson

ISBN #:

0295967625

Author:

Simon Wilson

ISBN #:

0295970391

Author:

Simon Wilson

ISBN #:

0370300343

Author:

Simon Wilson

ISBN #:

0520227697

Author:

Simon Wilson

ISBN #:

0520227700

Author:

Simon Wilson

ISBN #:

0801413303

Author:

Simon Wilson

ISBN #:

0801494680

Author:

Simon Wilson

ISBN #:

0714816930