Sarah S Kim

US Patent:

7105382, Sep 12, 2006

Filed:

Nov 24, 2003

Appl. No.:

10/721441

Inventors:

Alan M. Myers - Menlo Park CA, US
Sarah E. Kim - Portland OR, US
R. Scott List - Beaverton OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 21/50

US Classification:

438122, 438106, 257E23098, 257E25013

Abstract:

A device where the electrodes of an electroosmotic pump are located directly in the flow-producing region of the electroosmotic pump is described as well as methods of forming such a device. Placing the electrodes of an electroosmotic pump directly in the flow-producing region of the electroosmotic pump may increase the flow rate of a cooling fluid that is pumped through the pump. The cooling fluid may then remove a greater amount of heat from the substrate over which it is flowed. The substrate may be the non-device side of a die or a thermal management chip that is placed in direct contact with the non-device side of a die. In these instances the electroosmotic pump may be part of a microelectronic package containing the die or the thermal management chip.