Richard S Chen

US Patent:

7241689, Jul 10, 2007

Filed:

Jan 3, 2005

Appl. No.:

11/029169

Inventors:

Kieun Kim - Pasadena CA, US
Adam L. Cohen - Los Angeles CA, US
Willa M. Larsen - Reseda CA, US
Richard T. Chen - Burbank CA, US
Ananda H. Kumar - Fremont CA, US
Ezekiel J. J. Kruglick - San Diego CA, US
Vacit Arat - La Canada Flintridge CA, US
Gang Zhang - Monterey Park CA, US
Michael S. Lockard - Lake Elizabeth CA, US

Assignee:

Microfabrica Inc. - Van Nuys CA

International Classification:

H01L 21/44

US Classification:

438670, 438689, 257E21159, 257E21523

Abstract:

Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.

US Patent:

7265562, Sep 4, 2007

Filed:

Jan 3, 2005

Appl. No.:

11/029219

Inventors:

Richard T. Chen - Burbank CA, US
Ezekiel J. J. Kruglick - San Diego CA, US
Christopher A. Bang - San Diego CA, US
Dennis R. Smalley - Newhall CA, US
Pavel B. Lembrikov - Santa Monica CA, US

Assignee:

Microfabrica Inc. - Van Nuys CA

International Classification:

G01R 31/02

US Classification:

324754, 324762

Abstract:

Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

US Patent:

7265565, Sep 4, 2007

Filed:

Jan 3, 2005

Appl. No.:

11/028960

Inventors:

Richard T. Chen - Burbank CA, US
Ezekiel J. J. Kruglick - San Diego CA, US
Christopher A. Bang - San Diego CA, US
Dennis R. Smalley - Newhall CA, US
Pavel B. Lembrikov - Santa Monica CA, US

Assignee:

Microfabrica Inc. - Van Nuys CA

International Classification:

G01R 31/02

US Classification:

324762, 324754

Abstract:

Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

US Patent:

7273812, Sep 25, 2007

Filed:

Jul 7, 2005

Appl. No.:

11/178145

Inventors:

Kieun Kim - Pasadena CA, US
Adam L. Cohen - Los Angeles CA, US
Willa M. Larsen - Reseda CA, US
Richard T. Chen - Burbank CA, US
Ananda H. Kumar - Fremont CA, US
Ezekiel J. J. Kruglick - San Diego CA, US
Vacit Arat - La Canada Flintridge CA, US
Gang Zhang - Monterey Park CA, US
Michael S. Lockard - Lake Elizabeth CA, US
Christopher A. Bang - San Diego CA, US

Assignee:

Microfabrica Inc. - Van Nuys CA

International Classification:

H01L 21/44

US Classification:

438670, 257E21159, 257E23108, 438736

Abstract:

Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.

US Patent:

7363705, Apr 29, 2008

Filed:

Jan 3, 2005

Appl. No.:

11/028962

Inventors:

Kieun Kim - Pasadena CA, US
Adam L. Cohen - Los Angeles CA, US
Willa M. Larsen - Reseda CA, US
Richard T. Chen - Burbank CA, US
Ananda H. Kumar - Fremont CA, US
Ezekiel J. J. Kruglick - San Diego CA, US
Vacit Arat - La Canada Flintridge CA, US
Gang Zhang - Monterey Park CA, US
Michael S. Lockard - Lake Elizabeth CA, US

Assignee:

Microfabrica, Inc. - Van Nuys CA

International Classification:

H01R 9/00

US Classification:

29842, 29874, 29884, 174261, 324754, 324761

Abstract:

Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.

US Patent:

7412767, Aug 19, 2008

Filed:

Jan 3, 2005

Appl. No.:

11/029217

Inventors:

Kieun Kim - Pasadena CA, US
Adam L. Cohen - Los Angeles CA, US
Willa M. Larsen - Reseda CA, US
Richard T. Chen - Burbank CA, US
Ananda H. Kumar - Fremont CA, US
Ezekiel J. J. Kruglick - San Diego CA, US
Vacit Arat - La Canada Flintridge CA, US
Gang Zhang - Monterey Park CA, US
Michael S. Lockard - Lake Elizabeth CA, US

Assignee:

Microfabrica, Inc. - Van Nuys CA

International Classification:

H01R 43/02
H01R 9/00

US Classification:

29879, 29842, 29843, 29874, 29876, 29877, 29878, 2281805

Abstract:

Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.

US Patent:

7504840, Mar 17, 2009

Filed:

Oct 6, 2005

Appl. No.:

11/244817

Inventors:

Vacit Arat - La Canada Flintridge CA, US
Adam L. Cohen - Los Angeles CA, US
Dennis R. Smalley - Newhall CA, US
Ezekiel J. J. Kruglick - San Diego CA, US
Richard T. Chen - Burbank CA, US
Kieun Kim - Pasadena CA, US

Assignee:

Microfabrica Inc. - Van Nuys CA

International Classification:

G01R 31/02

US Classification:

324754, 324762

Abstract:

Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e. g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.

US Patent:

7511523, Mar 31, 2009

Filed:

Apr 2, 2007

Appl. No.:

11/695577

Inventors:

Richard T. Chen - Burbank CA, US
Ezekiel J. J. Kruglick - San Diego CA, US
Christopher A. Bang - San Diego CA, US
Dennis R. Smalley - Newhall CA, US
Pavel B. Lembrikov - Santa Monica CA, US

Assignee:

Microfabrica Inc. - Van Nuys CA

International Classification:

G01R 31/02

US Classification:

324762, 324754, 324761

Abstract:

Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.