Mohan Rao Paruchuri from 7725 Haverhill Ln, Westland, MI 48187, age 65, Phone: 734 459-3087

Lead-Free Electrical Solder And Method Of Manufacturing
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US Patent:

6360939, Mar 26, 2002
Filed:

Oct 7, 1998
Appl. No.:

09/414207
Inventors:

Mohan R. Paruchuri - Canton MI
Dongkai Shangguan - Livonia MI
Assignee:

Visteon Global Technologies, Inc. - Dearborn MI
International Classification:

B23K 3102
US Classification:

2282485, 22818022
Abstract:

A method of manufacturing a lead-free electrical solder paste having primary solder powder and an additive metal powder component that does not melt during the soldering process. Metal powders may be either elemental metal or a metal alloy. The primary powder is the same as is used in conventional solder paste. The additive powder has a melting point substantially higher than the melting point of the primary powder. The primary powder comprises between 80-99% Sn and 1-20% Ag. The additive powder metal is selected from the metal group comprising Sn, Ni, Cu, Ag, and Bi and mixtures thereof.

Method For Strengthening Air Bridge Circuits
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US Patent:

6376780, Apr 23, 2002
Filed:

Jan 16, 2001
Appl. No.:

09/761140
Inventors:

Lakhi Nandlal Goenka - Ann Arbor MI
Mohan R. Paruchuri - Canton MI
Assignee:

Visteon Global Technologies, Inc. - Dearborn MI
International Classification:

H01R 1204
US Classification:

174261, 174255
Abstract:

A multilayer circuit board having strengthened air bridge crossover structures, and additive and subtractive methods for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit. A preferred embodiment includes air bridge structures having generally T-shaped cross-sections, which provide strengthened, mechanically robust air bridges which are especially resistant to damage from flexure and displacement due to physical impact, bending, thermal excursions, and the like.

Method For Making An Electronic Circuit Assembly
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US Patent:

6381837, May 7, 2002
Filed:

Sep 4, 1998
Appl. No.:

09/148061
Inventors:

Jay DeAvis Baker - W. Bloomfield MI
Edward McLeskey - Waterford MI
Delin Li - Canton MI
Cuong Van Pham - Belleville MI
Robert Edward Belke - West Bloomfield MI
Vivek Amir Jairazbhoy - Farmington Hills MI
Thomas B Krautheim - Belleville MI
Mohan R. Paruchuri - Canton MI
Lakhi Nandlal Goenka - Ann Arbor MI
Jun Ming Hu - Canton MI
Assignee:

Visteon Global Technologies, Inc. - Dearborn MI
International Classification:

H05K 334
US Classification:

29840, 29832, 29834, 29831, 29846, 174261
Abstract:

A method for producing an electronic circuit assembly (e. g. , a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.

Etched Tri-Metal With Integrated Wire Traces For Wire Bonding
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US Patent:

6395994, May 28, 2002
Filed:

Jan 31, 2000
Appl. No.:

09/495242
Inventors:

Lakhi Nandial Goenka - Ann Arbor MI
Mohan R. Paruchuri - Canton MI
Assignee:

Visteon Global Technologies, Inc. - Dearborn MI
International Classification:

H05K 103
US Classification:

174255
Abstract:

A circuit component secured to a printed circuit board typically uses fine wires for completing the circuit from the printed circuit to the component. The component may be an integrated circuit having one or more pads thereon for receiving the wire. A device and method for making the device has the printed circuit formed on the PCB with one or more wire traces that are etched away from the printed circuit. The etchant removes a portion of the bottom layer and sometimes the middle layer of an etched tri-metal along with any lamination and adhesive. This forms a free end of the wire trace that is bonded to the component. Additional wires are not required.

Cladded Material Construction For Etched-Tri-Metal Circuits
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US Patent:

6454878, Sep 24, 2002
Filed:

Nov 1, 2000
Appl. No.:

09/703553
Inventors:

Achyuta Achari - Canton MI
Brenda Joyce Nation - Troy MI
Jay D Baker - Dearborn MI
Lakhi Nandlal Goenka - Ann Arbor MI
Mohan R. Paruchuri - Canton MI
Vladimir Stoica - Farmington Hills MI
Assignee:

Visteon Global Technologies, Inc. - Dearborn MI
International Classification:

C23C 806
US Classification:

148284, 216 13, 216 20, 29830
Abstract:

A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer on the outside surface of the tri-metal material. Alternatively bonding materials may be used on the intermediate surfaces; such bonding materials can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.

Etched Tri-Layer Metal Bonding Layer
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US Patent:

6459041, Oct 1, 2002
Filed:

Nov 1, 2000
Appl. No.:

09/703815
Inventors:

Achyuta Achari - Canton MI
Lakhi Nandlal Goenka - Ann Arbor MI
Mohan R. Paruchuri - Canton MI
Assignee:

Visteon Global Technologies, Inc. - Dearborn MI
International Classification:

H01B 708
US Classification:

174117F, 174117 FF
Abstract:

A tri-metallic material for use in the manufacture of printed circuit boards is described, and the process for its manufacture is described. The tri-metallic material is a sandwich wherein a copper layer is essential the âbreadâ of the sandwich and an aluminum layer is the filling between both slices of bread. A metallic bonding and/or barrier layer is spread on the aluminum and is selected for its highly non-corrosive properties as well as its bonding, and diffusion inhibiting capabilities.

Method For Constructing Multilayer Circuit Boards Having Air Bridges
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US Patent:

6475703, Nov 5, 2002
Filed:

Dec 1, 1998
Appl. No.:

09/203148
Inventors:

Delin Li - Canton MI
Achyuta Achari - Canton MI
Alice Dawn Zitzmann - Belleville MI
Brenda Joyce Nation - Troy MI
Edward McLeskey - Waterford MI
Mohan R. Paruchuri - Canton MI
Lakhi Nandlal Goenka - Ann Arbor MI
Assignee:

Visteon Global Technologies, Inc. - Dearborn MI
International Classification:

G03C 556
US Classification:

430313, 430315, 430329, 216 15, 216 16, 216 20, 427404, 427405, 427471, 427532
Abstract:

A multilayer circuit board having air bridge crossover structures and an additive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit.

Electrical Circuit Board And A Method For Making The Same
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US Patent:

6495053, Dec 17, 2002
Filed:

Aug 30, 2000
Appl. No.:

09/651765
Inventors:

Lawrence Leroy Kneisel - Novi MI
Mohan R. Paruchuri - Canton MI
Vladimir Stoica - Farmington Hills MI
Assignee:

Visteon Global Tech, Inc. - Dearborn MI
International Classification:

H01B 124
US Classification:

216 13, 216 17, 216 19, 216 20, 216 34, 216 35, 216 36, 438720, 438742, 438754, 427 96, 427 97
Abstract:

A multi-layer electronic circuit board design having selectively formed apertures or cavities , and which includes grooves or troughs which are effective to selectively entrap liquefied adhesive material, thereby substantially preventing the adhesive material from entering the apertures.