Michael M Ghadaksaz

US Patent:

7986647, Jul 26, 2011

Filed:

Sep 29, 2007

Appl. No.:

11/906288

Inventors:

Michael M. Ghadaksaz - Inverness IL, US

Assignee:

iCover Wireless, Inc. - Schaumburg IL

International Classification:

H04B 3/36

US Classification:

370293, 370279, 455 7, 455 903

Abstract:

A portable wireless signal repeater module having embedded integrated patch antennas is installed on a window of a house or office or the interior surface of a vehicle's windshield. The module has two sets of embedded patch antennas, which, when mounted on a window, one set faces outdoors and another face indoors. Signals from nearby cellular service provider's transmitters are received by embedded patch antennas facing outdoors, filtered, amplified, and through a duplexer, passed on to the embedded patch antennas facing indoors for propagation within the indoor environment. Signals from handsets indoors are received by embedded patch antennas of the repeater module facing indoors, filtered, amplified, and through a duplexer, passed on to the embedded antennas facing outdoors for propagation toward nearby cellular service provider's receiver.

US Patent:

20110080188, Apr 7, 2011

Filed:

Aug 1, 2008

Appl. No.:

12/221451

Inventors:

Michael M. Ghadaksaz - Inverness IL, US

International Classification:

G01R 31/26

US Classification:

32476201

Abstract:

A universal test fixture for testing and characterization of high-power flange-packaged RF and microwave transistors and diodes includes a precision-machined heat sink having a built-in center cavity with a finger catch on either side of the cavity which uses a plurality of matching modules that are installed in the center cavity and designed as transistor or diode carrier modules to provide mounting for the high-power packaged RF and microwave devices in a wide variety of flange type packages, an adjustable clamping structure connected to a movable arm, and a plurality of non-conductive high temperature pressure clamps. Each carrier module is made of a gold-plated rectangular aluminum block having a center cavity that is machined to the package outline. A non-conductive black-anodized high-temperature resistant pressure clamp machined to the package outline holds the packaged device in the carrier module. When clamped down using the clamping structure, the pressure clamp holds the package leads on a printed circuit board ensuring excellent electrical contact between package leads and circuit traces and surrounding ground planes, obviating soldering and desoldering the leads to the circuit board. The pressure clamp also produces pressure along the device package to hold the packaged device to the carrier module which houses the device and which itself is bolted to the heat sink resulting in excellent thermal contact under the device.

US Patent:

20110102007, May 5, 2011

Filed:

Aug 1, 2008

Appl. No.:

12/221466

Inventors:

Michael M. Ghadaksaz - Inverness IL, US

International Classification:

G01R 35/00
G01R 1/067

US Classification:

32475502, 324601

Abstract:

A calibrated passive impedance probe has a wide bandwidth operating range for impedance and performance measurements of RF and microwave components, devices, and circuits in 50Ω and 75Ω environments. The probe is calibrated at the probe tip, thus allowing accurate impedance and performance measurements of in-circuit functions and on-board components. The calibrated probe can be used to eliminate RF connectors and provide input and output connections to a circuit board for prototype design and quick performance verification thus realizing cost savings on RF connectors. The probe includes a semi-rigid coaxial cable assembly filled with dielectric material, a silver plated center conductor, and silver plated ground outer conductor having an SMA male connector on one end and exposed center conductor at the opposite end and having uniform characteristic impedance of 50Ω or 75Ω along the cable length; a hexagonal shaped body made of anodized aluminum having raised texture on the surface for sure handling; a probe tip of gold plated aluminum with two spring loaded ground pins; a four-finger threaded cable catch for locking semi-rigid coaxial cable assembly inside the tip and for ground continuity from cable to spring loaded pins; an interface RF connector-adapter including SMA female-SMA female, BNC-SMA female, or Type N-SMA female; a locking nut to hold and lock cable assembly and connector-adapter inside the probe body; and 50Ω and 75Ω precision loads for probe calibration.