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Leonard L Wardzala

Deceased

from Chicago, IL

Also known as:
  • Leonard J Wardzala
  • Leonard L Zala
  • Leonard A
Phone and address:
7727 Jerome St, Chicago, IL 60631
773 631-5525

Leonard Wardzala Phones & Addresses

  • 7727 Jerome St, Chicago, IL 60631 • 773 631-5525
  • 7725 Jerome St, Chicago, IL 60631
  • Burlington, WI
  • Niles, IL
  • 7727 W Jerome St, Chicago, IL 60631 • 773 610-2464

Work

  • Position:
    Sales Occupations

Us Patents

  • Method For Fabricating Thick Film Alumina Structures Used In High Frequency, Low Loss Applications And A Structure Resulting Therefrom

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  • US Patent:
    20040251230, Dec 16, 2004
  • Filed:
    Jun 16, 2003
  • Appl. No.:
    10/462447
  • Inventors:
    Leonard Wardzala - Burlington WI, US
    Gregory Ballard - Belvidere IL, US
    Kurt Friel - Sycamore IL, US
  • International Classification:
    H01B013/00
  • US Classification:
    216/013000
  • Abstract:
    A method for fabricating thick film alumina structures used in high frequency, low loss applications is provided. More particularly, the invention is directed to a co-fire process for fabricating, or laminating, thick film structures to one another by printing a conductor layer between two thick film circuits, drying the layer, and co-firing the combined structure. This process is particularly useful in fabricating high frequency (e.g. 10 gigabit) fiber optic transmitters.
  • Method For Fabricating Thick Film Alumina Structures Used In High Frequency, Low Loss Applications And A Structure Resulting Therefrom

    view source
  • US Patent:
    20070237480, Oct 11, 2007
  • Filed:
    Feb 21, 2007
  • Appl. No.:
    11/709331
  • Inventors:
    Leonard Wardzala - Burlington WI, US
    Gregory Ballard - Belvidere IL, US
    Kurt Friel - Sycamore IL, US
  • International Classification:
    G02B 6/12
    C23C 26/00
  • US Classification:
    385129000, 427096100
  • Abstract:
    A method for fabricating thick film alumina structures used in high frequency, low loss applications is provided. More particularly, the invention is directed to a co-fire process for fabricating, or laminating, thick film structures to one another by printing a conductor layer between two thick film circuits, drying the layer, and co-firing the combined structure. This process is particularly useful in fabricating high frequency (e.g. 10 gigabit) fiber optic transmitters.
Name / Title
Company / Classification
Phones & Addresses
Leonard Wardzala
Executive Vice-President
Nano Micro Solutions, LLC
Thick Film Engineering Design and Manufacture · Business Services
590 E Gdn St, Dekalb, IL 60115
PO Box 4894, Wheaton, IL 60189
1812 Challenger Ct, Wheaton, IL 60189

Youtube

Highlights from the Green Ribbon Cutting

Thank you to everyone that joined us last week for the Green Ribbon Cu...

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    Entertainment
  • Uploaded:
    27 Apr, 2010
  • Duration:
    2m 2s

Mylife

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Len Wardzala

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Friends:
John Murphy, Roddye Davis, Dwayne Bednar

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