Leonard J Wardzala

US Patent:

8132457, Mar 13, 2012

Filed:

Aug 11, 2008

Appl. No.:

12/228225

Inventors:

Michael Haji-Sheikh - DeKalb IL, US
Anima Bose - DeKalb IL, US
Leonard Wardzala - DeKalb IL, US

Assignee:

Northern Illinois University - DeKalb IL

International Classification:

G01N 19/00

US Classification:

7333504

Abstract:

A nano-sensor including a substrate including pores formed thereon and a detecting mechanism for detecting changes in capacitance due to the presence of a substance. A method of measuring humidity by sampling air with the nano-sensor, detecting changes in capacitance, and determining the relative humidity of air. A method of detecting the presence of a substance by taking a sample with the nano-sensor, detecting changes in capacitance, and determining the presence of a substance. A method of making the nano-sensor by forming nano-pores on a substrate, and forming, on the surface of the substrate, a detecting mechanism for detecting changes in capacitance due to the presence of a substance.

US Patent:

20040251230, Dec 16, 2004

Filed:

Jun 16, 2003

Appl. No.:

10/462447

Inventors:

Leonard Wardzala - Burlington WI, US
Gregory Ballard - Belvidere IL, US
Kurt Friel - Sycamore IL, US

International Classification:

H01B013/00

US Classification:

216/013000

Abstract:

A method for fabricating thick film alumina structures used in high frequency, low loss applications is provided. More particularly, the invention is directed to a co-fire process for fabricating, or laminating, thick film structures to one another by printing a conductor layer between two thick film circuits, drying the layer, and co-firing the combined structure. This process is particularly useful in fabricating high frequency (e.g. 10 gigabit) fiber optic transmitters.

US Patent:

20070237480, Oct 11, 2007

Filed:

Feb 21, 2007

Appl. No.:

11/709331

Inventors:

Leonard Wardzala - Burlington WI, US
Gregory Ballard - Belvidere IL, US
Kurt Friel - Sycamore IL, US

International Classification:

G02B 6/12
C23C 26/00

US Classification:

385129000, 427096100

Abstract:

A method for fabricating thick film alumina structures used in high frequency, low loss applications is provided. More particularly, the invention is directed to a co-fire process for fabricating, or laminating, thick film structures to one another by printing a conductor layer between two thick film circuits, drying the layer, and co-firing the combined structure. This process is particularly useful in fabricating high frequency (e.g. 10 gigabit) fiber optic transmitters.