Jeffrey Wayne Sultemeier

US Patent:

20040014403, Jan 22, 2004

Filed:

Jul 16, 2002

Appl. No.:

10/196395

Inventors:

Brandon Oberkampf - Austin TX, US
Kimberly Kidwell - Austin TX, US
John Schaper - Austin TX, US
Jeffrey Sultemeier - Buda TX, US
Robert Stolle - Dale TX, US

International Classification:

B24B001/00
B24B007/30

US Classification:

451/060000

Abstract:

A system for detecting the usable state of a point of use filter of a chemical mechanical polishing (CMP) tool. The system measures the pressure differential across the point of use filter. In one example, the system includes an upstream and a down stream pressure transducer for measuring the pressure differential. The system can provide an indication that the usable state of filter has decreased to a point where the filter needs to be replaced. Such an indication may be displayed on a display located on the polishing tool frame.

US Patent:

54784360, Dec 26, 1995

Filed:

Dec 27, 1994

Appl. No.:

8/364142

Inventors:

Paul M. Winebarger - Austin TX
Mark A. Zaleski - Austin TX
Troy B. Morrison - Austin TX
Jeffrey J. Sultemeier - Buda TX

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2100

US Classification:

1566361

Abstract:

A selective cleaning process for fabricating a semiconductor device includes the steps of processing a semiconductor substrate (10) and introducing metal contaminants (22) by contacting the semiconductor substrate (10) with a polishing slurry during a polished planarization process. The metal contaminants (22) are removed by applying a cleaning solution including an organic solvent and a compound containing fluorine. The chemical constituents of the cleaning solution are substantially unreactive with metal interconnect material (12) underlying dielectric layers (18) present on the semiconductor substrate (10). The preferred cleaning solution comprises an aqueous solution of ethylene glycol and ammonium fluoride.