George L Carson

US Patent:

7334369, Feb 26, 2008

Filed:

Dec 7, 2005

Appl. No.:

11/296827

Inventors:

George J. Carson - Chicago IL, US

International Classification:

E04D 13/00

US Classification:

52 11

Abstract:

A rain gutter cleaning system of the invention comprises a generally planar panel, or two generally planar panels, movably secured to the bottom of the gutter. The rain gutter cleaning system includes a hinge securing one end of the generally planar panel to the gutter. One generally planar panel is normally disposed in a first position. In this first position, the generally planar panel is adjacent to, and generally parallel to, the gutter. The generally planar panel may be moved to a second position. In this second position, the generally planar panel is pivotally spaced apart from the gutter.

US Patent:

20130234847, Sep 12, 2013

Filed:

Feb 26, 2013

Appl. No.:

13/777419

Inventors:

George J. Carson - Chicago IL, US
Dion D. Xenos - Palos Hills IL, US

International Classification:

B60C 23/20

US Classification:

340449

Abstract:

A system and method for operating a tire temperature warning system with an optional cooling solution is disclosed.

US Patent:

58443193, Dec 1, 1998

Filed:

Mar 3, 1997

Appl. No.:

8/808773

Inventors:

Danniel Roman Gamota - Palatine IL
George Amos Carson - Elk Grove Village IL
Sean Xin Wu - Palatine IL
Brian J. Bullock - Elmhurst IL

Assignee:

Motorola Corporation - Schaumburg IL

International Classification:

H01L 2348
H01L 2352
H01L 2940

US Classification:

257778

Abstract:

A microelectronic assembly (10) includes an integrated circuit component (14) attached to a polymeric substrate (12) by a plurality of unencapsulated solder bump interconnections (16). A collar (18) is affixed to the polymeric substrate (12) about the integrated circuit component (14) and is formed of an inorganic material having a coefficient of thermal expansion less than that of the substrate (12). The collar (18) constrains thermal expansion of the polymeric substrate (12) in the die attach region (22), thereby lessening any deleterious effects caused by a mismatch in the thermal expansion of the polymeric substrate (12) and the integrated circuit component (14).

US Patent:

58959769, Apr 20, 1999

Filed:

Jun 3, 1996

Appl. No.:

8/657216

Inventors:

Michelle J. Morrell - Glen Ellyn IL
Steven C. Machuga - Deisenhofen, DE
Grace M. O'Malley - Hoffman Estates IL
George A. Carson - Elk Grove Village IL
Andrew Skipor - Glendale Heights IL
Wen Xu Zhou - Atlanta GA
Karl W. Wyatt - Cary IL

Assignee:

Motorola Corporation - Schaumburg IL

International Classification:

H01L 2348

US Classification:

257778

Abstract:

A microelectronic assembly (10) includes an integrated circuit die (12) mounted onto a substrate (14) by solder bump interconnections (32). The die (12) and the substrate (14) are spaced apart by a gap (30) that is filled with a polymeric encapsulant (16). The die (12) includes a die perimeter (24) and a face (27) facing away from the substrate (14). A polymeric reinforcement (18) is disposed onto the die face (27) to protect the die (12) and to reduce the effects of thermally induced stresses on the die (12) and the solder bump interconnections (32). The polymeric reinforcement (18) is spaced apart from the die perimeter (24) to maintain a desired peripheral fillet geometry of the encapsulant (16).

US Patent:

60494638, Apr 11, 2000

Filed:

Jul 25, 1997

Appl. No.:

8/900403

Inventors:

Grace M. O'Malley - Hoffman Estates IL
Lillian C. Thompson - Phoenix AZ
George Amos Carson - Elk Grove Village IL
Iwona Turlik - Barrington IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 702

US Classification:

361760

Abstract:

A microelectronic assembly (10) includes a polymeric card (12) that includes a substantially planar major surface (18). An integrated circuit component (14) is embedded in the polymeric card (12) and has a first contact (20) and a second contact (22). An antenna element (16) is formed of a singular metallic strip and includes a first terminal (26) electrically connected to the first contact (20), a second terminal (28) electrically connected to the second contact (22), and a loop (30) intermediate the first terminal (26) and the second terminal (28). The first terminal (26) includes a first outer surface (32) and the second terminal (28) includes a second outer surface (34). The first outer surface (32) and the second outer surface (34) are exposed at the major surface (18) and are coextensive therewith. The loop (30) is embedded within the polymeric card (12) and spaced apart from the major surface (18).

US Patent:

20150208847, Jul 30, 2015

Filed:

Jan 28, 2015

Appl. No.:

14/607337

Inventors:

George Carson - Chicago IL, US

International Classification:

A47J 27/05

Abstract:

A steam cooker with a first pot and a second pot is provided. The second pot may fit within the first pot and may be suspended above the bottom of the first pot. The bottom of the first pot may be filled with water. Food may be placed within the second pot. A lid may cover the first pot, sealing the water and the second pot within. The first pot may be heated by a fire or stove. The steam from the heated water may sufficiently cook the food. Further, condensation may be collected and water may drip into the second pot. The water is purified due to the boiling process.

Author:

George Barr Carson

ISBN #:

0836921003