Dennis Dean Epp

US Patent:

6662812, Dec 16, 2003

Filed:

Jul 21, 2000

Appl. No.:

09/621249

Inventors:

Allen David Hertz - Boca Raton FL 33428
Eric L. Hertz - Boca Raton FL 33428
Dennis D. Epp - Aliso Viejo CA 92656

International Classification:

B08B 310

US Classification:

134 13, 134 254, 34279

Abstract:

A method and apparatus are disclosed for improving drying of a module, tooling, and solder stencils via the introduction of acoustic pressure waves and/or vibrational energy to the module, tooling, or solder stencils. The acoustic pressure waves may be created by a transducer where the waves are transferred to the module through air or a vibrational interface medium. The acoustic pressure waves impinge on the water droplets to atomize the droplets on the surface of the module and in the cracks, crevices and hard to reach areas of connectors and other components, without undesirable heat. The acoustic energy may further be used to assist in cleaning solder stencils within an automated screen printer.

US Patent:

7293567, Nov 13, 2007

Filed:

Dec 16, 2003

Appl. No.:

10/737240

Inventors:

Allen David Hertz - Boca Raton FL, US
Eric Lee Hertz - Indian Harbour Beach FL, US
Dennis D. Epp - Aliso Viejo CA, US

International Classification:

B08B 3/10

US Classification:

134 13, 134 254, 228201

Abstract:

A method and apparatus are disclosed for improving a screen printing process by applying vibrational energy to assist in the print release, cleaning, and drying processes. The vibrational energy or acoustic pressure waves may be created by a transducer where the waves are transferred to the stencil or printable material through air or a vibrational interface medium. The vibrational energy in turn assists with separating the printable material from the side walls of the apertures of the stencil. The vibrational energy can further assist in the process of cleaning the stencil. The acoustic pressure can also be used in the drying process by having the waves impinge on the water droplets to atomize the droplets on the surface of the stencil. The technology can be used for the assembly of Printed Circuit Assemblies, Ball Grid Array IC Packages, Flip Chip, etc. The same technology may be applied to other cleaning processes for cleaning Printed Circuit Assemblies, tooling, and the like, whereby the cleaning processes can assist in cleaning within the cracks, crevices and hard to reach areas of connectors and other components, without undesirable heat.