Anna Tsimelzon

US Patent:

20090014846, Jan 15, 2009

Filed:

Jul 11, 2008

Appl. No.:

12/172110

Inventors:

Zachary M. Fresco - Santa Clara CA, US
Chi-I Lang - Sunnyvale CA, US
Jinhong Tong - Santa Clara CA, US
Anh Duong - Union City CA, US
Nitin Kumar - Menlo Park CA, US
Anna Tsimelzon - Mountain View CA, US
Tony Chiang - Campbell CA, US

International Classification:

H01L 21/312
H01L 29/51

US Classification:

257642, 438780, 257E21259, 257E29162

Abstract:

Methods of modifying a patterned semiconductor substrate are presented including: providing a patterned semiconductor substrate surface including a dielectric region and a conductive region; and applying an amphiphilic surface modifier to the dielectric region to modify the dielectric region. In some embodiments, modifying the dielectric region includes modifying a wetting angle of the dielectric region. In some embodiments, modifying the wetting angle includes making a surface of the dielectric region hydrophilic. In some embodiments, methods further include applying an aqueous solution to the patterned semiconductor substrate surface. In some embodiments, the conductive region is selectively enhanced by the aqueous solution. In some embodiments, methods further include providing the dielectric region formed of a low-k dielectric material. In some embodiments, applying the amphiphilic surface modifier modifies an interaction of the low-k dielectric region with a subsequent process.