Lin Chen Fu

from Hacienda Heights, CA

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Lin Fu Phones & Addresses

Name / Title

Company / Classification

Phones & Addresses

Lin Fu
President

Calton Trading Corp

17700 S Santa Fe Ave, Compton, CA 90221

Lin Ming Fu
President

ED MEDIA INC

10501 Vly Blvd STE 822, El Monte, CA 91731

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Location:

Greater Los Angeles Area

Industry:

Law Practice

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Polishing Pad Employing Polyamine And Cyclohexanedimethanol Curatives
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US Patent:

20210008687, Jan 14, 2021
Filed:

Jul 8, 2020
Appl. No.:

16/923688
Inventors:

- Aurora IL, US
Lin Fu - Rancho Palos Verdes CA, US
Chen-Chih Tsai - Naperville IL, US
Jaeseck Lee - Beaverton OR, US
Sarah Brosnan - St. Charles IL, US
International Classification:

B24B 37/24
Abstract:

A chemical-mechanical polishing pad comprising a thermosetting polyurethane polishing layer includes an isocyanate-terminated urethane prepolymer, a polyamine curative, and a cyclohexanedimethanol curative. The polyamine curative and the cyclohexanedimethanol curative are in a molar ratio of polyamine curative to cyclohexanedimethanol curative in a range from about 20:1 to about 1:1.

Chemical Mechanical Planarization Pads Via Vat-Based Production
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US Patent:

20200353586, Nov 12, 2020
Filed:

May 7, 2020
Appl. No.:

16/868965
Inventors:

- Aurora IL, US
Lin FU - Rancho Palos Verdes CA, US
William Michael SPITZIG - Lake Oswego OR, US
Chen-Chih TSAI - Naperville IL, US
Ping HUANG - Beaverton OR, US
Justin STEWART - Aurora IL, US
Carlos BARROS - West Chicago IL, US
International Classification:

B24B 37/24
B24B 37/26
B24B 37/22
Abstract:

A chemical mechanical polishing (CMP) pad includes a polishing portion formed using a vat-based additive manufacturing process. The polishing portion includes a polymer material with a first elastic modulus. In some embodiments the polishing portion is disposed on the backing portion. The backing portion may have a second elastic modulus. The second elastic modulus may be less than the first elastic modulus.