Joseph N Vu

Author:

Joseph Vu

ISBN #:

0321388682

Address:

780 Jeffrey Ave, Campbell, CA 95008

VIN:

WDDGF54X08F101099

Make:

MERCEDES-BENZ

Model:

C-CLASS

Year:

2008

US Patent:

6409878, Jun 25, 2002

Filed:

Oct 5, 2000

Appl. No.:

09/680558

Inventors:

Xia Li - Fremont CA
Joseph Vu - San Jose CA
Mohammad Massoodi - Los Altos CA
Jose Hulog - San Jose CA

Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA

International Classification:

C23F 102

US Classification:

15634523

Abstract:

An automatic decapsulation system for a device is disclosed. The system comprises an etch plate, an etch head, an acid resistant, high heat endurance and flexible sheet coupled to the etch plate, and a rubber gasket disposed between the sheet and the etch head. The sheet provides a precise etch window and a self-aligning gasket for the device. The rubber gasket creates a tight seal between the device, the sheet, and the etch head. A system in accordance with the present invention utilizes an acid resistant, high heat endurance and flexible sheet in combination with a rubber gasket to seal the device for decapsulation and to provide a well-defined etch window. In addition, the sheet being utilized as the gasket is also utilized as the fixture, thereby eliminating the need to align the gasket to the metal fixture utilized in the conventional system.

US Patent:

6395129, May 28, 2002

Filed:

Nov 27, 2000

Appl. No.:

09/722232

Inventors:

Joseph L. Vu - San Jose CA
Mehrdad Mahanpour - Union City CA

Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA

International Classification:

H01L 2100

US Classification:

15634511

Abstract:

A fixture assembly of a unique construction is provided for use with a decapsulating machine so as to prevent damage to a FBGA package during decapsulation. The fixture assembly includes a retaining gasket for holding and aligning the FBGA package in the decapsulating machine, a spacer element for protecting the solder balls of the FBGA package, and a cover for receiving the pressure from a spring-loaded arm of the decapsulating machine. As a result, the FBGA package is prevented from being over etched by the sulfuric acid during decapsulation. In addition, damage to the solder balls are prevented due to excess pressure from the spring-loaded arm.