Douglas L Hubbard

Author:

Douglas W. Hubbard

ISBN #:

0470110120

US Patent:

6362703, Mar 26, 2002

Filed:

Jan 13, 2000

Appl. No.:

09/482587

Inventors:

Timothy D. Keesey - Garden Grove CA
Clifton Quan - Arcadia CA
Douglas A. Hubbard - West Hills CA
David E. Roberts - San Pedro CA
Chris E. Schutzenberger - Seal Beach CA
Raymond C. Tugwell - Simi Valley CA
Gerald A. Cox - Playa Del Rey CA
Stephen R. Kerner - Culver City CA

Assignee:

Raytheon Company - Lexington MA

International Classification:

H01P 104

US Classification:

333 33, 333243, 333260

Abstract:

An RF interconnect between a rectangular coaxial transmission line including a coaxial center conductor and a dielectric structure with a rectilinear cross-sectional configuration fitted around the coaxial center conductor and an RF circuit separated from the airline circuit by a separation distance. The RF interconnect includes a compressible conductor structure having an uncompressed length exceeding the separation distance, and a dielectric sleeve structure surrounding at least a portion of the uncompressed length of the compressible conductor structure. The RF interconnect structure is disposed between the rectangular coaxial transmission line and the RF circuit such that the compressible conductor is placed under compression between the substrate and the RF circuit. Examples of the RF circuit include a vertical coaxial transmission line or a grounded coplanar waveguide circuit disposed in parallel with the center conductor of the rectangular coaxial transmission line.

US Patent:

6366185, Apr 2, 2002

Filed:

Jan 12, 2000

Appl. No.:

09/482188

Inventors:

Timothy D. Keesey - Huntington Beach CA
Clifton Quan - Arcadia CA
Douglas A. Hubbard - West Hills CA
David E. Roberts - San Pedro CA
Chris E. Schutzenberger - Long Beach CA
Raymond C. Tugwell - Simi Valley CA
Gerald A. Cox - Playa Del Rey CA

Assignee:

Raytheon Company - Lexington MA

International Classification:

H01P 308

US Classification:

333260, 333246

Abstract:

An RF interconnect between an airline circuit including a dielectric substrate having a conductor trace formed on a first substrate surface and an RF circuit separated from the airline circuit by a separation distance. The RF interconnect includes a compressible conductor structure having an uncompressed length exceeding the separation distance, and a dielectric sleeve structure surrounding at least a portion of the uncompressed length of the compressible conductor structure. The RF interconnect structure is disposed between the substrate and the RF circuit such that the compressible conductor is placed under compression between the substrate and the RF circuit. Examples of the RF circuit include a vertical coaxial transmission line or a grounded coplanar waveguide circuit disposed in parallel with the airline circuit.