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Zukhra I Niazimbetova

age ~60

from Westborough, MA

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Also known as:
  • Zukhra I Niyazymbetova
  • Niazimbetova Zukhra
  • A A
Phone and address:
1 Hillcrest Dr, Westboro, MA 01581
Related to:
Connected to:

Zukhra Niazimbetova Phones & Addresses

  • 1 Hillcrest Dr, Westborough, MA 01581
  • 1 Hillcrest Dr APT B, Westborough, MA 01581
  • Moravia, NY
  • Wilmington, DE
  • 923 White Clay Ter, Bear, DE 19701

Us Patents

  • Metal Plating Compositions

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  • US Patent:
    8048284, Nov 1, 2011
  • Filed:
    Apr 2, 2008
  • Appl. No.:
    12/080484
  • Inventors:
    Erik Reddington - Ashland MA, US
    Gonzalo Urrutia Desmaison - Berlin, DE
    Zukhra I. Niazimbetova - Westborough MA, US
    Donald E. Cleary - Littleton MA, US
    Mark Lefebvre - Hudson NH, US
  • Assignee:
    Rohm and Haas Electronic Materials LLC - Marlborough MA
  • International Classification:
    C25D 3/56
    C25D 3/58
    C25D 3/62
    C25D 3/60
    C25D 3/00
    C25D 3/46
    C25D 3/50
    C25D 3/48
    C23C 16/40
    C23C 18/40
    C23C 18/36
    C23C 18/44
  • US Classification:
    205238, 205239, 205241, 205242, 205247, 205252, 205253, 205255, 205257, 205259, 205261, 205263, 205264, 205265, 205266, 205267, 205271, 205276, 205280, 205291, 205296, 205300, 205302, 205303, 106 125, 106 126, 106 127, 106 128
  • Abstract:
    Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.

  • Plating Bath And Method

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  • US Patent:
    8262895, Sep 11, 2012
  • Filed:
    Mar 15, 2010
  • Appl. No.:
    12/661311
  • Inventors:
    Zukhra I. Niazimbetova - Westboro MA, US
    Maria Anna Rzeznik - Shrewsbury MA, US
  • Assignee:
    Rohm and Haas Electronic Materials LLC - Marlborough MA
  • International Classification:
    C08F 2/10
    C08G 59/14
    C23C 18/38
    C25D 3/38
  • US Classification:
    205297, 106 126, 25218311, 427487, 528117
  • Abstract:
    Copper plating baths containing a leveling agent that is a reaction product of a certain benzimidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.

  • Plating Bath And Method

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  • US Patent:
    8268157, Sep 18, 2012
  • Filed:
    Mar 15, 2010
  • Appl. No.:
    12/661312
  • Inventors:
    Zukhra I. Niazimbetova - Westboro MA, US
  • Assignee:
    Rohm and Haas Electronic Materials LLC - Marlborough MA
  • International Classification:
    C08F 2/10
    C08G 59/14
    C23C 18/38
    C25D 3/38
  • US Classification:
    205297, 106 126, 25218311, 427497, 528117, 528118, 528119
  • Abstract:
    Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.

  • Plating Bath And Method

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  • US Patent:
    8268158, Sep 18, 2012
  • Filed:
    Aug 11, 2011
  • Appl. No.:
    13/207658
  • Inventors:
    Zukhra I. Niazimbetova - Westboro MA, US
    Elie H. Najjar - Norwood MA, US
    Maria Anna Rzeznik - Shrewsbury MA, US
    Erik Reddington - Ashland MA, US
  • Assignee:
    Rohm and Haas Electronic Materials LLC - Marlborough MA
  • International Classification:
    C08G 59/14
    C09K 3/00
    C23C 18/38
    C25D 3/38
  • US Classification:
    205297, 106 126, 25218311, 528117
  • Abstract:
    Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.

  • Metal Plating Compositions And Methods

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  • US Patent:
    20080268138, Oct 30, 2008
  • Filed:
    Apr 2, 2008
  • Appl. No.:
    12/080522
  • Inventors:
    Erik Reddington - Ashland MA, US
    Gonzalo Urrutia Desmaison - Berlin, DE
    Zukhra I. Niazimbetova - Westborough MA, US
    Donald E. Cleary - Littleton MA, US
    Mark Lefebvre - Hudson NH, US
  • Assignee:
    Rohm and Haas Electronic Materials LLC - Marlborough MA
  • International Classification:
    C09D 5/24
    B05D 5/12
    C07C 233/00
  • US Classification:
    427 961, 106 105, 106 119, 106 118, 106 121, 564197
  • Abstract:
    Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

  • Plating Bath And Method

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  • US Patent:
    20110220512, Sep 15, 2011
  • Filed:
    Mar 15, 2010
  • Appl. No.:
    12/661301
  • Inventors:
    Zukhra I. Niazimbetova - Westboro MA, US
    Elie H. Najjar - Norwood MA, US
    Maria Anna Rzeznik - Shrewsbury MA, US
    Erik Reddington - Ashland MA, US
  • Assignee:
    Rohm and Haas Electronic Materials LLC - Marlborough MA
  • International Classification:
    C25D 3/38
    C07D 233/58
    C07D 233/64
  • US Classification:
    205297, 5483351, 5483435, 5483411
  • Abstract:
    Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.

  • Metal Plating Compositions And Methods

    view source
  • US Patent:
    20110318479, Dec 29, 2011
  • Filed:
    Sep 6, 2011
  • Appl. No.:
    13/226290
  • Inventors:
    Erik REDDINGTON - Ashland MA, US
    Gonzalo Urrutia DESMAISON - Berlin, DE
    Zukhra I. NIAZIMBETOVA - Westborough MA, US
    Donald E. CLEARY - Littleton MA, US
    Mark LEFEBVRE - Hudson MA, US
  • Assignee:
    Rohm and Haas Electronic Materials LLC - Marlborough MA
  • International Classification:
    H05K 3/00
    B05D 1/36
    B05D 5/12
    C07C 233/16
    C08G 12/06
  • US Classification:
    427 961, 564160, 528229, 427123, 427404
  • Abstract:
    Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

  • Metal Plating Compositions

    view source
  • US Patent:
    20120034371, Feb 9, 2012
  • Filed:
    Aug 15, 2011
  • Appl. No.:
    13/209592
  • Inventors:
    Erik Reddington - Ashland MA, US
    Gonzalo Urrutia Desmaison - Berlin, DE
    Zukhra I. Niazimbetova - Westborough MA, US
    Donald E. Cleary - Littleton MA, US
    Mark Lefebvre - Hudson NH, US
  • Assignee:
    Rohm and Haas Electronic Materials LLC - Marlborough MA
  • International Classification:
    H05K 3/00
    B05D 5/12
    B05D 1/36
  • US Classification:
    427 961, 427404, 427123
  • Abstract:
    Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
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