Zhijun J Zuo

US Patent:

8002021, Aug 23, 2011

Filed:

Feb 4, 2008

Appl. No.:

12/012577

Inventors:

Zhijun Zuo - Lancaster PA, US
Scott Garner - Lititz PA, US

Assignee:

Advanced Cooling Technologies, Inc. - Lancaster PA

International Classification:

F28F 7/02

US Classification:

165 804, 16510414, 16510421

Abstract:

The invention is a heat exchanger transferring heat from a small heat source to a moving fluid. The inherent limitation of such a system is that most of the heat transfer to the fluid occurs only in the immediate vicinity of the heat input even though a large surface area heat transfer structure such as fins or small fluid passages is used to enhance the heat transfer within the heat exchanger. The invention adds a heat pipe inside the heat exchanger enclosure and in contact with the heat transfer structure. The heat pipe spreads the incoming heat over a larger part of the surface area of the heat transfer structure and improves the heat transfer to the cooling fluid by furnishing multiple heat transfer locations without adding extra thermal resistance between the heat source and the fluid flow.

US Patent:

20030057546, Mar 27, 2003

Filed:

Sep 26, 2001

Appl. No.:

09/963899

Inventors:

Stephen Memory - Kenosha WI, US
Fredrick Ganaway - Racine WI, US
C. Rogers - Racine WI, US
Anthony DeVuono - Racine WI, US
Alfred Phillips - Pine Grove PA, US
Zhijun Zuo - Lancaster PA, US

International Classification:

H01L023/10
H01L023/34

US Classification:

257/706000

Abstract:

A modular cooling system () is provided for use in an electronics enclosure () mounting a plurality of heat generating electronic components (). The cooling system () includes a cooling liquid supply manifold (), a cooling liquid return manifold (), and a plurality of cooling modules () that are selectively mountable into the electronic enclosure (). The cooling system () also includes a wall () fixed in the enclosure to separate the electronic components () from the manifolds () to shield the electronic components () from any of the cooling liquid () should it leak from the system ().