Zhihui Wang

US Patent:

20230006362, Jan 5, 2023

Filed:

Sep 13, 2022

Appl. No.:

17/943300

Inventors:

- Irvine CA, US
Zhihui Wang - Tustin CA, US
Franco De Flaviis - Irvine CA, US
Alfred Grau Besoli - Irvine CA, US
Kartik Sridharan - San Diego CA, US
Ahmadreza Rofougaran - Newport Beach CA, US
Michael Boers - South Turramurra, AU
Sam Gharavi - Irvine CA, US
Donghyup Shin - Irvine CA, US
Farid Shirinfar - Granada Hills CA, US
Stephen Wu - Fountain Valley CA, US
Maryam Rofougaran - Rancho Palos Verdes CA, US

International Classification:

H01Q 21/06
H01Q 21/00
H01Q 9/04
H01Q 1/22

Abstract:

An antenna module that includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate, a plurality of packaged circuitry on a second surface of the antenna substrate, and a plurality of supporting balls mounted on the second surface of the antenna substrate. The plurality of packaged circuitry includes a plurality of radio-frequency (RF) chips on the second surface of the antenna substrate. Each of the plurality of 3-D antenna cells comprises a raised antenna patch with a plurality of projections and a plurality of supporting legs, where at least a relief cut is provided between one of the plurality of projections and one of the plurality of supporting legs.

US Patent:

20210028555, Jan 28, 2021

Filed:

Oct 1, 2020

Appl. No.:

17/060182

Inventors:

- Irvine CA, US
Zhihui Wang - Tustin CA, US
Franco De Flaviis - Irvine CA, US
Alfred Grau Besoli - Irvine CA, US
Kartik Sridharan - San Diego CA, US
Ahmadreza Rofougaran - Newport Beach CA, US
Michael Boers - South Turramurra, AU
Sam Gharavi - Irvine CA, US
Donghyup Shin - Irvine CA, US
Farid Shirinfar - Granada Hills CA, US
Stephen Wu - Fountain Valley CA, US
Maryam Rofougaran - Rancho Palos Verdes CA, US

International Classification:

H01Q 21/06
H01Q 21/00
H01Q 1/22
H01Q 9/04

Abstract:

An apparatus comprising at least a plurality of antenna modules mounted on a printed circuit board (PCB) is disclosed. The PCB includes a plurality of holes embedded with a heat sink. Each antenna module comprises an antenna substrate. Each antenna module further comprises a plurality of three-dimensional (3-D) antenna cells that are mounted on a first surface of the antenna substrate. Each antenna module further comprises a plurality of packaged circuitry that are mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Furthermore, each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.

US Patent:

20180351262, Dec 6, 2018

Filed:

May 30, 2017

Appl. No.:

15/607750

Inventors:

- Newport Beach CA, US
Zhihui Wang - Tustin CA, US
Franco De Flaviis - Irvine CA, US
Alfred Grau Besoli - Irvine CA, US
Kartik Sridharan - San Diego CA, US
Ahmadreza Rofougaran - Newport Beach CA, US
Michael Boers - South Turramurra, AU
Sam Gharavi - Irvine CA, US
Donghyup Shin - Irvine CA, US
Farid Shirinfar - Granada Hills CA, US
Stephen Wu - Fountain Valley CA, US
Maryam Rofougaran - Rancho Palos Verdes CA, US

International Classification:

H01Q 21/06
H01Q 1/38
H01Q 21/00

Abstract:

An apparatus comprising at least a plurality of antenna modules mounted on a printed circuit board (PCB) is disclosed. The PCB includes a plurality of holes embedded with a heat sink. Each antenna module comprises an antenna substrate. Each antenna module further comprises a plurality of three-dimensional (3-D) antenna cells that are mounted on a first surface of the antenna substrate. Each antenna module further comprises a plurality of packaged circuitry that are mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Furthermore, each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.