Zhihui Wang

US Patent:

20080224307, Sep 18, 2008

Filed:

Mar 14, 2007

Appl. No.:

11/724135

Inventors:

Tarek Kaylani - Irvine CA, US
Zhihui Wang - Irvine CA, US
Kenneth Kindsfater - Laguna Niguel CA, US
Balasubramanian Annamalai - Bangalore, IN
Jeff Echtenkamp - Laguna Niguel CA, US

International Classification:

H01L 23/48

US Classification:

257737

Abstract:

According to one exemplary embodiment, a semiconductor die with on-die preferred interface selection includes at least two groups of pads situated on an active surface of the semiconductor die, where each of the at least two groups of pads is coupled to its associated interface in the die. A set of bumps is mask-programmably routed to one of the at least two groups of pads, thereby selecting the preferred interface for the semiconductor die. A non-preferred interface is not routed to any bumps on the active surface of the semiconductor die, thereby reducing bump count on the die. Each of the at least two groups of pads can be situated in a corresponding pad ring on the active surface of said semiconductor die. The at least two groups of pads can be laid out substantially inline.

US Patent:

20110254158, Oct 20, 2011

Filed:

Jun 30, 2011

Appl. No.:

13/174260

Inventors:

Tarek Kaylani - Irvine CA, US
Zhihui Wang - Irvine CA, US
Kenneth Kindsfater - Laguna Niguel CA, US
Balasubramanian Annamalai - Bangalore, IN
Jeff Echtenkamp - Laguna Niguel CA, US

International Classification:

H01L 23/48

US Classification:

257737, 257E2301

Abstract:

According to one exemplary embodiment, a semiconductor die with on-die preferred interface selection includes at least two groups of pads situated on an active surface of the semiconductor die, where each of the at least two groups of pads is coupled to its associated interface in the die. A set of bumps is mask-programmably routed to one of the at least two groups of pads, thereby selecting the preferred interface for the semiconductor die. A non-preferred interface is not routed to any bumps on the active surface of the semiconductor die, thereby reducing bump count on the die. Each of the at least two groups of pads can be situated in a corresponding pad ring on the active surface of said semiconductor die. The at least two groups of pads can be laid out substantially inline.

US Patent:

20230051891, Feb 16, 2023

Filed:

Nov 1, 2022

Appl. No.:

17/978565

Inventors:

- Irvine CA, US
Ahmadreza ROFOUGARAN - Newport Beach CA, US
Sam GHARAVI - Irvine CA, US
Kartik SRIDHARAN - San Diego CA, US
Donghyup SHIN - Irvine CA, US
Farid SHIRINFAR - Granada Hills CA, US
Stephen WU - Fountain Valley CA, US
Maryam ROFOUGARAN - Rancho Palos Verdes CA, US
Alfred Grau Besoli - Irvine CA, US
Enver Adas - Newport Beach CA, US
Zhihui WANG - Tustin CA, US

International Classification:

H01Q 21/22
H01Q 3/34
H01Q 1/52
H01Q 13/20
H01Q 1/02
H01Q 21/00

Abstract:

An antenna system that includes a plurality of chips and a beam forming phased array. The beam forming phased array includes a plurality of radiating waveguide antenna cells. Each radiating waveguide antenna cell includes a plurality of pins that are connected to ground. A body of each radiating waveguide antenna cell corresponds to the ground. The plurality of chips are electrically connected with the plurality of pins and the ground of each of the plurality of radiating waveguide antenna cells to control beamforming through a second end of the plurality of radiating waveguide antenna cells.

US Patent:

20230006362, Jan 5, 2023

Filed:

Sep 13, 2022

Appl. No.:

17/943300

Inventors:

- Irvine CA, US
Zhihui Wang - Tustin CA, US
Franco De Flaviis - Irvine CA, US
Alfred Grau Besoli - Irvine CA, US
Kartik Sridharan - San Diego CA, US
Ahmadreza Rofougaran - Newport Beach CA, US
Michael Boers - South Turramurra, AU
Sam Gharavi - Irvine CA, US
Donghyup Shin - Irvine CA, US
Farid Shirinfar - Granada Hills CA, US
Stephen Wu - Fountain Valley CA, US
Maryam Rofougaran - Rancho Palos Verdes CA, US

International Classification:

H01Q 21/06
H01Q 21/00
H01Q 9/04
H01Q 1/22

Abstract:

An antenna module that includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate, a plurality of packaged circuitry on a second surface of the antenna substrate, and a plurality of supporting balls mounted on the second surface of the antenna substrate. The plurality of packaged circuitry includes a plurality of radio-frequency (RF) chips on the second surface of the antenna substrate. Each of the plurality of 3-D antenna cells comprises a raised antenna patch with a plurality of projections and a plurality of supporting legs, where at least a relief cut is provided between one of the plurality of projections and one of the plurality of supporting legs.

US Patent:

20210328363, Oct 21, 2021

Filed:

Jul 1, 2021

Appl. No.:

17/365037

Inventors:

- Irvine CA, US
Ahmadreza ROFOUGARAN - Newport Beach CA, US
Sam GHARAVI - Irvine CA, US
Kartik SRIDHARAN - San Diego CA, US
Donghyup SHIN - Irvine CA, US
Farid SHIRINFAR - Granada Hills CA, US
Stephen WU - Fountain Valley CA, US
Maryam ROFOUGARAN - Rancho Palos Verdes CA, US
Alfred Grau Besoli - Irvine CA, US
Enver Adas - Newport Beach CA, US
Zhihui WANG - Tustin CA, US

International Classification:

H01Q 21/22
H01Q 3/34
H01Q 1/52
H01Q 13/20
H01Q 1/02
H01Q 21/00

Abstract:

An antenna system, includes a first substrate, a plurality of chips, and a waveguide antenna element based beam forming phased array. The waveguide antenna element based beam forming phased array includes a plurality of radiating waveguide antenna cells. Each radiating waveguide antenna cell includes a plurality of pins that are connected to ground. A body of each radiating waveguide antenna cell corresponds to the ground. The plurality of chips are electrically connected with the plurality of pins and the ground of each of the plurality of radiating waveguide antenna cells to control beamforming through a second end of the plurality of radiating waveguide antenna cells.

US Patent:

20210028555, Jan 28, 2021

Filed:

Oct 1, 2020

Appl. No.:

17/060182

Inventors:

- Irvine CA, US
Zhihui Wang - Tustin CA, US
Franco De Flaviis - Irvine CA, US
Alfred Grau Besoli - Irvine CA, US
Kartik Sridharan - San Diego CA, US
Ahmadreza Rofougaran - Newport Beach CA, US
Michael Boers - South Turramurra, AU
Sam Gharavi - Irvine CA, US
Donghyup Shin - Irvine CA, US
Farid Shirinfar - Granada Hills CA, US
Stephen Wu - Fountain Valley CA, US
Maryam Rofougaran - Rancho Palos Verdes CA, US

International Classification:

H01Q 21/06
H01Q 21/00
H01Q 1/22
H01Q 9/04

Abstract:

An apparatus comprising at least a plurality of antenna modules mounted on a printed circuit board (PCB) is disclosed. The PCB includes a plurality of holes embedded with a heat sink. Each antenna module comprises an antenna substrate. Each antenna module further comprises a plurality of three-dimensional (3-D) antenna cells that are mounted on a first surface of the antenna substrate. Each antenna module further comprises a plurality of packaged circuitry that are mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Furthermore, each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.

US Patent:

20190267721, Aug 29, 2019

Filed:

Feb 26, 2018

Appl. No.:

15/904521

Inventors:

- NEWPORT BEACH CA, US
Ahmadreza ROFOUGARAN - Newport Beach CA, US
Sam GHARAVI - Irvine CA, US
Kartik SRIDHARAN - San Diego CA, US
Donghyup SHIN - Irvine CA, US
Farid SHIRINFAR - Granada Hills CA, US
Stephen WU - Fountain Valley CA, US
Maryam ROFOUGARAN - Rancho Palos Verdes CA, US
Alfred Grau Besoli - Irvine CA, US
Enver Adas - NEWPORT BEACH, US
Zhihui WANG - Tustin CA, US

International Classification:

H01Q 21/22
H01Q 3/34
H01Q 21/00
H01Q 13/20
H01Q 1/02
H01Q 1/52

Abstract:

An antenna system, includes a first substrate, a plurality of chips, and a waveguide antenna element based beam forming phased array. The waveguide antenna element based beam forming phased array has a unitary body that comprises a plurality of radiating waveguide antenna cells in a first layout for millimeter wave communication. Each radiating waveguide antenna cell comprises a plurality of pins that are connected with a body of a corresponding radiating waveguide antenna cell that acts as ground for the plurality of pins. A first end of the plurality of radiating waveguide antenna cells of the waveguide antenna element based beam forming phased array, as the unitary body, in the first layout is mounted on the first substrate. The plurality of chips are electrically connected with the plurality of pins and the ground of each of the plurality of radiating waveguide antenna cells to control beamforming.

US Patent:

20190267722, Aug 29, 2019

Filed:

Apr 23, 2019

Appl. No.:

16/391628

Inventors:

- Newport Beach CA, US
Ahmadreza ROFOUGARAN - Newport Beach CA, US
Sam GHARAVI - Irvine CA, US
Kartik SRIDHARAN - San Diego CA, US
Donghyup SHIN - Irvine CA, US
Farid SHIRINFAR - Granada Hills CA, US
Stephen WU - Fountain Valley CA, US
Maryam ROFOUGARAN - Rancho Palos Verdes CA, US
Alfred Grau Besoli - Irvine CA, US
Enver Adas - Newport Beach CA, US
Zhihui WANG - Tustin CA, US

International Classification:

H01Q 21/22
H01Q 21/00
H01Q 1/02
H01Q 3/34
H01Q 1/52
H01Q 13/20

Abstract:

An antenna system, includes a first substrate, a plurality of chips, and a waveguide antenna element based beam forming phased array. The waveguide antenna element based beam forming phased array has a unitary body that comprises a plurality of radiating waveguide antenna cells in a first layout for millimeter wave communication. Each radiating waveguide antenna cell comprises a plurality of pins that are connected with a body of a corresponding radiating waveguide antenna cell that acts as ground for the plurality of pins. A first end of the plurality of radiating waveguide antenna cells of the waveguide antenna element based beam forming phased array, as the unitary body, in the first layout is mounted on the first substrate. The plurality of chips are electrically connected with the plurality of pins and the ground of each of the plurality of radiating waveguide antenna cells to control beamforming.