Zhian N He

US Patent:

8128791, Mar 6, 2012

Filed:

Oct 30, 2006

Appl. No.:

11/590413

Inventors:

Bryan Buckalew - Tualatin OR, US
Jonathan Reid - Sherwood OR, US
John Sukamto - Lake Oswego OR, US
Zhian He - Tigard OR, US
Seshasayee Varadarajan - Lake Oswego OR, US
Steven T. Mayer - Lake Oswego OR, US

Assignee:

Novellus Systems, Inc. - San Jose CA

International Classification:

C25D 21/14
C25D 3/38

US Classification:

204237, 204626, 205101, 205125, 205182

Abstract:

In a copper electroplating apparatus having separate anolyte and catholyte portions, the concentration of anolyte components (e. g. , acid or copper salt) is controlled by providing a diluent to the recirculating anolyte. The dosing of the diluent can be controlled by the user and can follow a pre-determined schedule. For example, the schedule may specify the diluent dosing parameters, so as to prevent precipitation of copper salt in the anolyte. Thus, precipitation-induced anode passivation can be minimized.

US Patent:

8172992, May 8, 2012

Filed:

Dec 8, 2009

Appl. No.:

12/633219

Inventors:

Vinay Prabhakar - Fremont CA, US
Bryan L. Buckalew - Tualatin OR, US
Kousik Ganesan - Tualatin OR, US
Shantinath Ghongadi - Wilsonville OR, US
Zhian He - Beaverton OR, US
Steven T. Mayer - Lake Oswego OR, US
Robert Rash - Portland OR, US
Jonathan D. Reid - Sherwood OR, US
Yuichi Takada - Tualatin OR, US
James R. Zibrida - Portland OR, US

Assignee:

Novellus Systems, Inc. - San Jose CA

International Classification:

C25B 9/02

US Classification:

20429709, 2042971, 20429714, 20429708

Abstract:

Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses. Contamination may happen during removal of semiconductor wafers from apparatuses after the electroplating process. In certain embodiments, a base plate with a hydrophobic coating, such as polyamide-imide (PAI) and sometimes polytetrafluoroethylene (PTFE), are used. Further, contact tips of the contact ring assembly may be positioned further away from the sealing lip of the lipseal. In certain embodiments, a portion of the contact ring assembly and/or the lipseal also include hydrophobic coatings.

US Patent:

8262871, Sep 11, 2012

Filed:

Dec 17, 2009

Appl. No.:

12/640992

Inventors:

Steven T. Mayer - Lake Oswego OR, US
Shantinath Ghongadi - Wilsonville OR, US
Kousik Ganesan - Tualatin OR, US
Zhian He - Tigard OR, US
Jingbin Feng - Lake Oswego OR, US

Assignee:

Novellus Systems, Inc. - San Jose CA

International Classification:

C25B 9/00
C25D 17/00

US Classification:

204263, 204242, 205 80

Abstract:

An apparatus for electroplating a layer of metal onto a work piece surface includes a membrane separating the chamber of the apparatus into a catholyte chamber and an anolyte chamber. In the catholyte chamber is a catholyte manifold region that includes a catholyte manifold and at least one flow distribution tube. The catholyte manifold and at least one flow distribution tube serve to mix and direct catholyte flow in the catholyte chamber. The provided configuration effectively reduces failure and improves the operational ranges of the apparatus.

US Patent:

8308931, Nov 13, 2012

Filed:

Nov 7, 2008

Appl. No.:

12/291356

Inventors:

Jonathan Reid - Sherwood OR, US
Bryan Buckalew - Tualatin OR, US
Zhian He - Beaverton OR, US
Seyang Park - Beaverton OR, US
Seshasayee Varadarajan - Lake Oswego OR, US
Bryan Pennington - Tualatin OR, US
Thomas Ponnuswamy - Sherwood OR, US
Patrick Breling - Portland OR, US
Glenn Ibarreta - Ridgefield WA, US
Steven Mayer - Lake Oswego OR, US

Assignee:

Novellus Systems, Inc. - San Jose CA

International Classification:

C25D 21/12
C25D 7/12
C25D 3/38

US Classification:

205 96, 205 97, 2042307

Abstract:

An apparatus for electroplating a layer of metal on the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer (preferably within 5 mm of the wafer surface) which serves to modulate ionic current at the wafer surface, and a second cathode configured to divert a portion of current from the wafer surface. The ionically resistive ionically permeable element in a preferred embodiment is a disk made of a resistive material having a plurality of perforations formed therein, such that perforations do not form communicating channels within the body of the disk. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.

US Patent:

8377268, Feb 19, 2013

Filed:

Jun 6, 2011

Appl. No.:

13/154224

Inventors:

Robert Rash - Portland OR, US
Shantinath Ghongadi - Wilsonville OR, US
Kousik Ganesan - Hillsboro OR, US
Zhian He - Beaverton OR, US
Tariq Majid - Wilsonville OR, US
Jeff Hawkins - Portland OR, US
Seshasayee Varadarajan - Lake Oswego OR, US
Bryan Buckalew - Tualatin OR, US

Assignee:

Novellus Systems, Inc. - San Jose CA

International Classification:

C25D 17/06
C25D 7/12

US Classification:

20429701

Abstract:

Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.

US Patent:

8475636, Jul 2, 2013

Filed:

Jun 9, 2009

Appl. No.:

12/481503

Inventors:

Steven Mayer - Lake Oswego OR, US
Jingbin Feng - Lake Oswego OR, US
Zhian He - Tigard OR, US
Jonathan Reid - Sherwood OR, US
Seshasayee Varadarajan - Lake Oswego OR, US

Assignee:

Novellus Systems, Inc. - Fremont CA

International Classification:

C25D 17/12
C25D 21/12

US Classification:

2042289, 2042294, 2042307, 204DIG 7, 205 96

Abstract:

An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.

US Patent:

8475637, Jul 2, 2013

Filed:

Dec 17, 2008

Appl. No.:

12/337147

Inventors:

Jingbin Feng - Lake Oswego OR, US
Zhian He - Tigard OR, US
Robert Rash - Portland OR, US
Steven T. Mayer - Lake Oswego OR, US

Assignee:

Novellus Systems, Inc. - San Jose CA

International Classification:

C25D 17/00
C25D 21/04

US Classification:

2042785, 205291

Abstract:

Embodiments related to increasing a uniformity of an electroplated film are disclosed. For example, one disclosed embodiment provides an electroplating apparatus comprising a plating chamber, a work piece holder, a cathode contact configured to electrically contact a work piece, and an anode contact configured to electrically contact an anode disposed in the plating chamber. A diffusing barrier is disposed between the cathode contact and the anode contact to provide a uniform electrolyte flow to the work piece, and electrolyte delivery and return paths are provided for delivering electrolyte to and away from the plating chamber. Additionally, a vented electrolyte manifold is disposed in the electrolyte delivery path immediately upstream of the plating chamber, the vented electrolyte manifold comprising one or more electrolyte delivery openings that open to the plating chamber and one or more vents that open to a location other than the plating chamber.

US Patent:

8475644, Jul 2, 2013

Filed:

Oct 26, 2009

Appl. No.:

12/606030

Inventors:

Steven Mayer - Lake Oswego OR, US
Jingbin Feng - Lake Oswego OR, US
Zhian He - Tigard OR, US
Jonathan Reid - Sherwood OR, US
Seshasayee Varadarajan - Lake Oswego OR, US

Assignee:

Novellus Systems, Inc. - Fremont CA

International Classification:

C25D 21/12
C25D 7/12
C25D 3/38

US Classification:

205 96, 2042289, 2042294, 2042307, 204DIG 7, 205123

Abstract:

An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.