Yu W Chang

Author:

Yu Sang Chang

ISBN #:

0887305822

Author:

Yu Sang Chang

ISBN #:

0939246546

US Patent:

6423949, Jul 23, 2002

Filed:

May 19, 1999

Appl. No.:

09/314845

Inventors:

Steven Aihua Chen - Fremont CA
Henry Ho - San Jose CA
Michael X. Yang - Fremont CA
Bruce W. Peuse - San Carlos CA
Karl Littau - Palo Alto CA
Yu Chang - San Jose CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H05B 368

US Classification:

2194441, 118725

Abstract:

A heating apparatus including a stage comprising a surface having an area to support a wafer and a body, a shaft coupled to the stage, and a first and a second heating element. The first heating element is disposed within a first plane of the body of the stage. The second heating element is disposed within a second plane of the body of the stage at a greater distance from the surface of the stage than the first heating element. A reactor comprising a chamber, a resistive heater, a first temperature sensor, and a second temperature sensor. A resistive heating system for a chemical vapor deposition apparatus comprising a resistive heater. A method of controlling the temperature in a reactor comprising providing a resistive heater in a chamber of a reactor, measuring the temperature with at least two temperature sensors, and controlling the temperature in the reactor by regulating a power supply to the first heating element and the second heating element according to the temperature measured by the first temperature sensor and the second temperature sensor.

US Patent:

6500263, Dec 31, 2002

Filed:

Mar 26, 2001

Appl. No.:

09/817786

Inventors:

Yu Chang - San Jose CA
Wen Xiao Chen - Roseville CA

Assignee:

Applied Materials, Inc, - Santa Clara CA

International Classification:

C23C 16000

US Classification:

118715, 118707, 118733, 42725528

Abstract:

Multiple levels of interlocks are provided relative to gas flow for a chemical vapor deposition chamber. When a chamber lid used for normal processing is in place, no interlock is in effect. When a lid used during maintenance operations is in place, flow of toxic gas to the chamber is interlocked, but flow of purge gas is permitted. When no lid is in place, all gas flow to the chamber is interlocked. The interlock arrangement may be implemented with two switches, both of which are actuated when the lid for normal processing is in place, and only one of which is actuated by the lid for the maintenance process.

US Patent:

6618265, Sep 9, 2003

Filed:

Oct 1, 2001

Appl. No.:

09/969202

Inventors:

Fong M. Chang - Los Gatos CA
Yu Chang - San Jose CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H05K 702

US Classification:

361760, 361775, 361823, 361828, 307 12, 307 29

Abstract:

All-or-none operation of a series of modular load elements is ensured by routing high and low voltage lines from a power source through opposite nodes positioned at either end of the series of load elements. This arrangement prevents activation of only a portion of the load elements where electrical connection between them is not successfully established.

US Patent:

6646235, Nov 11, 2003

Filed:

Oct 19, 2001

Appl. No.:

10/037151

Inventors:

Steven Aihua Chen - Fremont CA
Henry Ho - San Jose CA
Michael X. Yang - Fremont CA
Bruce W. Peuse - San Carlos CA
Karl Littau - Palo Alto CA
Yu Chang - San Jose CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H05B 368

US Classification:

2194441, 118725

Abstract:

A heating apparatus including a stage comprising a surface having an area to support a wafer and a body, a shaft coupled to the stage, and a first and a second heating element. The first heating element is disposed within a first plane of the body of the stage. The second heating element is disposed within a second plane of the body of the stage at a greater distance from the surface of the stage than the first heating element. A reactor comprising a chamber, a resistive heater, a first temperature sensor, and a second temperature sensor. A resistive heating system for a chemical vapor deposition apparatus comprising a resistive heater. A method of controlling the temperature in a reactor comprising providing a resistive heater in a chamber of a reactor, measuring the temperature with at least two temperature sensors, and controlling the temperature in the reactor by regulating a power supply to the first heating element and the second heating element according to the temperature measured by the first temperature sensor and the second temperature sensor.

US Patent:

6734020, May 11, 2004

Filed:

Mar 7, 2001

Appl. No.:

09/800881

Inventors:

Siqing Lu - San Jose CA
Yu Chang - San Jose CA
Dongxi Sun - Cupertino CA
Vinh Dang - San Jose CA
Michael X. Yang - Palo Alto CA
Anzhong Chang - San Jose CA
Anh N. Nguyen - Milpitas CA
Ming Xi - Milpitas CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

G01N 3508

US Classification:

436 55

Abstract:

A valve control system for a semiconductor processing chamber includes a system control computer and a plurality of electrically controlled valves associated with the processing chamber. The system further includes a programmable logic controller in communication with the system control computer and operatively coupled to the electrically controlled valves. The refresh time for control of the valves may be less than 10 milliseconds. Consequently, valve control operations do not significantly extend the period of time required for highly repetitive cycling in atomic layer deposition processes. A hardware interlock may be implemented through the output power supply of the programmable logic controller.

US Patent:

7039083, May 2, 2006

Filed:

Mar 12, 2003

Appl. No.:

10/387926

Inventors:

Chris H. Carroll - Santa Clara CA, US
Shiming Wang - Fremont CA, US
Yu Chung Chang - Cupertino CA, US
Joseph Indhiran Vanniasinkam - Toronto, CA

Assignee:

Opnext, Inc. - Fremont CA

International Classification:

H01S 3/04

US Classification:

372 36, 372 34

Abstract:

An optical assembly that can be utilized as a transmitter in a high data rate optical transceiver system is presented. The optical assembly allows a laser driver to be mounted near the laser and allows the laser driver and the laser to utilize a common heat sink. Further, assembly can be performed reliably and quickly to reduce the cost of production of the optical assembly.

US Patent:

7112961, Sep 26, 2006

Filed:

Oct 14, 2003

Appl. No.:

10/685210

Inventors:

Lawrence C. Lei - Milpitas CA, US
Siqing Lu - San Jose CA, US
Yu Chang - San Jose CA, US
Cecilia Martner - Los Gatos CA, US
Quyen Pham - Sunnyvale CA, US
Yu Ping Gu - Sunnyvale CA, US
Joel Huston - San Jose CA, US
Paul Smith - Campbell CA, US
Gabriel Lorimer Miller - Eastham MA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

G01B 7/06
G01N 27/72

US Classification:

324230, 324226

Abstract:

A method and apparatus are provided for measuring the thickness of a test object. The apparatus includes an eddy current sensor having first and second sensor heads. The sensor heads are positioned to have a predetermined gap therebetween for passage by at least a portion of the test object through the gap. The sensor heads make measurements at given sampling locations on the test object as the test object is moved through the gap. The apparatus also includes a position sensing mechanism to determine positions of the sampling locations on the test object. The apparatus also includes an evaluation circuit in communication with the eddy current sensor and to the position sensing mechanism for determining the thickness of the test object at the sampling locations.

US Patent:

7201803, Apr 10, 2007

Filed:

Dec 9, 2003

Appl. No.:

10/731651

Inventors:

Siqing Lu - San Jose CA, US
Yu Chang - San Jose CA, US
Dongxi Sun - Cupertino CA, US
Vinh Dang - San Jose CA, US
Michael X. Yang - Palo Alto CA, US
Anzhong (Andrew) Chang - San Jose CA, US
Anh N. Nguyen - Milpitas CA, US
Ming Xi - Milpitas CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B05C 11/00

US Classification:

118710

Abstract:

A valve control system for a semiconductor processing chamber includes a system control computer and a plurality of electrically controlled valves associated with the processing chamber. The system further includes a programmable logic controller in communication with the system control computer and operatively coupled to the electrically controlled valves. The refresh time for control of the valves may be less than 10 milliseconds. Consequently, valve control operations do not significantly extend the period of time required for highly repetitive cycling in atomic layer deposition processes. A hardware interlock may be implemented through the output power supply of the programmable logic controller.