Yi I Feng

Author:

Yi Feng

ISBN #:

0262062356

Author:

Yi Feng

ISBN #:

0262562111

Author:

Yi Feng

ISBN #:

0813336198

US Patent:

6902260, Jun 7, 2005

Filed:

Jul 24, 2003

Appl. No.:

10/626065

Inventors:

Chris Aschoff - Corvallis OR, US
Paul F. Reboa - Corvallis OR, US
Pamela Woody - Corvallis OR, US
Yi Feng - San Diego CA, US
Terry M. Lambright - Corvallis OR, US
Leo Clarke - Albany OR, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B41J002/05

US Classification:

347 63

Abstract:

Fluid-ejection devices capable of ejecting fluid onto media and methods for their manufacture are provided. One embodiment includes adhering a fluid-ejecting substrate of the fluid-ejection device to a carrier of the fluid-ejection device by drawing an adhesive between the fluid-ejecting substrate and the carrier using capillary action.

US Patent:

20040001117, Jan 1, 2004

Filed:

Jul 1, 2002

Appl. No.:

10/186489

Inventors:

Si-Lam Choy - Corvallis OR, US
John Altendorf - Corvallis OR, US
Carl Baker - Corvallis OR, US
Yi Feng - Corvallis OR, US

International Classification:

B41J002/165

US Classification:

347/029000

Abstract:

A capping shroud for a fluid ejection device is disclosed as one embodiment of the invention. A fluid ejection assembly may include the fluid ejection die and the capping shroud. The capping shroud has an aperture therethrough and surrounds the fluid ejection die. A top surface of the capping shroud is substantially flush with a top surface of the fluid ejection die.

US Patent:

20110033660, Feb 10, 2011

Filed:

Apr 18, 2008

Appl. No.:

12/937923

Inventors:

Yi Feng - San Diego CA, US
Sterling Chaffins - Albany OR, US
Emmet Whittaker - Corvallis OR, US
Veronica A. Nelson - Albany OR, US
Brian G. Risch - Corvallis OR, US

International Classification:

C09J 7/02
B32B 7/12
B05D 5/10

US Classification:

428138, 428336, 4272071

Abstract:

An adhesive tape has an adhesive material including at least 28% vinyl acetate by weight disposed on a basefilm at a substantially uniform thickness of up to 18 microns. A method of fabricating an adhesive tape includes depositing an adhesive material including at least 28% vinyl acetate by weight on a basefilim at a substantially uniform thickness of up to 18 microns.

US Patent:

6107117, Aug 22, 2000

Filed:

Dec 20, 1996

Appl. No.:

8/770535

Inventors:

Zhenan Bao - North Plainfield NJ
Ananth Dodabalapur - Millington NJ
Yi Feng - Bridgewater NJ
Venkataram Reddy Raju - New Providence NJ

Assignee:

Lucent Technologies Inc. - Murray Hill NJ

International Classification:

H01L 5140

US Classification:

438 99

Abstract:

A process for fabricating thin film transistors in which the active layer is an organic semiconducting material with a carrier mobility greater than 10. sup. -3 cm. sup. 2 /Vs and a conductivity less than about 10. sup. -6 S/cm at 20. degree. C. is disclosed. The organic semiconducting material is a regioregular (3-alkylthiophene) polymer. The organic semiconducting films are formed by applying a solution of the regioregular polymer and a solvent over the substrate. The poly (3-alkylthiophene) films have a preferred orientation in which the thiophene chains has a planar stacking so the polymer backbone is generally parallel to the substrate surface.

US Patent:

63294672, Dec 11, 2001

Filed:

Dec 20, 1999

Appl. No.:

9/467861

Inventors:

Adel Farhan Halasa - Bath OH
Wen-Liang Hsu - Cuyahoga Falls OH
Charles John Pearson - Akron OH
Yi Feng - Corvallis OR

Assignee:

The Goodyear Tire & Rubber Company - Akron OH

International Classification:

C08F 842

US Classification:

525196

Abstract:

It has been unexpectedly found that greatly improved properties for tire rubbers, such as lower hysteresis, can be attained by coupling the rubber with both a tin halide, such as tin tetrachloride, and a silicon halide, such as silicon tetrachloride. Even better characteristics for use in tire tread compounds can be realized by asymmetrically coupling the rubbery polymer. This invention more specifically discloses a coupled rubbery polymer which is particularly valuable for use in manufacturing tire tread compounds, said coupled rubbery polymer being comprised of (1) tin atoms having at least three polydiene arms covalently bonded thereto and (2) silicon atoms having at least three polydiene arms covalently bonded thereto.

US Patent:

20220339862, Oct 27, 2022

Filed:

Jul 7, 2022

Appl. No.:

17/859922

Inventors:

- Spring TX, US
Hector Lebron - San Diego CA, US
Yi Feng - San Diego CA, US
Alay Yemane - San Diego CA, US
Ali Emamjomeh - San Diego CA, US

International Classification:

B29C 64/165
B33Y 10/00
B33Y 70/00
C09D 11/322
C09D 11/324

Abstract:

The present disclosure relates to a composition for printing a three-dimensional object. The composition comprises composite particles comprising a thermoplastic polymer and a colour-masking pigment. The colour-masking pigment is encapsulated by the thermoplastic polymer and is present in an amount of from about 1.5 to less than about 6 wt % of the total weight of the composite particles.

US Patent:

20220315779, Oct 6, 2022

Filed:

Jun 10, 2022

Appl. No.:

17/837232

Inventors:

- Spring TX, US
Rachael Donovan - San Diego CA, US
Shannon Reuben Woodruff - San Diego CA, US
Yi Feng - San Diego CA, US

International Classification:

C09D 11/102
B33Y 10/00
B33Y 70/00
B29C 64/165
C09D 11/30

Abstract:

Compositions including polyamides and methods of employing compositions including polyamides are described herein. For instance, composition for three-dimensional (3D) printing can include a polymer build material comprising of at least two polyamides including a first polyamide and a second polyamide, where the first polyamide is present in an amount ranging of from about 95% to about 99% of a total weight of the polymer build material and where the second polyamide is present in an amount ranging of from about 1% to about 5% of the total weight of the polymer build material.

US Patent:

20220298369, Sep 22, 2022

Filed:

Jun 10, 2022

Appl. No.:

17/837291

Inventors:

- Spring TX, US
Rachael Donovan - San Diego CA, US
Shannon Reuben Woodruff - San Diego CA, US
Yi Feng - San Diego CA, US

International Classification:

C09D 11/102
B33Y 10/00
B33Y 70/00
B29C 64/165
C09D 11/30

Abstract:

Compositions including polyamides and methods of employing compositions including polyamides are described herein. For instance, composition for three-dimensional (3D) printing can include a polymer build material comprising of at least two polyamides including a first polyamide and a second polyamide, where the first polyamide is present in an amount ranging of from about 95% to about 99% of a total weight of the polymer build material and where the second polyamide is present in an amount ranging of from about 1% to about 5% of the total weight of the polymer build material.