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Xiaohong H Tang

age ~59

from Amherst, NY

Also known as:
  • Xiad H Tang
  • Xiao H Tang
  • Shawn Tang
  • Hong Tang Xiao

Xiaohong Tang Phones & Addresses

  • Amherst, NY
  • Buffalo, NY
  • 4739 Columbia Rd, Ellicott City, MD 21042 • 410 997-3345
  • Columbia, MD
  • Anchorage, AK
  • Bronx, NY
  • Mayfield Heights, OH
  • 5292 Mallard Roost, Buffalo, NY 14221

Education

  • Degree:
    Associate degree or higher

Resumes

Xiaohong Tang Photo 1

Xiaohong Tang

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Us Patents

  • Emi Filtered Co-Connected Hermetic Feedthrough, Feedthrough Capacitor And Leadwire Assembly For An Active Implantable Medical Device

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  • US Patent:
    20140036409, Feb 6, 2014
  • Filed:
    Jan 16, 2013
  • Appl. No.:
    13/743276
  • Inventors:
    Thomas Marzano - East Amherst NY, US
    Keith W. Seitz - Clarence Center NY, US
    Steven W. Winn - Lancaster NY, US
    Christine A. Frysz - Orchard Park NY, US
    Richard L. Brendel - Carson City NV, US
    Jason Woods - Carson City NV, US
    Dominick J. Frustaci - Williamsville NY, US
    Xiaohong Tang - Williamsville NY, US
    William C. Thiebolt - Tonawanda NY, US
  • Assignee:
    GREATBATCH LTD. - Clarence NY
  • International Classification:
    H01G 4/35
  • US Classification:
    361302
  • Abstract:
    A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.
  • Elevated Hermetic Feedthrough Insulator Adapted For Side Attachment Of Electrical Conductors On The Body Fluid Side Of An Active Implantable Medical Device

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  • US Patent:
    20130184796, Jul 18, 2013
  • Filed:
    Jan 16, 2013
  • Appl. No.:
    13/742781
  • Inventors:
    Keith W. Seitz - Clarence Center NY, US
    Robert A. Stevenson - Canyon Country CA, US
    Xiaohong Tang - Williamsville NY, US
    William C. Thiebolt - Tonawanda NY, US
    Christine A. Frysz - Orchard Park NY, US
    Richard L. Brendel - Carson City NV, US
    Jason Woods - Carson City NV, US
    Steven W. Winn - Lancaster NY, US
    Dominick J. Frustaci - Williamsville NY, US
    Buehl E. Truex - Glendora CA, US
    Donald Hickel, Jr. - Scottsville NY, US
  • Assignee:
    GREATBATCH LTD. - Clarence NY
  • International Classification:
    A61N 1/05
  • US Classification:
    607116
  • Abstract:
    An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
  • Miniature Electrochemical Cell Having A Casing Of A Conductive Plate Closing An Open-Ended Ceramic Container Having A Via Hole Supporting An Electrically Conductive Pathway

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  • US Patent:
    20220384883, Dec 1, 2022
  • Filed:
    Aug 5, 2022
  • Appl. No.:
    17/817670
  • Inventors:
    - Clarence NY, US
    David Dianetti - Lancaster NY, US
    Xiaohong Tang - Williamsville NY, US
  • International Classification:
    H01M 50/155
    H01M 50/10
    H01M 50/116
    H01M 50/147
    H01M 50/172
    H01M 50/545
    H01M 50/159
    H01M 50/117
    H01M 50/548
    H01M 50/528
    H01M 50/559
    H01G 4/236
  • Abstract:
    A miniature electrochemical cell having a volume of less than 0.5 cc is described. The cell casing comprises an open-ended ceramic container having a via hole providing an electrically conductive pathway extending through the container. A metal lid closes the open-end of the container. An electrode assembly housed inside the casing comprises an anode current collector deposited on an inner surface of the ceramic container in contact with the electrically conductive pathway in the via hole. An anode active material contacts the current collector and a cathode active material contacts the metal lid. A separator is disposed between the anode and cathode active materials. That way, the electrically conductive pathway serves as a negative terminal, and the lid, electrically isolated from the conductive pathway by the ceramic container, serves as a positive terminal. The negative and positive terminals are configured for electrical connection to a load.
  • Method For Providing A Substrate With Hermetic Vias For A Thin Film Electrochemical Cell Activated With A Solid Electrolyte And Housed In A Ceramic Casing

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  • US Patent:
    20220376290, Nov 24, 2022
  • Filed:
    Aug 2, 2022
  • Appl. No.:
    17/879347
  • Inventors:
    - Clarence NY, US
    Xiaohong Tang - Williamsville NY, US
    Holly Noelle Moschiano - Williamsville NY, US
    Biswa P. Das - Thousand Oaks CA, US
    Brian P. Hohl - Clarence NY, US
  • International Classification:
    H01M 10/052
    H01M 10/0562
    H01M 4/131
    H01M 4/66
    H01M 50/10
    H01M 50/116
    H01M 50/186
    H01M 50/191
    H01M 50/124
  • Abstract:
    A method for providing a miniature electrochemical cell having a total volume that is less than 0.5 cc is described. The cell casing is formed by joining two ceramic casing halves together. One or both casing halves are machined from ceramic to provide a recess that is sized and shaped to contain the electrode assembly. The opposite polarity terminals are electrically conductive feedthroughs or pathways, such as of gold, and are formed by brazing gold into tapered via holes machined into one or both ceramic casing halves. The two ceramic casing halves are separated from each other by a metal interlayer, such as of gold, bonded to a thin film metallization layer, such as of titanium, that contacts an edge periphery of each ceramic casing half. A solid electrolyte of LiPON (LiPON) is used to activate the electrode assembly.
  • A Ceramic Reinforced Metal Composite For Hermetic Bodies For Implantable Devices

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  • US Patent:
    20230085958, Mar 23, 2023
  • Filed:
    Sep 12, 2022
  • Appl. No.:
    17/942229
  • Inventors:
    - Clarence NY, US
    Dallas J. Rensel - Sanborn NY, US
    Brian P. Hohl - Clarence NY, US
    Xiaohong Tang - Williamsville NY, US
  • International Classification:
    C04B 41/51
    A61N 1/375
    C04B 41/88
    C04B 41/45
    C04B 41/00
  • Abstract:
    A ceramic reinforced metal composite (CRMC) comprising a composition composite as an interpenetrating network of at least two interconnected composites is described. The interpenetrating networks comprise a ceramic matrix composite (CMC) and a metal matrix composite (MMC). The composition composite is particularly useful as an electrically conductive pathway extending through the ceramic body of a hermetically sealed component, for example, a feedthrough in an active implantable medical device (AIMD).
  • Miniature Electrochemical Cell Having A Casing Of A Conductive Plate Closing An Open-Ended Ceramic Container Having Two Via Holes Supporting Opposite Polarity Platinum-Containing Conductive Pathways

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  • US Patent:
    20210119189, Apr 22, 2021
  • Filed:
    Oct 17, 2019
  • Appl. No.:
    16/655286
  • Inventors:
    - Clarence NY, US
    David Dianetti - Lancaster NY, US
    Xiaohong Tang - Williamsville NY, US
  • International Classification:
    H01M 2/02
    H01M 10/0525
    H01M 2/04
    H01M 2/10
  • Abstract:
    A miniature electrochemical cell having a volume of less than 0.5 cc is described. The cell casing comprises an open-ended ceramic container having first and second via holes providing respective first and second electrically conductive pathways extending through the container. A metal lid secured to the open-end of the container by a gold seal provides the cell casing. An electrode assembly housed inside the casing comprises a cathode active material deposited on an inner surface of the ceramic container in contact with a current collector in electrical continuity with one of the conductive pathways. A solid electrolyte, preferably of LiPON (LiPON), is deposited on the cathode active material followed by an anode active material in contact with the other conductive pathway. The first and second conductive pathways can comprise platinum or gold. That way, the first and second conductive pathways serve as negative and positive terminals for the cell. The negative and positive terminals are configured for electrical connection to a load.
  • Miniature Electrochemical Cell Having A Casing Of A Conductive Plate Closing An Open-Ended Ceramic Container Having A Via Hole Supporting A Platinum-Containing Conductive Pathway

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  • US Patent:
    20210111382, Apr 15, 2021
  • Filed:
    Oct 15, 2019
  • Appl. No.:
    16/653247
  • Inventors:
    - Clarence NY, US
    David Dianetti - Lancaster NY, US
    Xiaohong Tang - Williamsville NY, US
  • International Classification:
    H01M 2/04
    H01M 2/06
    H01M 2/02
  • Abstract:
    A miniature electrochemical cell having a volume of less than 0.5 cc is described. The cell casing comprises an open-ended ceramic container having a via hole providing an electrically conductive pathway extending through the container. A metal lid closes the open-end of the container. An electrode assembly housed inside the casing comprises an anode current collector deposited on an inner surface of the ceramic container in contact with the electrically conductive pathway in the via hole. An anode active material contacts the current collector and a cathode active material contacts the metal lid. A separator is disposed between the anode and cathode active materials. That way, the electrically conductive pathway serves as a negative terminal, and the lid, electrically isolated from the conductive pathway by the ceramic container, serves as a positive terminal. The negative and positive terminals are configured for electrical connection to a load.
  • Substrate With Hermetic Vias For A Thin Film Electrochemical Cell Activated With A Solid Electrolyte And Housed In A Ceramic Casing

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  • US Patent:
    20200303763, Sep 24, 2020
  • Filed:
    Mar 9, 2020
  • Appl. No.:
    16/812492
  • Inventors:
    - Clarence NY, US
    Xiaohong Tang - Williamsville NY, US
    Brian P. Hohl - Clarence NY, US
    Biswa P. Das - Thousand Oaks CA, US
    Holly Noelle Moschiano - Williamsville NY, US
  • International Classification:
    H01M 10/052
    H01M 10/0562
    H01M 2/02
    H01M 2/06
    H01M 4/66
    H01M 4/131
  • Abstract:
    A miniature electrochemical cell having a total volume that is less than 0.5 cc is described. The cell casing is formed by joining two ceramic casing halves together. One or both casing halves are machined from ceramic to provide a recess that is sized and shaped to contain the electrode assembly. The opposite polarity terminals are electrically conductive feedthroughs or pathways, such as of gold, and are formed by brazing gold into tapered via holes machined into one or both ceramic casing halves. The two ceramic casing halves are separated from each other by a metal interlayer, such as of gold, bonded to a thin film metallization layer, such as of titanium, that contacts an edge periphery of each ceramic casing half. A solid electrolyte of LiPON (LiPON) is used to activate the electrode assembly.

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Xiaohong Tang

Youtube

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