William K Flaherty

US Patent:

49743171, Dec 4, 1990

Filed:

Apr 20, 1989

Appl. No.:

7/340633

Inventors:

Noe E. Rodriguez - Arnold MD
William T. Flaherty - Columbia MD
Sharon A. Duggan - Washington DC
Timothy M. Fertig - Pasadena MD

Assignee:

Westinghouse Electric Corp. - Pittsburgh PA

International Classification:

H05K 330

US Classification:

29841

Abstract:

A thermal heat transfer member is disclosed for use in electronic or microwave systems with particular application to advanced avionic systems. This thermal heat transfer member for line replaceable module (LRM) comprises; a bottom cover, a grid partition bottom means, a solid thermal plane material fixedly interconnected to the grid partition bottom means, a grid partition top means fixedly interconnected upon the thermal plane, sandwiching the thermal plane between the grid partition top and the grid partition bottom, and finally, a top cover. The utilization of a "building block" approach and composite high strength heat-conductive materials designed to dissipate heat away from electronic devices and components mounted within the LRM operate to produce a radio frequency LRM of high heat conductivity with reduced weight ideal for utilization in advanced development avionic systems subject to extreme G-force and stress in avionic system operation.

US Patent:

48376647, Jun 6, 1989

Filed:

Sep 12, 1988

Appl. No.:

7/247865

Inventors:

Noe E. Rodriguez - Arnold MD
William T. Flaherty - Columbia MD
Sharon A. Duggan - Washington DC
Timothy M. Fertig - Pasadena MD

Assignee:

Westinghouse Electric Corp. - Pittsburgh PA

International Classification:

H05K 720

US Classification:

361386

Abstract:

A thermal heat transfer member is disclosed for use in electronic or microwave systems with particular application to advanced avionic systems. This thermal heat transfer member for line replaceable module (LRM) comprises; a bottom cover, a grid partition bottom means, a solid thermal plane material fixedly interconnected to the grid partition bottom means, a grid partition top means fixedly interconnected upon the thermal plane, sandwiching the thermal plane between the grid partition top and the grid partition bottom, and finally, a top cover. The utilization of a "building block" approach and composite high strength heat-conductive materials designed to dissipate heat away from electronic devices and components mounted within the LRM operate to produce a radio frequency LRM of high heat conductivity with reduced weight ideal for utilization in advanced development avionic systems subject to extreme G-force and stress in avionic system operation.