Wayne C Schar

US Patent:

58422730, Dec 1, 1998

Filed:

Jan 26, 1996

Appl. No.:

8/592042

Inventors:

Wayne C. Schar - Portola Valley CA

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

H05K 336

US Classification:

29830

Abstract:

A method for compliant conductive interconnect whereby conductive adhesive is dispensed directly onto conductive sites of a first substrate and, while adhesive is wet or with partial or complete curing, a second substrate is aligned and placed in contact with adhesive deposits, thereby completing the interconnect. After assembly, un-filled underfill shrinks sufficiently to compress compliant adhesive and external clamping is largely eliminated. The method is scalable as low as about 6 mils with no real upper limit according to the percentage conductive particles by volume in the adhesive.