Walter R Demore

US Patent:

6366238, Apr 2, 2002

Filed:

Feb 20, 2001

Appl. No.:

09/790245

Inventors:

Walter R. DeMore - La Crescenta CA
Bruce A. Holmes - Redondo Beach CA
Martin Nunez - Carson CA

Assignee:

The Boeing Company - Seattle WA

International Classification:

H01Q 322

US Classification:

342368

Abstract:

A modular beamformer system for providing signals to at least two radiating elements of a phased array antenna is provided. The system includes a right-hand circular polarization beamformer module and a left-hand circular polarization beamformer module. The left and right circular polarization beamformer modules are coupled to two radiating elements. Each beamformer module includes two groups of beamforming circuitry, one per radiating element. At least one feeder line extends from each beamforming circuitry and is coupled to one of the radiating elements to transmit an output of each beamforming circuitry.

US Patent:

6380623, Apr 30, 2002

Filed:

Oct 15, 1999

Appl. No.:

09/418870

Inventors:

Walter R. Demore - La Crescenta CA

Assignee:

Hughes Electronics Corporation - El Segundo CA

International Classification:

H01L 2980

US Classification:

257723, 257275, 257301, 257691, 257724, 257308, 257363, 257173, 257725, 257604, 257664, 257728, 257532, 257533, 257534, 257924, 361766, 361807, 361808, 361821

Abstract:

A microwave-frequency microcircuit assembly includes an integrated circuit structure having a circuit ground. A support structure includes a grounded metallic carrier, and a dielectric substrate having a top surface, a bottom surface contacting the carrier, and a capacitor via extending through the dielectric substrate. A metallization on the top surface of the substrate includes an input metallization trace to the integrated circuit structure, an output metallization trace from the integrated circuit structure, and a substrate ground plane upon which the integrated circuit structure is affixed. A thin-film capacitor resides in the capacitor via and is electrically connected between the substrate ground plane and the carrier. An electrical resistor is connected between the circuit ground of the integrated circuit structure and the carrier to self-bias the integrated circuit structure.

US Patent:

6987417, Jan 17, 2006

Filed:

Jun 24, 2003

Appl. No.:

10/606093

Inventors:

Frank Winter - San Diego CA, US
Ian Robinson - Venice CA, US
Walter DeMore - San Diego CA, US

Assignee:

Northrop Grumman Corpoation - Los Angeles CA

International Classification:

H03F 3/38

US Classification:

330 10, 330297

Abstract:

An amplifier system is provided that switches between operation in a polar mode and a linear mode based on a characteristic of an input signal relative to a threshold level. The system operates as a polar amplifier in the polar mode, and as a linear amplifier in the linear mode. A mode selector controls whether polar components of the input signal are sent to a power amplifier or whether a composite signal is amplified.

US Patent:

62494392, Jun 19, 2001

Filed:

Oct 21, 1999

Appl. No.:

9/422581

Inventors:

Walter R. DeMore - La Crescenta CA
Richard A. Holloway - El Segundo CA
Bruce A. Holmes - Redondo Beach CA
Benjamin T. Johnson - Manhattan Beach CA
Dale A. Londre - Anaheim CA
Lloyd Y. Nakamura - Redondo Beach CA

Assignee:

Hughes Electronics Corporation - El Segundo CA

International Classification:

H01Q 2300

US Classification:

361752

Abstract:

A millimeter wave multilayer phased array assembly has a multilayer board consisting of several laminated printed wiring boards (PWBs) and a frame having a waveguide input and waveguide output. The PWBs are made of a high frequency laminate material and have a pattern of metalization to perform varying electronic tasks. These tasks include electrical interconnection, RF signal transmission, DC current routing and DC signal routing.