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Vivek M Sura

age ~65

from Chatham, NJ

Also known as:
  • Vivek Sura

Vivek Sura Phones & Addresses

  • Chatham, NJ
  • Hopewell Junction, NY

Us Patents

  • Copper-Based Paste Containing Copper Aluminate For Microstructural And Shrinkage Control Of Copper-Filled Vias

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  • US Patent:
    6358439, Mar 19, 2002
  • Filed:
    Jun 6, 1995
  • Appl. No.:
    08/466562
  • Inventors:
    Farid Youssif Aoude - Wappingers Falls NY
    Lawrence Daniel David - Wappingers Falls NY
    Renuka Shastri Divakaruni - Ridgefield CT
    Shaji Farooq - Hopewell Junction NY
    Lester Wynn Herron - Hopewell Junction NY
    Hal Mitchell Lasky - Hyde Park NY
    Anthony Mastreani - Hopewell Junction NY
    Govindarajan Natarajan - Pleasant Valley NY
    Vivek Madan Sura - Hopewell Junction NY
    Rao Venkateswara Vallabhaneni - Wappingers Falls NY
    Donald Rene Wall - Wappingers Falls NY
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    H01B 122
  • US Classification:
    252512
  • Abstract:
    A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.
  • Large Ceramic Articles And Method Of Manufacturing

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  • US Patent:
    54396360, Aug 8, 1995
  • Filed:
    Feb 18, 1992
  • Appl. No.:
    7/836675
  • Inventors:
    Raschid J. Bezama - Mahopac NY
    Jon A. Casey - LaGrange NY
    Mario E. Ecker - Poughkeepsie NY
    Shaji Farooq - Hopewell Junction NY
    Irene S. Frantz - Leeds NY
    Katharine G. Frase - Peekskill NY
    David H. Gabriels - Cold Springs NY
    Lester W. Herron - Hopewell Junction NY
    John U. Knickerbocker - Hopewell Junction NY
    Sara H. Knickerbocker - Hopewell Junction NY
    Govindarajan Natarajan - Pleasant Valley NY
    John Thomson - Lake Carmel NY
    Yee-Ming Ting - Cornwall NY
    Sharon L. Tracy - LaGrangeville NY
    Robert M. Troncillito - Marlboro NY
    Vivek M. Sura - Hopewell Junction NY
    Donald R. Wall - Wappingers Falls NY
    Giai V. Yen - Seattle WA
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    B22F 300
  • US Classification:
    419 3
  • Abstract:
    A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.
  • Copper-Based Paste Containing Copper Aluminate For Microstructural And Shrinkage Control Of Copper-Filled Vias

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  • US Patent:
    59254432, Jul 20, 1999
  • Filed:
    Sep 10, 1991
  • Appl. No.:
    7/758991
  • Inventors:
    Farid Youssif Aoude - Wappingers Falls NY
    Lawrence Daniel David - Wappingers Falls NY
    Renuka Shastri Divakaruni - Ridgefield CT
    Shaji Farooq - Hopewell Junction NY
    Lester Wynn Herron - Hopewell Junction NY
    Hal Mitchell Lasky - Hyde Park NY
    Anthony Mastreani - Hopewell Junction NY
    Govindarajan Natarajan - Pleasant Valley NY
    Vivek Madan Sura - Hopewell Junction NY
    Rao Venkateswara Vallabhaneni - Wappingers Falls NY
    Donald Rene Wall - Wappingers Falls NY
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    H01B 106
  • US Classification:
    428209
  • Abstract:
    A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.
  • Copper-Based Paste Containing Copper Aluminate For Microstructural And Shrinkage Control Of Copper-Filled Vias

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  • US Patent:
    61240419, Sep 26, 2000
  • Filed:
    Mar 11, 1999
  • Appl. No.:
    9/266338
  • Inventors:
    Farid Youssif Aoude - Wappingers Falls NY
    Lawrence Daniel David - Wappingers Falls NY
    Renuka Shastri Divakaruni - Ridgefield CT
    Shaji Farooq - Hopewell Junction NY
    Lester Wynn Herron - Hopewell Junction NY
    Hal Mitchell Lasky - Hyde Park NY
    Anthony Mastreani - Hopewell Junction NY
    Govindarajan Natarajan - Pleasant Valley NY
    Vivek Madan Sura - Hopewell Junction NY
    Rao Venkateswara Vallabhaneni - Wappingers Falls NY
    Donald Rene Wall - Wappingers Falls NY
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    H01B 106
  • US Classification:
    428472
  • Abstract:
    A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.
  • Toughened Glass Ceramic Substrates For Semiconductor Devices Subjected To Oxidizing Atmospheres During Sintering

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  • US Patent:
    53045173, Apr 19, 1994
  • Filed:
    Feb 1, 1993
  • Appl. No.:
    8/011577
  • Inventors:
    Jon A. Casey - Poughkeepsie NY
    Sylvia M. DeCarr - Poughkeepsie NY
    Subhash L. Shinde - Croton-on-Hudson NY
    Vivek M. Sura - Hopewell Junction NY
    Rao R. Tummala - Hopewell Junction NY
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    C03C 1400
    C03C 818
  • US Classification:
    501 32
  • Abstract:
    A sintering process is described using a glass-ceramic slurry containing an alloy powder or flakes selected from a group of alloys consisting of: ______________________________________ Fe--Cr Cu--Ti Fe--Cr--Ni Ag--Ti Cr--Al Nb--Al Ni--Cr Cu--Al Ni--Al Cu--Al--Cr Fe--Al ______________________________________ The slurry is molded and later is sintered in a steam atmosphere at a temperature of about 1000. degree. C. to yield a glass-ceramic substrate toughened against crack propagation and useful in the packaging of semi-conductor device chips.
  • Large Ceramic Article And Method Of Manufacturing

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  • US Patent:
    55410057, Jul 30, 1996
  • Filed:
    May 11, 1995
  • Appl. No.:
    8/438825
  • Inventors:
    Raschid J. Bezama - Mahopac NY
    Jon A. Casey - LaGrange NY
    Mario E. Ecker - Poughkeepsie NY
    Shaji Farooq - Hopewell Junction NY
    Irene S. Frantz - Leeds NY
    Katherine G. Frase - Peekskill NY
    David H. Gabriels - Cold Springs NY
    Lester W. Herron - Hopewell Junction NY
    John U. Knickerbocker - Hopewell Junction NY
    Sarah H. Knickerbocker - Hopewell Junction NY
    Govindarajan Natarajan - Pleasant Valley NY
    John Thomson - Lake Carmel NY
    Yee-Ming Ting - Cornwall NY
    Sharon L. Tracy - LaGrangeville NY
    Robert M. Troncillito - Marlboro NY
    Vivek M. Sura - Hopewell Junction NY
    Donald R. Wall - Wappingers Falls NY
    Giai V. Yen - Seattle WA
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    B22F 3105
  • US Classification:
    428551
  • Abstract:
    A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.
  • I/O Pad Adhesion Layer For A Ceramic Substrate

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  • US Patent:
    55320317, Jul 2, 1996
  • Filed:
    Jan 29, 1992
  • Appl. No.:
    7/827657
  • Inventors:
    Shaji Farooq - Hopewell Junction NY
    Sampath Purushothaman - Yorktown Heights NY
    Vivek M. Sura - Hopewell Junction NY
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    B32B 1504
    H01L 2348
  • US Classification:
    428623
  • Abstract:
    A ceramic substrate having an improved I/O pad adhesion layer. The ceramic substrate has an I/O pad for joining to an I/O pin. The I/O pad includes an improved adhesion layer of TiO, followed by layers of Ti (or Ti and Ni) and a solder wettable layer which may be Au or Pt. Also disclosed are low yield stress solders of Sn/Sb, Sn/Ag, Sn/Cu and Sn/Cu/Ti.

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