Vivek M Sura

US Patent:

6358439, Mar 19, 2002

Filed:

Jun 6, 1995

Appl. No.:

08/466562

Inventors:

Farid Youssif Aoude - Wappingers Falls NY
Lawrence Daniel David - Wappingers Falls NY
Renuka Shastri Divakaruni - Ridgefield CT
Shaji Farooq - Hopewell Junction NY
Lester Wynn Herron - Hopewell Junction NY
Hal Mitchell Lasky - Hyde Park NY
Anthony Mastreani - Hopewell Junction NY
Govindarajan Natarajan - Pleasant Valley NY
Vivek Madan Sura - Hopewell Junction NY
Rao Venkateswara Vallabhaneni - Wappingers Falls NY
Donald Rene Wall - Wappingers Falls NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01B 122

US Classification:

252512

Abstract:

A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.

US Patent:

54396360, Aug 8, 1995

Filed:

Feb 18, 1992

Appl. No.:

7/836675

Inventors:

Raschid J. Bezama - Mahopac NY
Jon A. Casey - LaGrange NY
Mario E. Ecker - Poughkeepsie NY
Shaji Farooq - Hopewell Junction NY
Irene S. Frantz - Leeds NY
Katharine G. Frase - Peekskill NY
David H. Gabriels - Cold Springs NY
Lester W. Herron - Hopewell Junction NY
John U. Knickerbocker - Hopewell Junction NY
Sara H. Knickerbocker - Hopewell Junction NY
Govindarajan Natarajan - Pleasant Valley NY
John Thomson - Lake Carmel NY
Yee-Ming Ting - Cornwall NY
Sharon L. Tracy - LaGrangeville NY
Robert M. Troncillito - Marlboro NY
Vivek M. Sura - Hopewell Junction NY
Donald R. Wall - Wappingers Falls NY
Giai V. Yen - Seattle WA

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B22F 300

US Classification:

419 3

Abstract:

A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.

US Patent:

59254432, Jul 20, 1999

Filed:

Sep 10, 1991

Appl. No.:

7/758991

Inventors:

Farid Youssif Aoude - Wappingers Falls NY
Lawrence Daniel David - Wappingers Falls NY
Renuka Shastri Divakaruni - Ridgefield CT
Shaji Farooq - Hopewell Junction NY
Lester Wynn Herron - Hopewell Junction NY
Hal Mitchell Lasky - Hyde Park NY
Anthony Mastreani - Hopewell Junction NY
Govindarajan Natarajan - Pleasant Valley NY
Vivek Madan Sura - Hopewell Junction NY
Rao Venkateswara Vallabhaneni - Wappingers Falls NY
Donald Rene Wall - Wappingers Falls NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01B 106

US Classification:

428209

Abstract:

A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.

US Patent:

61240419, Sep 26, 2000

Filed:

Mar 11, 1999

Appl. No.:

9/266338

Inventors:

Farid Youssif Aoude - Wappingers Falls NY
Lawrence Daniel David - Wappingers Falls NY
Renuka Shastri Divakaruni - Ridgefield CT
Shaji Farooq - Hopewell Junction NY
Lester Wynn Herron - Hopewell Junction NY
Hal Mitchell Lasky - Hyde Park NY
Anthony Mastreani - Hopewell Junction NY
Govindarajan Natarajan - Pleasant Valley NY
Vivek Madan Sura - Hopewell Junction NY
Rao Venkateswara Vallabhaneni - Wappingers Falls NY
Donald Rene Wall - Wappingers Falls NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01B 106

US Classification:

428472

Abstract:

A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.

US Patent:

53045173, Apr 19, 1994

Filed:

Feb 1, 1993

Appl. No.:

8/011577

Inventors:

Jon A. Casey - Poughkeepsie NY
Sylvia M. DeCarr - Poughkeepsie NY
Subhash L. Shinde - Croton-on-Hudson NY
Vivek M. Sura - Hopewell Junction NY
Rao R. Tummala - Hopewell Junction NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

C03C 1400
C03C 818

US Classification:

501 32

Abstract:

A sintering process is described using a glass-ceramic slurry containing an alloy powder or flakes selected from a group of alloys consisting of: ______________________________________ Fe--Cr Cu--Ti Fe--Cr--Ni Ag--Ti Cr--Al Nb--Al Ni--Cr Cu--Al Ni--Al Cu--Al--Cr Fe--Al ______________________________________ The slurry is molded and later is sintered in a steam atmosphere at a temperature of about 1000. degree. C. to yield a glass-ceramic substrate toughened against crack propagation and useful in the packaging of semi-conductor device chips.

US Patent:

55410057, Jul 30, 1996

Filed:

May 11, 1995

Appl. No.:

8/438825

Inventors:

Raschid J. Bezama - Mahopac NY
Jon A. Casey - LaGrange NY
Mario E. Ecker - Poughkeepsie NY
Shaji Farooq - Hopewell Junction NY
Irene S. Frantz - Leeds NY
Katherine G. Frase - Peekskill NY
David H. Gabriels - Cold Springs NY
Lester W. Herron - Hopewell Junction NY
John U. Knickerbocker - Hopewell Junction NY
Sarah H. Knickerbocker - Hopewell Junction NY
Govindarajan Natarajan - Pleasant Valley NY
John Thomson - Lake Carmel NY
Yee-Ming Ting - Cornwall NY
Sharon L. Tracy - LaGrangeville NY
Robert M. Troncillito - Marlboro NY
Vivek M. Sura - Hopewell Junction NY
Donald R. Wall - Wappingers Falls NY
Giai V. Yen - Seattle WA

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B22F 3105

US Classification:

428551

Abstract:

A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.

US Patent:

55320317, Jul 2, 1996

Filed:

Jan 29, 1992

Appl. No.:

7/827657

Inventors:

Shaji Farooq - Hopewell Junction NY
Sampath Purushothaman - Yorktown Heights NY
Vivek M. Sura - Hopewell Junction NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B32B 1504
H01L 2348

US Classification:

428623

Abstract:

A ceramic substrate having an improved I/O pad adhesion layer. The ceramic substrate has an I/O pad for joining to an I/O pin. The I/O pad includes an improved adhesion layer of TiO, followed by layers of Ti (or Ti and Ni) and a solder wettable layer which may be Au or Pt. Also disclosed are low yield stress solders of Sn/Sb, Sn/Ag, Sn/Cu and Sn/Cu/Ti.