Virang G Shah

age ~63

from Plano, TX

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Also known as:

Virang A Shah
Virang C Shah
Girang G Shah
Virang G Small
Virang G Smay
Chah Virang

Phone and address:: 8008 Barrymoore Ln, Plano, TX 75025
214 383-2089

Connected to:

Virang Shah Phones & Addresses

8008 Barrymoore Ln, Plano, TX 75025 • 214 383-2089 • 214 495-6587
4420 Giovanni Dr, Plano, TX 75024 • 972 208-2718
2821 Townbluff Dr, Plano, TX 75075 • 972 612-3225 • 972 867-6116
Lubbock, TX

Work

Company:

Microfab technologies, inc
Nov 1991
Position:

Senior applications engineer

Education

Degree:

Master of Science, Masters
School / High School:

The University of Texas at Dallas
1991 to 1995
Specialities:

Engineering

Skills

Materials Science • Thin Films • Semiconductors • Characterization • Engineering • Design of Experiments • Electronics • Project Management • Research and Development • Product Development • Manufacturing • Nanotechnology • Materials • Cross Functional Team Leadership • Marketing • Website Updating

Languages

English • Hindi • Bengali • Gujarati

Industries

Electrical/Electronic Manufacturing

Medicine Doctors

Virang G. Shah

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Specialties:

Podiatric Medicine

Work:

Foot & Ankle Health Centers LLC
3925 Johns Crk Ct STE C2, Suwanee, GA 30024
678 871-0876 (phone), 678 871-0836 (fax)

Languages:

English

Description:

Dr. Shah works in Suwanee, GA and specializes in Podiatric Medicine. Dr. Shah is affiliated with Emory Johns Creek Hospital.

Resumes

Senior Applications Engineer

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Location:

Dallas, TX

Industry:

Electrical/Electronic Manufacturing

Work:

Microfab Technologies, Inc
Senior Applications Engineer
Gtz India Oct 1984 - Jul 1987
Sales and Technical Service Executive

Education:

The University of Texas at Dallas 1991 - 1995
Master of Science, Masters, Engineering Texas Tech University 1988 - 1990
Master of Business Administration, Masters, General Business National Institute of Technology Durgapur 1980 - 1984
Bachelor of Engineering, Bachelors, Chemical Engineering

Skills:

Materials Science
Thin Films
Semiconductors
Characterization
Engineering
Design of Experiments
Electronics
Project Management
Research and Development
Product Development
Manufacturing
Nanotechnology
Materials
Cross Functional Team Leadership
Marketing
Website Updating

Languages:

English
Hindi
Bengali
Gujarati

Us Patents

Direct Solder Bumping Of Hard To Solder Substrate
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US Patent:

60150831, Jan 18, 2000
Filed:

Jan 27, 1997
Appl. No.:

8/789640
Inventors:

Donald J. Hayes - Plano TX
Michael T. Boldman - Murphy TX
Virang G. Shah - Plano TX
Assignee:

MicroFab Technologies, Inc. - Plano TX
International Classification:

B23K 100
B23K 3102
US Classification:

228254
Abstract:

A method has been formed for direct solder "bumping" of wafers, chips and interconnection pads or traces on hard to solder surfaces such as aluminum and indium tin oxide. It has been discovered that conventional solders modified by the addition of a light reactive metal can be jetted in the form of microdroplets onto a hard to solder substrate and that the modified droplets will wet and bond to the surface of the hard to solder substrate. This makes it possible for the first time to create solder bumps on bare uncoated hard to solder substrates such as aluminum and indium tin oxide without the need for first applying a different surface which conventional solder will wet.