Uri Frodis

US Patent:

6613972, Sep 2, 2003

Filed:

Jan 5, 2001

Appl. No.:

09/755985

Inventors:

Adam L. Cohen - Los Angeles CA
Paul Ronney - Monrovia CA
Uri Frodis - Los Angeles CA
Lars Sitzki - Niedernhausen, DE
Eckart Meiburg - Santa Barbara CA
Steffen Wussow - Hamburg, DE

Assignee:

University of Southern California - Los Angeles CA

International Classification:

H01L 3528

US Classification:

136209, 136204, 136211, 136212

Abstract:

A generally toroidal counterflow heat exchanger is the main element of a combustor that operates at a micro scale. The combustor includes a central combustion region with openings to a reactant gas channel and an exhaust gas channel. The reactant channel and exhaust channels are coiled around each other in a spiral configuration that reduces heat loss. An electric current microgenerator is similar and also includes a thermoelectric active wall composed of n-type and p-type thermoelectric elements as part of a channel wall of the microcombustor. The thermoelectric active wall includes fins configured to increase the temperature differential across the thermoelectric elements relative to the temperature difference between the thermoelectric elements and the reactant and exhaust gases. A method of monolithically fabricating such microdevices by electrodepositing multiple layers of material is also provided.

US Patent:

6951456, Oct 4, 2005

Filed:

Jul 29, 2003

Appl. No.:

10/630513

Inventors:

Adam L. Cohen - Los Angeles CA, US
Paul D. Ronney - Monrovia CA, US
Uri Frodis - Los Angeles CA, US
Lars Sitzki - Niedernhausen, DE
Eckart H. Meiburg - Santa Barbara CA, US
Steffen Wussow - Hamburg, DE

Assignee:

University of Southern California - Los Angeles CA

International Classification:

F23D014/02

US Classification:

431215, 136209, 136204, 136211, 136212, 431116, 431242, 431247, 431254, 431258, 431350, 110204

Abstract:

A generally toroidal counterflow heat exchanger is the main element of a combustor that operates at a micro scale. The combustor includes a central combustion region with openings to a reactant gas channel and an exhaust gas channel. The reactant channel and exhaust channels are coiled around each other in a spiral configuration that reduces heat loss. An electric current microgenerator is similar and also includes a thermoelectric active wall composed of n-type and p-type thermoelectric elements as part of a channel wall of the microcombustor. The thermoelectric active wall includes fins configured to increase the temperature differential across the thermoelectric elements relative to the temperature difference between the thermoelectric elements and the reactant and exhaust gases. A method of monolithically fabricating such microdevices by electrodepositing multiple layers of material is also provided.

US Patent:

7271888, Sep 18, 2007

Filed:

Jan 3, 2005

Appl. No.:

11/029220

Inventors:

Uri Frodis - Los Angeles CA, US
Adam L. Cohen - Los Angeles CA, US
Michael S. Lockard - Lake Elizabeth CA, US

Assignee:

Microfabrica Inc. - Van Nuys CA

International Classification:

G01N 21/88

US Classification:

3562371, 451 6, 438 14

Abstract:

Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e. g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e. g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.

US Patent:

7517462, Apr 14, 2009

Filed:

Jan 3, 2005

Appl. No.:

11/029014

Inventors:

Adam L. Cohen - Los Angeles CA, US
Michael S. Lockard - Lake Elizabeth CA, US
Kieun Kim - Pasadena CA, US
Qui T. Le - Anaheim CA, US
Gang Zhang - Monterey Park CA, US
Uri Frodis - Los Angeles CA, US
Dale S. McPherson - Kissimmee FL, US
Dennis R. Smalley - Newhall CA, US

Assignee:

Microfabrica Inc. - Van Nuys CA

International Classification:

B81C 1/00

US Classification:

216 2, 216 13, 216 38, 216 39, 216 56, 205118, 205223

Abstract:

Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e. g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

US Patent:

7524427, Apr 28, 2009

Filed:

Jan 3, 2005

Appl. No.:

11/029218

Inventors:

Adam L. Cohen - Los Angeles CA, US
Michael S. Lockard - Lake Elizabeth CA, US
Kieun Kim - Pasadena CA, US
Qui T. Le - Anaheim CA, US
Gang Zhang - Monterey Park CA, US
Uri Frodis - Los Angeles CA, US
Dale S. McPherson - Kissimmee FL, US
Dennis R. Smalley - Newhall CA, US

Assignee:

Microfabrica Inc. - Van Nuys CA

International Classification:

B81C 1/00

US Classification:

216 2, 216 13, 216 38, 216 39, 216 56, 205118, 205223

Abstract:

Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e. g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

US Patent:

7588674, Sep 15, 2009

Filed:

Jan 3, 2005

Appl. No.:

11/028944

Inventors:

Uri Frodis - Los Angeles CA, US
Adam L. Cohen - Los Angeles CA, US
Michael S. Lockard - Lake Elizabeth CA, US

Assignee:

Microfabrica Inc. - Van Nuys CA

International Classification:

C25D 5/52

US Classification:

205222, 205170, 451 8

Abstract:

Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e. g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e. g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.

US Patent:

7878385, Feb 1, 2011

Filed:

Oct 30, 2007

Appl. No.:

11/929539

Inventors:

Ananda H. Kumar - Fremont CA, US
Ezekiel J. J. Kruglick - San Diego CA, US
Adam L. Cohen - Los Angeles CA, US
Kieun Kim - Pasadena CA, US
Gang Zhang - Monterey Park CA, US
Richard T. Chen - Burbank CA, US
Christopher A. Bang - San Diego CA, US
Vacit Arat - La Canada Flintridge CA, US
Michael S. Lockard - Lake Elizabeth CA, US
Uri Frodis - Los Angeles CA, US
Pavel B. Lembrikov - Santa Monica CA, US
Jeffrey A. Thompson - Los Angeles CA, US

Assignee:

Microfabrica Inc. - Van Nuys CA

International Classification:

B23K 31/02

US Classification:

22818022, 228215

Abstract:

Embodiments of invention are directed to the formation of microprobes (i. e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i. e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

US Patent:

8382423, Feb 26, 2013

Filed:

Jul 7, 2008

Appl. No.:

12/168787

Inventors:

Uri Frodis - Los Angeles CA, US
Adam L. Cohen - Los Angeles CA, US
Michael S. Lockard - Lake Elizabeth CA, US

Assignee:

Microfabrica Inc. - Van Nuys CA

International Classification:

F04D 1/08

US Classification:

415 83, 415904

Abstract:

Embodiments are directed to micro-scale or meso-scale devices having hydraulic or pneumatic actuation mechanisms incorporating bearings elements (such as ball bearings, cylindrical bearings, interference bearings, or hydrostatic bearings. Devices of some embodiments are turbines. Some devices may function as medical devices. Other embodiments are directed to multi-layer, multi-material electrochemical fabrication methods for producing such devices.