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Travis S Longenbach

age ~34

from Clinton, NY

Travis Longenbach Phones & Addresses

  • Clinton, NY
  • Gansevoort, NY
  • 34 Division St, Ballston Spa, NY 12020
  • Essex Junction, VT
  • South Burlington, VT
  • Philadelphia, PA
  • Levittown, PA

Work

  • Company:
    Globalfoundries
    Apr 2019 to Jun 2019
  • Position:
    Member of technical staff, integration

Education

  • Degree:
    Master of Science, Masters
  • School / High School:
    Drexel University
    2008 to 2013
  • Specialities:
    Materials Science

Skills

Powder X Ray Diffraction • Uv/Vis • Structured Problem Solving • Project Management • Materials Science • Semiconductors • Microsoft Office • Characterization • Manufacturing • Failure Mode and Effects Analysis • Root Cause Analysis • Microsoft Powerpoint • Cross Functional Team Leadership • Nanoparticles • Biomaterials • Thin Films • Raman • R&D • Data Analysis • Optical Inspection • Defect Characterization • Equipment Engineering • Business Process Mapping • Engineering • Matlab • Microsoft Excel • Quality Assurance • Integration • Research and Development • Research • Process Engineering

Languages

English

Ranks

  • Certificate:
    Hseb Service Level 2

Interests

New Product Development • Semiconductors • Project Management • Research • Biotechnology • Healthcare • Manufacturing • R&D

Industries

Semiconductors

Us Patents

  • Managing A Condition Of A Selection Of Clothing Items

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  • US Patent:
    20170000277, Jan 5, 2017
  • Filed:
    Jun 30, 2015
  • Appl. No.:
    14/788314
  • Inventors:
    - Armonk NY, US
    TRAVIS LONGENBACH - ESSEX JUNCTION VT, US
    NICOLAS E. PIZZUTI - ESSEX JUNCTION VT, US
  • International Classification:
    A47G 25/14
    G08B 21/18
  • Abstract:
    A monitoring system including one or more processors communicatively connected with a memory, one or more output interfaces, one or more connectivity interfaces and one or more sensors, is attached to a clothing frame. The one or more sensors sense one or more indicators of a status of a clothing item attached to the clothing frame, the one or more sensors attached to the clothing frame and connected to one or more processors, one or more output interfaces, and one or more connectivity interfaces. The monitoring system determines the status information for the clothing item based on the one or more indicators. The monitoring system selectively adjusts an output interface to display the status information. The monitoring system communicates the status information to one or more additional clothing frames via the one or more connectivity interfaces.
  • Intelligent Wardrobe Program

    view source
  • US Patent:
    20160321547, Nov 3, 2016
  • Filed:
    Apr 30, 2015
  • Appl. No.:
    14/700254
  • Inventors:
    - GRAND CAYMAN, KY
    Travis S. Longenbach - Essex Junction VT, US
    Nicolas E. Pizzuti - South Burlington VT, US
  • International Classification:
    G06N 5/04
  • Abstract:
    A computer receives information detailing the wardrobe of the user, including apparel and accessories, stored in a wardrobe database. The computer receives the schedule of the user and searches the schedule for keywords associated with dress codes and locational information in order to identify the dress code and locations of scheduled events. The computer cross references the determined dress code and weather conditions with suitable clothing in the wardrobe of the user then sends a signal to receivers in the wardrobe to indicate to the user which articles of clothing are appropriate for the weather and occasions of a particular day.
  • Predicting Semiconductor Package Warpage

    view source
  • US Patent:
    20160290905, Oct 6, 2016
  • Filed:
    Mar 30, 2015
  • Appl. No.:
    14/672331
  • Inventors:
    - Armonk NY, US
    Eric G. Liniger - Sandy Hook CT, US
    Travis S. Longenbach - Essex Junction VT, US
  • International Classification:
    G01N 3/42
  • Abstract:
    A method for predicting the electrical functionality of a semiconductor package, the method includes performing a first stiffness test for a first semiconductor package, receiving failure data for the first semiconductor package, the failure data includes results of an electrical test performed after the first semiconductor package is assembled on a printed circuit board, generating a database comprising results of the first stiffness test as a function of the failure data for the first semiconductor package, performing a second stiffness test for a second semiconductor package, identifying a unique result from the results of the first stiffness test in the database, the unique result aligns with a result of the second stiffness test, and predicting a failure data for the second semiconductor package based on the failure data for the first semiconductor package which corresponds to the unique result of the first stiffness test identified in the database.
  • Elliptical Wafer Manufacture

    view source
  • US Patent:
    20160079059, Mar 17, 2016
  • Filed:
    Sep 17, 2014
  • Appl. No.:
    14/488617
  • Inventors:
    - Armonk NY, US
    Dylan J. Fath - Winooski VT, US
    Michael C. Johnson - Burlington VT, US
    Travis S. Longenbach - South Burlington VT, US
    Nicolas E. Pizzuti - South Burlington VT, US
  • International Classification:
    H01L 21/02
    H01L 31/0352
    H01L 29/06
    H01L 31/18
    H01L 21/78
    H01L 29/04
  • Abstract:
    An approach to manufacturing an elliptical semiconductor wafer includes a structure for an elliptical semiconductor wafer with a crystal direction, wherein the crystal direction is provided by a seed crystal orientation. The structure of the elliptical semiconductor wafer has a minor radius for the elliptical semiconductor wafer and a major radius for the elliptical semiconductor wafer wherein the major radius is greater than the minor radius.

Resumes

Travis Longenbach Photo 1

Member Of Technical Staff, Quality

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Location:
8 River Crest Rd, Gansevoort, NY 12831
Industry:
Semiconductors
Work:
Globalfoundries Apr 2019 - Jun 2019
Member of Technical Staff, Integration

Globalfoundries Apr 2019 - Jun 2019
Member of Technical Staff, Quality

Globalfoundries Mar 2017 - Apr 2019
Principal Engineer, Process Integration

Globalfoundries Jul 2015 - Mar 2017
Principal Quality Assurance Engineer

Ibm Aug 2013 - May 2014
Staff Quality Engineer
Education:
Drexel University 2008 - 2013
Master of Science, Masters, Materials Science
Drexel University 2008 - 2013
Bachelors, Bachelor of Science, Materials Science, Engineering
Skills:
Powder X Ray Diffraction
Uv/Vis
Structured Problem Solving
Project Management
Materials Science
Semiconductors
Microsoft Office
Characterization
Manufacturing
Failure Mode and Effects Analysis
Root Cause Analysis
Microsoft Powerpoint
Cross Functional Team Leadership
Nanoparticles
Biomaterials
Thin Films
Raman
R&D
Data Analysis
Optical Inspection
Defect Characterization
Equipment Engineering
Business Process Mapping
Engineering
Matlab
Microsoft Excel
Quality Assurance
Integration
Research and Development
Research
Process Engineering
Interests:
New Product Development
Semiconductors
Project Management
Research
Biotechnology
Healthcare
Manufacturing
R&D
Languages:
English
Certifications:
Hseb Service Level 2
Cert Prep: Project Management Professional (Pmp)®

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