Tor N Kalleberg

US Patent:

56464410, Jul 8, 1997

Filed:

Apr 18, 1996

Appl. No.:

8/631600

Inventors:

Altaf Hasan - Chandler AZ
J. D. Wilson - Phoenix AZ
Tor Kalleberg - Phoenix AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 23495

US Classification:

257666

Abstract:

An integrated circuit package which has a plurality of inner surface pads located on a substrate and arranged in an angular pattern about an integrated circuit. The inner surface pads of the package are coupled to the outer surface pads of the integrated circuit with a TAB tape. The TAB tape has a plurality of conductors which each have a first end attached to the outer pads of the integrated circuit and a land portion attached to the inner surface pads of the substrate. The land portions of the tape are also arranged in an angular pattern about the integrated circuit.