Todd Alan Young

US Patent:

7595468, Sep 29, 2009

Filed:

Nov 7, 2005

Appl. No.:

11/268979

Inventors:

Sung-won Moon - Phoenix AZ, US
Todd Young - Gilbert AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05B 3/06
H05K 7/20

US Classification:

219540, 361679, 361687, 361703, 361704, 257777, 257676

Abstract:

The present invention relates to a thermal solution for hand-held devices. In an embodiment, the present invention implements a thermal gap filler and a system enclosure for effective thermal management of high performance hand-held devices. In an embodiment, a hand-held device of the present invention increases the thermal power dissipation capability by reducing its system thermal resistance.

US Patent:

20080160330, Jul 3, 2008

Filed:

Dec 29, 2006

Appl. No.:

11/648214

Inventors:

David Song - Chandler AZ, US
Kelly Lofgreen - Phoenix AZ, US
Barrett Faneuf - Olympia WA, US
Chia-Pin Chiu - Tampe AZ, US
Stephen Montgomery - Seattle WA, US
Todd Young - Gilbert AZ, US
Seth Reynolds - Chandler AZ, US

International Classification:

C22C 28/00

US Classification:

428545

Abstract:

In some embodiments, copper-elastomer hybrid thermal interface material to cool under-substrate silicon is presented. In this regard, an apparatus is introduced having a layer of copper, a layer of elastomer, and a layer of thin film thermal interface material between the copper and elastomer layers. Other embodiments are also disclosed and claimed.

US Patent:

20100008047, Jan 14, 2010

Filed:

Sep 15, 2009

Appl. No.:

12/586065

Inventors:

Sung-won Moon - Phoenix AZ, US
Todd Young - Gilbert AZ, US

International Classification:

H05K 7/20
H05K 9/00

US Classification:

361714, 361818, 361704

Abstract:

The present invention relates to a thermal solution for hand-held devices. In an embodiment, the present invention implements a thermal gap filler and a system enclosure for effective thermal management of high performance hand-held devices. In an embodiment, a hand-held device of the present invention increases the thermal power dissipation capability by reducing its system thermal resistance.

US Patent:

59905492, Nov 23, 1999

Filed:

Feb 6, 1998

Appl. No.:

9/019570

Inventors:

Chia-Pin Chiu - Chandler AZ
Imran Yusuf - Phoenix AZ
Banerjee Koushik - Chandler AZ
Todd Young - Chandler AZ
Gary Solbrekken - Chandler AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 2348
H01L 2334
H01L 2310

US Classification:

257706

Abstract:

One embodiment of the present invention is an electronic assembly which may have a first integrated circuit package mounted to a first side of a substrate and a second integrated circuit package mounted to a second side of the substrate. A thermal plate may be thermally coupled to the first integrated circuit package. A heat sink may be mounted to the thermal plate. A thermal bus may be is thermally coupled to the second integrated circuit package and the thermal plate. The thermal bus bar allows heat to flow from the second integrated circuit package to the thermal plate and heat sink. The electronic assembly of the present invention can thus remove heat from integrated circuit packages located on both sides of a substrate with only one heat sink.

US Patent:

20150276798, Oct 1, 2015

Filed:

Mar 28, 2014

Appl. No.:

14/229808

Inventors:

David Won-jun Song - Chandler AZ, US
Christopher Roy Schroeder - Gilbert AZ, US
Joseph Walczyk - Tigard OR, US
Lothar Kress - Portland OR, US
Todd Michael Young - Gilbert AZ, US
Robert Levi Bennett - Hillsboro OR, US
Arun Krishnamoorthy - Portland OR, US
Paul Jonathan Diglio - Beaverton OR, US
Charles Clifton Fulton - Phoenix AZ, US
Sruti Chigullapalli - Chandler AZ, US

International Classification:

G01R 1/04
G01R 31/26

Abstract:

Thermal interface material handing is described for thermal control of an electronic component under test. In one example, a thermal control unit is adapted to control the temperature of at least a portion of an electronic component during testing. A pedestal between the thermal control unit and the electronic component conducts heat from the electronic component to the thermal head. A conduit extends through a portion of the pedestal, to permit the flow of a liquid thermal interface material from an external source to a space between the pedestal and the electronic component. The liquid thermal interface material improves heat conduction between the electronic component and the pedestal. An elastomeric seal between the electronic device and the pedestal constrains the thermal interface fluid within the space between the electronic component and the pedestal.