A time domain reflectometer transmission line interface includes a pulse driver for generating a transmitted pulse signal. A coupling transformer coupled to the pulse driver couples the transmitted pulse signal to a transmission line and receives a reflected pulse signal from the transmission line. A differential amplifier is coupled to the pulse driver and to the coupling transformer through a network configured such that said transmitted pulse is balanced at the inverting and non-inverting inputs of the differential amplifier.
Time Domain Reflectometer With Digitally Generated Variable Width Pulse Output
A pulse generator includes circuitry for starting a pulse in response to receipt of a pulse enable signal. The pulse enable signal is synchronous with a first time base. The pulse generator includes circuitry for ending the pulse after a predetermined, user selectable, number of clock cycles. The clock cycles have a second time base that is asynchronous with the first time base. Since the end pulse signal is not on the same time base as the pulse enable signal, there is up to one asynchronous clock cycle period random variation in width of pulses having the same nominal width.
Apparatus For Detecting Imbalances In A Paired Line
Thomas W. Durston - North Richland Hills TX, US Robert G. Crick - Ranco Santa Fe CA, US
Assignee:
Textron Innovations Inc. - Providence RI
International Classification:
G01R 31/11 G01R 29/26
US Classification:
324533, 324613
Abstract:
A device for measuring and isolating noise-creating imbalances in a paired telecommunications line has an internal circuit. The internal circuit includes a pulse generator. Pulses provided by the pulse generator are applied to an interface which includes balanced pathways to the conductors. The pulses are applied simplex (longitudinally) to the pair of conductors. Upon encountering a fault in the pair, a reflected metallic voltage signal is received by the interface. The reflected metallic voltage signal is sampled by an analog-to-digital converter. Data relating to the sampled signal is displayed for detection and location of faults on the pair.
A bridge module provides connection between first and second conductors of a line under test and a test instrument adapted for use with the bridge module. The bridge module provides monitoring and measurement of DSL communication signals between the telephone company DSL terminal (DSLAM) and the subscriber home DSL equipment across a wide range of frequencies. The bridge module can be used at any point in the communications link and can be used while the link is active. The bridge module provides a clickless connection to the active DSL communications link to avoid interruption in DSL service.
Test Instruments For Pulse Tdr, Step Tdr And Transmission Analysis
The test instrument is used to perform both time domain reflectometry (TDR) and analysis of transmission signals on a line under test. Further, the test instrument provides for both pulse TDR and step TDR. A coupling transformer having an enhanced low frequency response provides for coupling of the test instrument to the line under test. Isolation circuits between the coupling transformer and the line under test to prevent damage to the test instrument due to voltages on the line under test allow the test instrument to be used in connection with an active line under test. Two isolation circuits are utilized to maintain longitudinal balance of the circuit. During step TDR, the positive and negative transmitter circuits provide step-shaped impulse signals. The enhanced low frequency response of the coupling transformer allows for transmission of step-shaped impulses, including the DC components of those signals, to the line under test and allows for transmission of reflected signals, including the DC components of those signals to the receivers. The test instrument provides selectable impedance matching and provides for selectable attenuation levels.
A system and method of data acquisition for transmission line performance evaluation and fault detection applications may incorporate wideband topology from reception of signals to be analyzed through to a high speed analog to digital converter. In accordance with one aspect of the present invention, for example, wideband variable gain amplifier and attenuation circuitry may be employed in conjunction with high speed sampling circuitry to facilitate event detection in a transmission line or wire; this implementation additionally allows seamless integration of spectrum analysis functionality in a single data acquisition system.
A system and method of data acquisition for transmission line performance evaluation and fault detection applications may incorporate wideband topology from reception of signals to be analyzed through to a high speed analog to digital converter. In accordance with one aspect of the present invention, for example, wideband variable gain amplifier and attenuation circuitry may be employed in conjunction with high speed sampling circuitry to facilitate event detection in a transmission line or wire; this implementation additionally allows seamless integration of spectrum analysis functionality in a single data acquisition system.
Thermal Attach And Detach Methods And System For Surface-Mounted Components
Thomas Durston - Reno NV, US Robert Larkin - Reno NV, US James Parsons - Reno NV, US Andrew Devey - Reno NV, US Alexander Prokop - Reno NV, US
International Classification:
A47J 36/02
US Classification:
228101000
Abstract:
A thermal attach and detach method and system for surface-mounted components (SMCs) employs a planar-heater which generates heat in response to an electrical current. The heater's resistance varies with its temperature, and the resistance is read to determine heater and SMC temperature. A means of gripping an SMC is provided such that the device's I/O contacts are heated by thermal conduction from the planar-heater through and/or along the SMC's side-walls. An electrical current is provided to the planar-heater such that heat sufficient to attach/detach the I/O contacts to or from a PCB is generated. The method enables the gripping, heating, resistance monitoring and SMC temperature measuring to occur simultaneously. Several means of gripping an SMC are described, including vacuum, mechanical, adhesive and magnetic. A method which employs a heating element to heat a substrate on which SMCs may be mounted is also described.
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