Theary Chheang - Bloomington MN, US Andrew Hine - St. Paul MN, US Mark Muggli - West St. Paul MN, US Susan Noe - St. Paul MN, US Patricia Sanft - St. Paul Park MN, US William Schultz - Vadnais Heights MN, US Robert Taylor - Stacy MN, US Stanley Tead - St. Paul MN, US
International Classification:
C08K003/34
US Classification:
524/445000
Abstract:
Incorporating organophilic clay into hot melt adhesive compositions, particularly those comprising semi-crystalline, thermoplastic polymers, greatly improves the adhesive properties in many respects. Some of these improvements are particularly beneficial to the specific use of hot melt adhesives filled with electrically conductive particles for use as electrically conductive adhesives.