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Suwit John Sangkaratana

age ~77

from Crown Point, IN

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Also known as:
  • Suwit J Sangkaratana
  • John J Sangkaratana
  • John S Sangkaratana
  • Suwit J Sangkaratan
  • Suwitt Sangkaratana
  • Suwit A
  • Suwit U
  • John Sang
  • Kim A
  • John Suwit
Phone and address:
2204 Elm Tree Ln, Crown Point, IN 46307
219 988-5623
Related to:
Connected to:

Suwit Sangkaratana Phones & Addresses

  • 2204 Elm Tree Ln, Crown Point, IN 46307 • 219 988-5623
  • Exeter, NH
  • Stratham, NH
  • Lowell, IN

Us Patents

  • Process Of Making Laminated Sheet And Product Made By The Process

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  • US Patent:
    20050257880, Nov 24, 2005
  • Filed:
    May 21, 2004
  • Appl. No.:
    10/850953
  • Inventors:
    William Herring - Valparaiso IN, US
    Shannon Crawford-Taylor - Merrillville IN, US
    Suwit Sangkaratana - Crown Point IN, US
  • International Classification:
    B44C001/165
    B32B031/00
  • US Classification:
    156230000, 156325000, 156243000
  • Abstract:
    A process of making an improved sheet/card laminate for packaging, signage, displays, transaction cards, ID cards and the like. The process comprises registering flat sheets to a film and then laminating the film or transferring coating(s) from the film to the individual, generally flat sheets via an adhesive. The film or coating(s) may include layered security, functional and/or decorative features.

  • Seamless Sleeve And Seamless Substrate

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  • US Patent:
    20110195266, Aug 11, 2011
  • Filed:
    Dec 6, 2010
  • Appl. No.:
    12/960747
  • Inventors:
    Louis M. Spoto - Hampton Falls NH, US
    Dean J. Randazzo - Chicago IL, US
    Matthew J. Deschner - Downers Grove IL, US
    William A. Herring - Valparaiso IN, US
    Shannon K. Crawford-Taylor - Merrillville IN, US
    Suwit Sangkaratana - Crown Point IN, US
    Paul R. Jelonek - Geneva IL, US
    Alan J. Varacins - Burlington WI, US
  • Assignee:
    Illinois Tool Works - Glenview IL
  • International Classification:
    B32B 3/30
    B32B 1/08
    B21D 22/08
  • US Classification:
    428586, 428156, 428600, 428161, 428 341, 428 3691, 428 344, 428 369, 722525
  • Abstract:
    A seamless, embossed or cast substrate is formed using a seamless sleeve having a seamless surface relief formed thereon and configured to slide over an cylindrical base in an embossing or casting assembly. The substrate is a flat web, foil, or film of, for example, paper, polyester, polypropylene, metal or other elongated flat material. The surface relief can be applied through interfering ablation, non-interfering ablation, ink jet printing, or other techniques wherein a seamless surface relief is formed onto the seamless sleeve. A method of making a seamless, embossed or cast substrate includes expanding a diameter of a seamless sleeve having a seamless surface relief formed thereon, sliding the expanded seamless sleeve onto a cylindrical base, allowing the diameter of the seamless sleeve to contract around the cylindrical base, and conveying a substrate through the embossing or casting assembly and embossing or casting the seamless surface relief into the substrate.

  • Non-Conductive Magnetic Stripe Assembly

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  • US Patent:
    20180240002, Aug 23, 2018
  • Filed:
    Feb 15, 2018
  • Appl. No.:
    15/897367
  • Inventors:
    - Glenview IL, US
    Suwit John Sangkaratana - Crown Point IN, US
    Roger D. Strasemeier - Sauk Village IL, US
  • Assignee:
    IIIinois Tool Works Inc. - Glenview IL
  • International Classification:
    G06K 19/06
    H05F 1/00
    B42D 25/373
    B42D 25/328
  • Abstract:
    A card assembly includes an insulating planar body and a magnetic stripe assembly coupled with the planar body. The magnetic stripe assembly includes a magnetic layer configured to magnetically store information and a metal layer that provides at least one of a security feature, a decorative feature, or other functional feature. The metal layer has a small thickness such that the metal layer prevents conduction of electrostatic discharge (ESD) through the magnetic stripe assembly.

  • Composite Laminate Assembly Used To Form Plural Individual Cards And Method Of Manufacturing The Same

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  • US Patent:
    20180232616, Aug 16, 2018
  • Filed:
    Feb 7, 2018
  • Appl. No.:
    15/890766
  • Inventors:
    - Glenview IL, US
    Suwit John Sangkaratana - Crown Point IN, US
    Roger D. Strasemeier - Sauk Village IL, US
  • Assignee:
    Illinois Tool Works Inc. - Glenview IL
  • International Classification:
    G06K 19/077
    B32B 27/06
    B32B 37/20
    B32B 38/00
  • Abstract:
    A laminated core stock sheet for use in a composite laminate assembly that is separated into individual cards is provided. The sheet includes a core substrate layer and an intermediate filmic layer coupled to the core substrate layer. The intermediate filmic layer includes a conductive material that provides a security, decorative, or functional feature of the cards. The core substrate layer and the intermediate filmic layer are coupled with another laminated core stock sheet to form the composite laminate assembly. The conductive material has a small thickness within the intermediate filmic layer such that the intermediate filmic layer prevents conduction of electrostatic discharge (ESD) through the intermediate filmic layer and outside of the individual cards.

  • Seamless Sleeve And Seamless Substrate

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  • US Patent:
    20150114062, Apr 30, 2015
  • Filed:
    Dec 29, 2014
  • Appl. No.:
    14/584945
  • Inventors:
    - Glenview IL, US
    Dean J. Randazzo - Chicago IL, US
    Matthew J. Deschner - Downers Grove IL, US
    William A. Herring - Valparaiso IN, US
    Shannon K. Crawford-Taylor - Merrillville IN, US
    Suwit Sangkaratana - Crown Point IN, US
    Paul R. Jelonek - Geneva IL, US
    Alan J. Varacins - Burlington WI, US
  • International Classification:
    B21B 27/00
    B21B 27/02
    B29C 59/02
  • US Classification:
    72 46, 264293, 425385, 722525, 2989532
  • Abstract:
    A seamless, embossed or cast substrate is formed using a seamless sleeve having a seamless surface relief formed thereon and configured to slide over an cylindrical base in an embossing or casting assembly. The substrate is a flat web, foil, or film of, for example, paper, polyester, polypropylene, metal or other elongated flat material. The surface relief can be applied through interfering ablation, non-interfering ablation, ink jet printing, or other techniques wherein a seamless surface relief is formed onto the seamless sleeve. A method of making a seamless, embossed or cast substrate includes expanding a diameter of a seamless sleeve having a seamless surface relief formed thereon, sliding the expanded seamless sleeve onto a cylindrical base, allowing the diameter of the seamless sleeve to contract around the cylindrical base, and conveying a substrate through the embossing or casting assembly and embossing or casting the seamless surface relief into the substrate.

  • Transfer Foils Utilizing Plasma Treatment To Replace The Release Layer

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  • US Patent:
    20140272440, Sep 18, 2014
  • Filed:
    Mar 15, 2013
  • Appl. No.:
    13/842548
  • Inventors:
    - Glenview IL, US
    Suwit J. Sangkaratana - Crown Point IN, US
    John H. Schneider - Frankfort IL, US
  • International Classification:
    B41M 3/12
    B01J 19/08
  • US Classification:
    428457, 427535
  • Abstract:
    A method providing for the replacement of the traditional release layer of transfer foils uses a plasma treatment to chemically modify the foil side surface of a PET substrate of the transfer foils. The chemically modified surface of the PET substrate provides the necessary low surface energy and release characteristics to allow for the controlled release of the foil from the PET carrier film. Accordingly, plasma treated transfer foils can be made without a release layer.
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