Sunil R Patel

US Patent:

7598380, Oct 6, 2009

Filed:

Jul 25, 2006

Appl. No.:

11/492750

Inventors:

Wansheng Liu - Edison NJ, US
Sunil S. Patel - Edison NJ, US
Nicolas Cuniere - Belle Mead NJ, US
Yvonne Lear - Candiac, CA
Prashant P. Deshpande - Princeton NJ, US
Jeffrey N. Simon - Lawrenceville NJ, US
Chiajen Lai - Kendall Park NJ, US
Annie J. Pullockaran - Pennington NJ, US
Nachimuthu Soundararajan - Kendall Park NJ, US
Jeffrey T. Bien - Princeton NJ, US

Assignee:

Bristol-Myers Squibb Company - Princeton NJ

International Classification:

C07D 487/04
C07D 213/69
C07D 213/73

US Classification:

544362, 546296, 546311

Abstract:

A method of preparing azaindole compounds for antiviral use having the formula.

US Patent:

7820820, Oct 26, 2010

Filed:

Aug 24, 2009

Appl. No.:

12/546108

Inventors:

Wansheng Liu - Edison NJ, US
Sunil S. Patel - Edison NJ, US
Nicolas Cuniere - Belle Mead NJ, US
Yvonne Lear - Candiac, CA
Prashant P. Deshpande - Princeton NJ, US
Jeffrey N. Simon - Lawrenceville NJ, US
Chiajen Lai - Kendall Park NJ, US
Annie J. Pullockaran - Pennington NJ, US
Nachimuthu Soundararajan - Kendall Park NJ, US
Jeffrey T. Bien - Princeton NJ, US

Assignee:

Bristol-Myers Squibb Company - Princeton NJ

International Classification:

C07D 487/04

US Classification:

544362, 546296, 546311

Abstract:

A method of preparing azaindole compounds for antiviral use having the formula.

US Patent:

5998242, Dec 7, 1999

Filed:

Oct 27, 1997

Appl. No.:

8/958776

Inventors:

Galen C. Kirkpatrick - Phoenix AZ
Manickam Thavarajah - San Jose CA
Sunil A. Patel - Los Altos CA
Stephen A. Murphy - San Jose CA

Assignee:

LSI Logic Corporation - Milpitas CA

International Classification:

H01L 2144

US Classification:

438127

Abstract:

A semiconductor chip fabrication assembly and method including a semiconductor package having a packaging substrate and a semiconductor die. An active circuit surface of the semiconductor die is positioned adjacent to a contact surface of the packaging substrate such that a substantially thin gap is formed therebetween. A semi-rigid shroud device is provided which defines a vacuum chamber configured to extend around the gap to hermetically seal the gap within the vacuum chamber. A dispensing device is provided having an outlet end positioned proximate the gap in the vacuum chamber which is adapted to vacuum flow the bonding material between the electrical contacts in the gap, and between the active circuit surface and the contact surface. The absence of air and any other gases forms a substantially voidless underfill layer of bonding material in the gap.

US Patent:

20160340373, Nov 24, 2016

Filed:

Aug 1, 2016

Appl. No.:

15/225261

Inventors:

- Princeton NJ, US
Yu Fan - Highland Park NJ, US
Collin Chan - New York NY, US
Lopa V. Desai - Chesterfield NJ, US
Sunil S. Patel - Edison NJ, US
Masano Sugiyama - Cranbury NJ, US

International Classification:

C07F 7/18
C07D 471/04
C07D 221/04

Abstract:

The disclosure generally relates to a process for the preparation of compounds of formula I, including synthetic intermediates which are useful in the process.

US Patent:

20150361047, Dec 17, 2015

Filed:

Aug 24, 2015

Appl. No.:

14/833891

Inventors:

- Princeton NJ, US
Yu Fan - Highland Park NJ, US
Collin Chan - New York NY, US
Lopa V. Desai - Chesterfield NJ, US
Sunil S. Patel - Edison NJ, US
Masano Sugiyama - Bloomfield NJ, US

International Classification:

C07D 221/04
C07F 7/18

Abstract:

The disclosure generally relates to a process for the preparation of compounds of formula I, including synthetic intermediates which are useful in the process.

US Patent:

20150099887, Apr 9, 2015

Filed:

Dec 12, 2014

Appl. No.:

14/568370

Inventors:

- Princeton NJ, US
Yu Fan - Highland Park NJ, US
Collin Chan - New York NY, US
Lopa V. Desai - Chesterfield NY, US
Sunil S. Patel - Edison NJ, US
Masano Sugiyama - Bloomfield NJ, US

International Classification:

C07F 7/18
C07D 471/04
C07D 221/04

US Classification:

546 14, 546183, 546118

Abstract:

The disclosure generally relates to a process for the preparation of compounds of formula I, including synthetic intermediates which are useful in the process.

US Patent:

20140135500, May 15, 2014

Filed:

Jan 16, 2014

Appl. No.:

14/156626

Inventors:

- Princeton NJ, US
Yu Fan - Highland Park NJ, US
Collin Chan - New York NY, US
Lopa V. Desai - Chesterfield NJ, US
Sunil S. Patel - Edison NJ, US
Masano Sugiyama - Bloomfield NJ, US

International Classification:

C07D 221/04
C07F 7/18

US Classification:

546 14, 546183

Abstract:

The disclosure generally relates to a process for the preparation of compounds of formula I, including synthetic intermediates which are useful in the process.