Sunil F Patel

US Patent:

6433565, Aug 13, 2002

Filed:

May 1, 2001

Appl. No.:

09/846435

Inventors:

Kishor V. Desai - Fremont CA
Maniam Alagaratnam - Cupertino CA
Sunil A. Patel - Los Altos CA

Assignee:

LSI Logic Corporation - Milpitas CA

International Classification:

G01R 3102

US Classification:

324755, 324765

Abstract:

A test fixture for a ball grid array package is disclosed that includes a test ball grid array package having a plurality of coarse pitch contacts formed on a coarse pitch surface of the test ball grid array package and a plurality of wafer bumps formed on a fine pitch surface of the test ball grid array package and an interposer coupled to the plurality of wafer bumps formed on the fine pitch surface of the test ball grid array package for coupling to a plurality of wafer bumps formed on a fine pitch surface of a subject ball grid array package.

US Patent:

59090570, Jun 1, 1999

Filed:

Sep 23, 1997

Appl. No.:

8/935424

Inventors:

John P. McCormick - Palo Alto CA
Sunil A. Patel - Los Altos CA

Assignee:

LSI Logic Corporation - Milpitas CA

International Classification:

H01L 2302
H01L 2334
H05K 720

US Classification:

257704

Abstract:

Provided is a single-piece integrated heat spreader/stiffener which is bonded to the substrate and die in a semiconductor package following electrical bonding of the die to the substrate, a packaging method using the integrated heat spreader/stiffener, and a semiconductor package incorporating the integrated heat spreader/stiffener. In a preferred embodiment, the integrated heat spreader/stiffener is a piece of high modulus, high thermal conductivity material shaped to attach over a die on the surface of a packaging substrate. The heat spreader/stiffener is equipped with a plurality of apertures to provide access to the top surface of the die for adhesive to bond the heat spreader/stiffener to the die, and to its perimeter to provide access for dispensation of underfill material between the die and the substrate. Once the adhesive and underfill materials are in place, the adhesive and underfill resins are cured by heating. A ball grid array (BGA) process may then be used to apply solder balls to the underside of the substrate for subsequent bonding of the package to a circuit board for use.

US Patent:

60021713, Dec 14, 1999

Filed:

Sep 22, 1997

Appl. No.:

8/935834

Inventors:

Kishor V. Desai - Livermore CA
Sunil A. Patel - Los Altos CA
John P. McCormick - Palo Alto CA

Assignee:

LSI Logic Corporation - Milpitas CA

International Classification:

H01L 2310
H01L 2334

US Classification:

257707

Abstract:

Provided is a multi-piece integrated heat spreader/stiffener assembly which is bonded to the substrate and die in a semiconductor package following electrical bonding of the die to the substrate, a packaging method using the integrated heat spreader/stiffener, and a semiconductor package incorporating the integrated heat spreader/stiffener. In a preferred embodiment, the integrated heat spreader/stiffener assembly has two pieces, both composed of a high modulus, high thermal conductivity material shaped to attach to each other and a die on the surface of a packaging substrate. A first piece of this assembly is bonded to the substrate surface adjacent to an electrically connected die and to the top surface of the die prior to the dispensation and curing of underfill material which provides the mechanical connection between the die and the substrate. With the first piece of the assembly in place, access may still be had to at least one edge of the die to dispense and cure the underfill epoxy. Once the underfill material is cured by heating, the second piece of the assembly is placed and bonded on the substrate either abutting or overlapping with the first piece.

US Patent:

6306751, Oct 23, 2001

Filed:

Sep 27, 1999

Appl. No.:

9/406308

Inventors:

Sunil A. Patel - Los Altos CA
Chok J. Chia - Cupertino CA
Kishor V. Desai - Fremont CA

Assignee:

LSI Logic Corporation - Milpitas CA

International Classification:

H01L 2144

US Classification:

438614

Abstract:

Provided is an apparatus and method for modifying the manufacture of chip carrier bond pads to increase the quality and reliability of semiconductor packages and ball joints in particular. This is accomplished by minimizing the corrosion of the barrier metal layer on the functional bond pads during gold deposition with the use of sacrificial pads electrically connected with the functional bond pads. According to one embodiment of the invention, a semiconductor package has copper conductive pads on a substrate that are exposed through a dielectric. Both functional and sacrificial (nonfunctional) copper conductive pads are provided. A barrier metal layer composed of nickel is electrolessly plated onto these conductive pads, and a bond metal layer of gold is deposited onto the nickel using electroless, generally immersion, gold plating. The surface area of the nickel on the sacrificial pads is less than that on the functional pads, and the nickel on the sacrificial pads corrodes first during electroless gold deposition. Without nickel corrosion on the functional bond pad, gold can more uniformly be deposited on the surface of the nickel layer.

US Patent:

6266249, Jul 24, 2001

Filed:

Aug 16, 1999

Appl. No.:

9/375835

Inventors:

Kishor V. Desai - Fremont CA
Sunil Patel - Los Altos CA
Ramaswamy Ranganathan - Saratoga CA

Assignee:

LSI Logic Corporation - Milpitas CA

International Classification:

H05K 118

US Classification:

361760

Abstract:

A semiconductor package is present along with an associated method. The package comprises a substrate with a top surface and a bottom surface, the substrate having a plurality of electrically conductive vias extending from the top surface of the substrate to the bottom surface of the substrate. A semiconductor device having an active surface, the active surface having a plurality of bonding pads, is attached to the substrate by an adhesive that bas holes that align with the vias. The vias are also aligned with the bonding pads. Solder serves to electrically and mechanically couple each of the bonding pads with a corresponding via. Each of the vias, in turn, is coupled to a solder ball formed on the bottom of the substrate.

US Patent:

61664340, Dec 26, 2000

Filed:

Sep 23, 1997

Appl. No.:

8/935583

Inventors:

Kishor V. Desai - Livermore CA
Sunil A. Patel - Los Altos CA
John P. McCormick - Palo Alto CA

Assignee:

LSI Logic Corporation - Milpitas CA

International Classification:

H01L 2312

US Classification:

257704

Abstract:

Provided is a die clip for use in semiconductor flip chip packaging as a replacement for the conventional combination of a heat spreader and stiffener, a packaging method using the die clip, and a semiconductor package incorporating the die clip. In a preferred embodiment, the die clip is a piece of high modulus, high thermal conductivity material shaped to attach over a die on the surface of a packaging substrate. The die clip closely engages the die while leaving some space open around the perimeter to provide access to the die. An underfill material may then be dispensed into the gap between the die and the substrate through an opening in the die clip. The underfill material is then cured, the die clip providing a heat sink and keeping the die and substrate flat and immobile during and after the curing process. A BGA process may then be used to apply solder balls to the underside of the substrate for subsequent bonding of the package to a circuit board for use.

US Patent:

20150264536, Sep 17, 2015

Filed:

Mar 17, 2014

Appl. No.:

14/216828

Inventors:

- San Diego CA, US
Sunil A. PATEL - Fremont CA, US
Gaurav LAMBA - Los Altos CA, US

Assignee:

QUALCOMM Incorporated - San Diego CA

International Classification:

H04W 4/04
H04W 4/02

Abstract:

A method of determining a present location of a mobile device within a structure includes: obtaining a prior location of the mobile device, the prior location being on a first floor of the structure; and in response to the prior location being indicative of the present location being remote from a floor transition, using a first set of access points to determine the present location, the first set of access points disposed only on the first floor; or in response to the prior location being indicative of the present location being proximate to the floor transition, using a second set of access points to determine the present location of the mobile device, the second set of access points comprising one or more access points disposed on the first floor and one or more access points disposed on the second floor, the second floor being separate from the first floor.

US Patent:

20150212191, Jul 30, 2015

Filed:

Sep 23, 2014

Appl. No.:

14/494483

Inventors:

- San Diego CA, US
Sundar Raman - Fremont CA, US
Chandrakant Mehta - Santa Clara CA, US
Arie Rahmat - San Diego CA, US
Sunil Patel - Santa Clara CA, US

International Classification:

G01S 5/02

Abstract:

Method, device, computer program product, and apparatus for performing and processing mobile device positioning are described. A mobile device can request vertical positioning assistance. The mobile device can receive vertical positioning assistance from a transmitter classified for vertical positioning assistance. The mobile device can receive optimized assistance data created in response to a particular positioning request. The optimized assistance data may be optimized for vertical position, horizontal positioning, or both usage types. The mobile device can receive usage type classifications directly from a transmitter. A server can receive and determine a request is a vertical positioning request. Vertical positioning can include determining one or more of: an altitude, floor, level, or any combination thereof, within the environment. Assistance data associated with a plurality of transmitters, vertical positioning assistance data from a transmitter classified for providing vertical assistance is selected and provided as vertical positioning assistance data.

Address:

8124 Keith Grn, Buena Park, CA 90621

Phone:

714 739-0770

VIN:

1HGCP2F88CA050033

Make:

HONDA

Model:

ACCORD

Year:

2012