Sung Y Tark

US Patent:

46109510, Sep 9, 1986

Filed:

Jul 25, 1985

Appl. No.:

6/746685

Inventors:

Melvin A. Lipson - Fullerton CA
Gene A. Derrico - Garden Grove CA
Sung Y. Tark - Irvine CA
Toshio Yamazaki - Mission Viejo CA

Assignee:

Dynachem Corporation - Tustin CA

International Classification:

G03C 500

US Classification:

430313

Abstract:

A photopolymerizable composition comprised of an addition polymerizable material, a photoinitiator, a thermal addition polymerization inhibitor and a polymeric binding agent. The addition polymerizable material is comprised of a defined monoethylenically unsaturated acrylate and one or more non-gaseous compounds having at least two terminal ethylenic groups. The photopolymerizable composition displays superior flexibility and develops and strips more efficiently when compared to a like composition but in the absence of the acrylate. The photopolymerizable composition may be in the form of sheet or roll on a film support which can be laminated to a substrate and can be used in the preparation of printed circuit boards.

US Patent:

45392862, Sep 3, 1985

Filed:

Jun 6, 1983

Appl. No.:

6/501199

Inventors:

Melvin A. Lipson - Fullerton CA
Gene A. Derrico - Garden Grove CA
Sung Y. Tark - Irvine CA
Toshio Yamazaki - Mission Viejo CA

Assignee:

Dynachem Corporation - Chicago IL

International Classification:

G03C 168

US Classification:

430277

Abstract:

A photopolymerizable composition comprised of an addition polymerizable material, a photoinitiator, a thermal addition polymerization inhibitor and a polymeric binding agent. The addition polymerizable material is comprised of a defined monoethylenically unsaturated acrylate and one or more non-gaseous compounds having at least two terminal ethylenic groups. The photopolymerizable composition displays superior flexibility and develops and strips more efficiently when compared to a like composition but in the absence of the acrylate. The photopolymerizable composition may be in the form of sheet or roll on a film support which can be laminated to a substrate and can be used in the preparation of printed circuit boards.