Stuart N Rounds

US Patent:

6406836, Jun 18, 2002

Filed:

Mar 21, 2000

Appl. No.:

09/531885

Inventors:

Robert Mohondro - Sykesville MD
Qingyuan Han - Columbia MD
Ivan Berry - Ellicott City MD
Mahmoud Dahimene - Sunnyvale CA
Stuart Rounds - Frederick MD

Assignee:

Axcelis Technologies, Inc. - Beverly MA

International Classification:

G03F 736

US Classification:

430329, 430311, 430313, 430314, 438706, 216 67

Abstract:

A method of stripping a photoresist layer comprising applying a re-coating material on the photoresist layer which extends through and fills openings in a first layer on which the photoresist layer is disposed, ashing the stack comprised of the photoresist layer and the re-coating material, and removing such re-coating material as remains in the openings in the first layer after the ashing.

US Patent:

6734120, May 11, 2004

Filed:

Feb 17, 2000

Appl. No.:

09/505695

Inventors:

Ivan Berry - Ellicott City MD
Stuart Rounds - Frederick MD
John Hallock - Potomac MD
Michael Owens - Austin TX
Mahmoud Dahimene - Sunnyvale CA

Assignee:

Axcelis Technologies, Inc. - Beverly MA

International Classification:

H01L 2131

US Classification:

438906, 438759, 438963

Abstract:

A method of enabling the removal of fluorine containing residue from a semiconductor substrate comprising applying a gas and/or vapor to which the residue is reactive to the residue while the temperature of the substrate is at an elevated level with respect to ambient temperature and the residue is exposed to ultraviolet radiation, for a time period which is sufficient to effect at least one of volatilizing the residue or rendering the residue hydrophilic enough to be removable with deionized water.

US Patent:

50714856, Dec 10, 1991

Filed:

Sep 11, 1990

Appl. No.:

7/580928

Inventors:

John C. Matthews - Gaithersburg MD
Robert D. Wooten - Rockville MD
David S. Ferris - Washington DC
Stuart N. Rounds - Germantown MD

Assignee:

Fusion Systems Corporation - Rockville MD

International Classification:

B08B 500

US Classification:

134 2

Abstract:

A method and apparatus for stripping a photoresist layer from a semiconductor wafer, wherein oxidizing gas is fed from the edge of the wafer to the center. The oxidizing gas may be directed so that it is incident on the heated wafer support platform before it is incident on the wafer.

Address:

5622 Crestwood Ct, Frederick, MD 21703

VIN:

5J6YH287X7L002141

Make:

HONDA

Model:

ELEMENT

Year:

2007