Bun Kobayashi - Cypress CA, US Steven W. Schell - Torrance CA, US Yonghan Chris Kim - La Mirada CA, US Pei-Ming Daniel Chow - Los Angeles CA, US
Assignee:
Microchip Technology Incorporated - Chandler AZ
International Classification:
H03G 3/30
US Classification:
330281, 330285
Abstract:
A step gain amplifier has an amplifier with an input and an output, and a bias circuit connected to the input and to a bias node. A passive feedback circuit using only passive elements connects the output to the input. A control circuit is connected to the bias circuit at the bias node.
Jason Blair - Pasadena CA, US Stephen Brawner - Pasadena CA, US Brian Coleman - Pasadena CA, US Alan Greaney - Buena Park CA, US Christian Gregory - La Crescenta CA, US Marc Grossman - Pasadena CA, US Gregg Luconi - Monrovia CA, US Carter Moursund - Pasadena CA, US Ulrik Pilegaard - Glendale CA, US Steven Schell - Arcadia CA, US Craig Tyner - Albuquerque NM, US
Assignee:
Esolar, Inc. - Burbank CA
International Classification:
A47L 1/02
US Classification:
134 56R
Abstract:
Systems and methods of heliostat reflector cleaning via a vehicle in a heliostat field.
Mechanical Arrangement And Components For Reducing Error In Deduced Reckoning
Steven Schell - Arcadia CA, US Joseph Brown - Valencia CA, US
International Classification:
G06F019/00
US Classification:
700245000
Abstract:
The present application discloses a mechanical arrangement and components for reducing errors in position estimation in mobile robotic vehicles that use deduced reckoning. The arrangement provides a method for determining the weight to be carried by the driven wheels to provide increased or maximum contact force between the driven wheels and a support surface, which in turn reduces or minimizes wheel slippage and reduces or minimizes vehicle tilting. The arrangement further provides uniquely shaped rolling elements that generate reduced sideways directed forces on the vehicle, thus reducing or minimizing wheel slippage.
Multi-Chip Electronic Circuit Module And A Method Of Manufacturing
Raymond Wong - Alhambra CA, US Steven W. Schell - Torrance CA, US
International Classification:
H01L 23/34 H01L 21/00
US Classification:
257724, 438106, 257E2308, 257E21001
Abstract:
An integrated circuit module has a substrate with an exposed surface. An integrated circuit die has a first surface and a second surface opposite the first surface, and has a plurality of bonding pads on the second surface. The integrated circuit die is positioned with its first surface on the exposed surface of the substrate. A plurality of dielectric layers cover the second surface of the integrated circuit die. At least one conductive layer is sandwiched between a pair of the plurality of dielectric layers, and forms one or more passive elements electrically connected to the plurality of bonding pads of the integrated circuit die, through one or more holes in one of the plurality of dielectric layers.
Solar Receivers With Internal Reflections And Flux-Limiting Patterns Of Reflectivity
Andrew Heap - Pasadena CA, US Steven Schell - Monrovia CA, US Gregg Luconi - Monrovia CA, US Quoc Pham - Los Angeles CA, US Adam Azarchs - Pasadena CA, US Dan Reznik - New York NY, US Porter Arbogast - Pasadena CA, US Craig Tyner - Albuquerque NM, US
International Classification:
F24J 2/06 F24J 2/07 F24J 2/48 F03G 6/06
US Classification:
126645, 126680, 126704, 126710
Abstract:
Solar receivers and particularly to solar receivers having one or more cavities and optionally having absorptivity/reflectivity patterns on surfaces and methods of reflective material application.
Bun Kobayashi - Cypress CA, US Steven W. Schell - Torrance CA, US Pei-Ming Daniel Chow - Los Angeles CA, US
International Classification:
H03H 11/24 H01P 1/22
US Classification:
333 81 R, 327308
Abstract:
An attenuator system comprises an attenuator and a control circuit for controlling the attenuation of the attenuator. In one embodiment, the attenuator comprises two diodes or two diode connected transistors, and the control circuit comprises two transistors as the only active devices. In another embodiment, the control circuit comprises another transistor in a shut down circuit.