- Elizabethtown KY, US Steven Sargeant - Elizabethtown KY, US Sudhir Naik - Noida, IN Sanjeev Gupta - Noida, IN Dipak Boral - Noida, IN Pramod Sirsamkar - Noida, IN
Embodiments of the disclosure relate to a blister package having a laminate structure that is heat-sealable to a lacquer layer on strain-hardened aluminum foil. The blister package includes a lid layer comprising a strain-hardened aluminum foil, a lacquer layer on a sealing surface of the strain-hardened aluminum foil and a laminate structure sealed directly to the lacquer layer. The laminate structure includes a multilayer film and a plurality of wells formed therethrough. The multilayer film includes a first formable layer of a thermoplastic material and a sealing layer of a copolyester material. The sealing layer overlies the first formable layer and has an outer surface opposite the first formable layer. The sealing layer has crystallinity from 5% to 20% as measured by differential scanning calorimetry (DSC). The outer surface of the sealing layer is sealed directly against the lacquer layer.