Stephen M Siu

US Patent:

6490162, Dec 3, 2002

Filed:

Aug 14, 2001

Appl. No.:

09/929682

Inventors:

Stephen Nicholas Siu - Los Angeles CA

Assignee:

International Rectifier Corporation - El Segundo CA

International Classification:

H05K 720

US Classification:

361719, 24458, 174 522, 257719

Abstract:

A power module having a power circuit board free of mounting holes and more usable surface area for disposition of copper traces is shown. The power module includes a power shell that snaps onto the underside of the power circuit board. The power shell has embedded therein a thermally conductive substrate. One or a plurality of power semiconductor devices are disposed over one side of the thermally conductive substrate. A heatsink is mounted to the underside of the power shell in thermal contact with the thermally conductive substrate. The heatsink is mounted to the underside of the power shell by a heatsink retainer which biases the heatsink against the substrate. The heatsink retainer is mounted on retainer posts which extend from the underside of the power shell.

US Patent:

62815792, Aug 28, 2001

Filed:

Feb 13, 1998

Appl. No.:

9/023125

Inventors:

Stephen N. Siu - Los Angeles CA

Assignee:

International Rectifier Corporation - El Segundo CA

International Classification:

H01L 2312
H01L 2518
H01L 2348
H01L 2352

US Classification:

257730

Abstract:

An insert-molded leadframe having wire bonding posts formed on an inner portion, device pins formed on an outer portion, and a central portion connecting between the inner portion and the outer portion. Plastic encases the central portion of the conductive leadframe, such that the bonding posts and the device pins are exposed at inner and outer edges, respectively, of the plastic casing. The bonding posts and the device pins are disposed substantially perpendicular to one another. The conductive leadframe is formed with the bonding posts in a first plane and the device pins in a second plane, the first and second planes being substantially mutually parallel. The conductive leadframe then is encased in plastic by injection molding to form the insert-molded leadframe of the invention. An IMS substrate with powertrain electronics is adhered to the bottom of the bonding posts at the inner edge of the insert-molded leadframe, and the powertrain electronics are electrically connected by wire bonding to the top of the bonding posts. A circuit board containing driver electronics is mounted on and electrically connected to the device pins at the outer edge of the plastic casing.