Stephen A Cromwell

US Patent:

7385824, Jun 10, 2008

Filed:

Jul 29, 2005

Appl. No.:

11/192736

Inventors:

Stephan K. Barsun - Sacranento CA, US
Brent Allen Boudreaux - Highland Village TX, US
Brandon Rubenstein - Loveland CO, US
Stephen Daniel Cromwell - Penryn CA, US
Eric C. Peterson - McKinney TX, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 7/20

US Classification:

361719, 361707, 361709, 361717, 361718, 257707

Abstract:

A processor module includes a processor and a voltage regulator both mounted on a carrier. The voltage regulator is mounted with its contacts under compression to ensure good electrical contact with pads on the carrier. Heat sinks mounted respectively on the processor and the voltage regulator are rigidly coupled to each other to provide rigidity to the module and thus maintain the desired compression of the voltage regulator contacts.

US Patent:

7926552, Apr 19, 2011

Filed:

Oct 19, 2007

Appl. No.:

11/875218

Inventors:

Jeffrey Metcalf - Frisco TX, US
Brandon Rubenstein - Loveland CO, US
Stephen D. Cromwell - Penryn CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

F28D 15/00

US Classification:

165 803, 16510426

Abstract:

An apparatus comprising a heat dispersion device having a first end. The first end has a shape different than that of the remainder of the heat dispersion device. The apparatus also comprises a jacket coupled to the heat dispersion device at the first end. The jacket has another shape associated with that of the remainder of the heat dispersion device.