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Stanton J Dent

age ~65

from Midland, MI

Also known as:
  • Stanton James Dent
  • Stan J Dent
  • Stan S Dent
  • Stan L Dent
  • James Dent Stanton
Phone and address:
3865 E Johns Ln, Midland, MI 48642
989 839-9668

Stanton Dent Phones & Addresses

  • 3865 E Johns Ln, Midland, MI 48642 • 989 839-9668
  • Roscommon, MI

Work

  • Position:
    Service Occupations

Education

  • Degree:
    High school graduate or higher

Us Patents

  • Semiconductor Package And Method Of Preparing Same

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  • US Patent:
    6940177, Sep 6, 2005
  • Filed:
    May 16, 2002
  • Appl. No.:
    10/068755
  • Inventors:
    Stanton James Dent - Midland MI, US
    Lyndon James Larson - Auburn MI, US
    Robert Thomas Nelson - Bay City MI, US
    Debra Charilla Rash - Santa Cruz, BO
  • Assignee:
    Dow Corning Corporation - Midland MI
  • International Classification:
    H01L023/48
  • US Classification:
    257779, 257678, 257784, 257668, 257778, 257788, 257789, 257791, 257782, 257783, 257795, 257 84, 438106, 438108, 438121, 438127, 156335
  • Abstract:
    A semiconductor package comprising a semiconductor wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and at least one cured silicone member covering at least a portion of the active surface, wherein at least a portion of each bond pad is not covered by the silicone member, the silicone member has a coefficient of linear thermal expansion of from 60 to 280 μm/m C. between −40 and 150 C. and a modulus of from 1 to 300 MPa at 25 C. , and the silicone member is prepared by the method of the invention.
  • Process For Preparing Clustered Functional Polyorganosiloxanes, And Methods For Their Use

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  • US Patent:
    20120245272, Sep 27, 2012
  • Filed:
    Nov 3, 2010
  • Appl. No.:
    13/508375
  • Inventors:
    Stanton Dent - Midland MI, US
    Kai Su - Midland MI, US
    Lauren Tonge - Sanford MI, US
    James Tonge - Sanford MI, US
  • International Classification:
    C08F 8/00
    C08L 83/07
  • US Classification:
    524502, 525100, 524547
  • Abstract:
    A hydrosilylation process is used to prepare a polyorganosiloxane having clustered functional groups at the polyorganosiloxane chain terminals. The ingredients used in the process include a) a polyorganosiloxane having an average of at least 2 aliphatically unsaturated organic groups per molecule, b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule and at least 4 silicon bonded hydrogen atoms for each aliphatically unsaturated organic group in ingredient a), c) a reactive species having, per molecule at least 1 aliphatically unsaturated organic group and 1 or more curable groups; and d) a hydrosilylation catalyst. The resulting clustered functional polyorganosiloxane is useful in a curable silicone composition for electronics applications.
  • Vacuum Dispensable Silicone Compositions

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  • US Patent:
    59772263, Nov 2, 1999
  • Filed:
    May 4, 1998
  • Appl. No.:
    9/072229
  • Inventors:
    Stanton James Dent - Midland MI
    Edward Joseph Benson - Fremont CA
    Ann Walstrom Norris - Midland MI
    Yeong Joo Lee - Midland MI
  • Assignee:
    Dow Corning Corporation - Midland MI
  • International Classification:
    C08K 554
  • US Classification:
    524267
  • Abstract:
    A vacuum dispensable silicone composition comprising (A) a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) an organopolysiloxane resin consisting essentially of (a) R. sup. 3. sub. 2 (CH. sub. 2. dbd. CH)SiO. sub. 1/2 siloxane units, (b) R. sup. 3. sub. 3 SiO. sub. 1/2 siloxane units, and (c) SiO. sub. 4/2 siloxane units wherein each R. sup. 3 is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups free of aliphatic unsaturation, the mole ratio of the combination of (a) and (b) units to (c) units is from 0. 6 to 1. 1, and the resin contains 1 to 5 percent by weight of vinyl groups; (C) an organohydrogenpolysiloxane having an average of at least three silicon-bonded hydrogen atoms per molecule in an amount sufficient to provide from one to three silicon-bonded hydrogen atoms per alkenyl group in components (A) and (B) combined; (D) an adhesion promoter in an amount sufficient to effect adhesion of the composition to a substrate; (E) a hydrosilylation catalyst; (F) a platinum catalyst inhibitor having a boiling point greater than 150. degree. C. at 0. 10 MPa in an amount sufficient to retard curing of the composition at ambient temperature; wherein the composition is substantially free of air.
  • Curable Silicone Composition With Reduced Mold Fouling

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  • US Patent:
    20200291187, Sep 17, 2020
  • Filed:
    May 17, 2018
  • Appl. No.:
    16/611918
  • Inventors:
    - Midland MI, US
    Stanton Dent - Midland MI, US
    Pierre Descamps - Rixensart, BE
    Stuart Leadley - Ck, IE
    Joel McDonald - Midland MI, US
    Kevin van Tiggelen - Seneffe, BE
    Michelle Cummings - Midland MI, US
    Serge Creutz - Liege, BE
    Francois de Buyl - Seneffe, BE
  • Assignee:
    Dow Silicones Corporation - Midland MI
  • International Classification:
    C08G 77/20
    C08G 77/06
    C09D 183/06
    B29C 45/00
  • Abstract:
    A curable silicone composition comprising (A) an alkenyl-containing organopolysiloxane comprising (A-1) a dialkylpolysiloxane that has an average of at least two alkenyl groups in each molecule), and (A-2) an alkenyl-containing, resin-form organopolysiloxane that comprises the SiOunit, RRSiOunit, and RSiOunit; (B) an organopolysiloxane that has an average of at least three silicon-bonded hydrogen atoms in each molecule, wherein component (B) is an organopolysiloxane comprising (B-1) an organopolysiloxane that contains at least 0.7 mass % silicon-bonded hydrogen and that comprises SiOunits and HRSiOunits in a ratio ranging from 1.50 to 2.50 moles of HRSiOunits per 1 mole of SiOunits, at 50 to 100 mass % of component (B), and (B-2) a straight-chain organopolysiloxane that contains at least 0.3 mass % silicon-bonded hydrogen, at 0 to 50 mass % of component (B); and (C) a hydrosilylation reaction catalyst.
  • Injection Moldable Silicone Composition

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  • US Patent:
    20200139594, May 7, 2020
  • Filed:
    Aug 6, 2018
  • Appl. No.:
    16/623958
  • Inventors:
    - Midland MI, US
    Stanton Dent - Midland MI, US
    Joel P. McDonald - Midland MI, US
    Jacob Steinbrecher - Midland MI, US
    Michael Strong - Midland MI, US
    Bradley W. Tuft - Midland MI, US
    Clinton Whiteley - Wichita KS, US
  • International Classification:
    B29C 45/00
    C08L 83/04
    C08G 77/20
    C08G 77/16
    C08G 77/18
    C08G 77/08
  • Abstract:
    An injection moldable composition, comprising: A) a silicone resin (I) [RSiO][RRSiO][SiO], wherein R, R, and Rare hydrocarbyl, hydrocarbyloxy, or hydroxyl, at least one of Ror Ris alkenyl, subscripts a, b, and c are each >0 and a+b+c=1, B) 0 to 90% (w/w), based on the weight of A) and B), of a silicone resin (II) [RSiO][SiO]wherein Ris hydrocarbyl, hydrocarbyloxy, or hydroxyl, at least one of Ris alkenyl, subscripts d and e are each >0, and d+e=1, C) a siloxane polymer having formula (III), [RSiO]RRSiO]. wherein Rare hydrocarbyl or hydroxyl, at least one of Ris alkenyl, subscripts f and g are each >0, and f+g=1, D) a silicone crosslinker having at least two silicon-bonded hydrogen atoms per molecule, and E) a hydrosilylation catalyst, wherein the ratio of silicon-bonded hydrogen atoms to carbon-carbon double bonds is from 1.2 to 2.2.

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  • Category:
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  • Uploaded:
    03 Apr, 2009
  • Duration:
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The Dark Droid Trailer 1

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  • Uploaded:
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Batman Calls a Drunk Radio Host

Batman decides to call that drunk radio dude.

  • Category:
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  • Uploaded:
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  • Duration:
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Grand Theft Auto 3 Mission #39 Smack Down

Uh-oh! Kenji looks pissed! Even though Claude put a dent in the Columi...

  • Category:
    Gaming
  • Uploaded:
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  • Duration:
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