Micron Technology
Director, Product Quality Manufacturing
Micron Technology Jul 2015 - Mar 2019
Operations Central Team Product Quality Manager
Micron Inc 2009 - 2015
Device Characterization Lead
Micron Technology May 2006 - Mar 2008
Photo Process Engineer
Nxp Semiconductors Aug 2005 - May 2006
Cmp Process Development Engineer
Education:
University of South Florida 2002 - 2005
Masters, Electrical Engineering
Skills:
Semiconductors Device Characterization Cmos Design of Experiments Semiconductor Industry Yield Verilog Failure Analysis Jmp Process Simulation Photolithography Thin Films Ic Silicon Spc Integrated Circuits
Us Patents
Vertical Transistor Devices, Memory Arrays, And Methods Of Forming Vertical Transistor Devices
Kuo Chen Wang - Boise ID, US Sriraj Manavalan - Boise ID, US Wei Ming Liao - Taipei, TW
International Classification:
H01L 29/78 H01L 21/336
US Classification:
257334, 257329, 438270, 257E2141, 257E29262
Abstract:
A vertical transistor device includes a line of active area adjacent a line of dielectric isolation. A buried data/sense line obliquely angles relative to the line of active area and the line of dielectric isolation. A pair of gate lines is outward of the buried data/sense line and obliquely angle relative to the line of active area and the line of dielectric isolation. A vertical transistor channel region is within the active area between the pair of gate lines. An outer source/drain region is in the active area above the channel region and an inner source/drain region is in the active area below the channel region. The inner source/drain region is electrically coupled to the buried data/sense line. Other devices and structures are contemplated, as are methods of forming a plurality of vertical transistor devices.
Vertical Transistor Devices, Memory Arrays, And Methods Of Forming Vertical Transistor Devices
- Boise ID, US Sriraj Manavalan - Boise ID, US Wei Ming Liao - Rueishan Township, TW
International Classification:
H01L 27/108
Abstract:
A vertical transistor device includes a line of active area adjacent a line of dielectric isolation. A buried data/sense line obliquely angles relative to the line of active area and the line of dielectric isolation. A pair of gate lines is outward of the buried data/sense line and obliquely angle relative to the line of active area and the line of dielectric isolation. A vertical transistor channel region is within the active area between the pair of gate lines. An outer source/drain region is in the active area above the channel region and an inner source/drain region is in the active area below the channel region. The inner source/drain region is electrically coupled to the buried data/sense line. Other devices and structures are contemplated, as are methods of forming a plurality of vertical transistor devices.