Nova Measuring Instruments
Senior Software Engineer
Kla-Tencor Dec 2010 - Sep 2015
Senior Software Engineer
Solyndra 2010 - 2010
Senior Software Engineer
Life Technologies Jul 2007 - Jan 2009
Senior Software Engineer and Algorithm Developer
Qylur Security Systems 2009 - 2009
Staff Software Engineer
Education:
Vnicpv, Russian Center For Surface and Vacuum Investigations 1988 - 1992
Doctorates, Doctor of Philosophy, Physics, Philosophy
Lomonosov Moscow State University (Msu) 1979 - 1985
Masters, Physics
Skills:
C++ Software Development Algorithms Programming C C# Software Engineering Oop Semiconductors Testing Multithreading Software Design Agile Methodologies R&D Object Oriented Design Metrology Physics Analysis Data Analysis
Languages:
English
Us Patents
Step Function Determination Of Auger Peak Intensity
Dimitri Klyachko - Cupertino CA Sergey Borodyansky - Cupertino CA Leonid Vasilyev - Sunnyvale CA
Assignee:
FEI Company - Hillsboro OR
International Classification:
H01J 3705
US Classification:
250305, 250306, 250307, 250310
Abstract:
An electron analyzer and its method of operation useful for determining the intensity of a peak in the electron spectrum. The invention is particularly useful for determining the intensity of an Auger peak of a given element in the sample being probed and associating the intensity with a concentration of that element in the sample. The electron spectrum is measured above and below the anticipated peak. The data near the peak are not used. The remaining data above the peak and below the peak are fit to respective equations linearly dependent upon the measurement energy. The difference of the two equations at the value of the peak energy is associated with the peak intensity and the elemental concentration. The invention can be applied to measuring nitrogen concentration in a thin protective film of amorphous carbon or diamond.
Measurement Of Film Thickness By Inelastic Electron Scattering
Leonid A. Vasilyev - Sunnyvale CA Robert Linder - Santa Clara CA Sergey Borodyansky - Sunnyvale CA Dmitri Klyachko - Cupertino CA
Assignee:
FEI Company - Hillsboro OR
International Classification:
H01J 37073
US Classification:
250310, 250305, 250307
Abstract:
A method and apparatus for measuring the thickness of a thin coating, having a thickness on the order of 1 to 10 nm, of one material formed over a substrate of another material of significantly different atomic number, for example, a carbon coating on a ferromagnetic substrate. A primary radiation source, for example, of electrons or X-ray, creates low-energy secondary electrons in the substrate. The intensity of inelastically scattered electrons generally increases with film thickness. The secondary electron spectrum measured for a test sample is compared with the spectra for a plurality of similar reference samples of the same set of compositions, and a test thickness is thereby determined. The method may be practice on conventional electron spectrometers with the addition of some programmed analysis. Various techniques are available for extracting the data and comparing the test and reference data.
Target And Process Sensitivity Analysis To Requirements
- Milpitas CA, US Nuriel Amir - St. Yokne'am, IL Mark Ghinovker - Yoqneam Ilit, IL Tal Shusterman - Haifa, IL David Gready - Tel Aviv, IL Sergey Borodyansky - Sunnyvale CA, US
International Classification:
G06F 17/50
Abstract:
Systems and method are provided for analyzing target, process and metrology configuration sensitivities to a wide range of parameters, according to external requirements or inner development and verification needs. Systems comprise the following elements. An input module is arranged to receive parameters relating to targets, target metrology conditions and production processes, to generate target data. A metrology simulation unit is arranged to simulate metrology measurements of targets from the target data and to generate multiple metrics that quantify the simulated target measurements. A sensitivity analysis module is arranged to derive functional dependencies of the metrics on the parameters and to define required uncertainties of the parameters with respect to the derived functional dependencies. Finally, a target optimization module is arranged to rank targets and target metrology conditions with respect to the simulated target measurements.