Abstract:
A flexible electronic device and method of manufacture are disclosed. According to one embodiment of the present invention, a flexible electronic device includes a front; a back; and a plurality of layers disposed between the front and the back. A plurality of components, including processor, a memory, a display, a display driver, a battery, and a data interface, may be disposed on the layers. The flexible electronic device may also include a plurality of flex points so that the flexible electronic device can be flexed relative to each flex point. According to another embodiment of the invention, the method of manufacturing a flexible electronic device by lamination includes (1) providing a first source of front layers for the flexible electronic device; (2) providing a second source of back layers for the flexible electronic device; (3) providing a source for each interior layer of the flexible electronic device, at least one interior layer having at least one flexible electronic component disposed thereon; (4) pressing the front, interior, and back layers together, resulting in a laminate; and (5) curing the laminate.