Sean M Sweetnam

US Patent:

20120186642, Jul 26, 2012

Filed:

Sep 22, 2010

Appl. No.:

13/497657

Inventors:

Christophe Ballif - Neuchatel, CH
Franz-Joseph Haug - Saint-Blaise, CH
Sean Sweetnam - Menlo Park CA, US
Thomas Söderström - Aarberg, CH

Assignee:

ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL) - Lausanne

International Classification:

H01L 31/0264
H01L 31/0368
H01L 31/18
H01L 31/0687

US Classification:

136255, 136258, 438 96, 257E31011

Abstract:

A solar cell includes a support (), a back electrode layer (), at least a hydrogenated microcrystalline silicon photoelectric device (), and a top electrode layer (). The back electrode layer () has a rough surface. The solar cell includes, between the back electrode layer () and the hydrogenated microcrystalline silicon photoelectric device (), an asymmetric intermediate layer (), the intermediate layer () being adjacent to the hydrogenated microcrystalline silicon photoelectric device () and having a surface, on the side of the back electrode layer (), having a roughness greater than the roughness of the surface of the intermediate layer () on the side of the hydrogenated microcrystalline silicon device (). Such solar cells allow obtaining optimum Voc and FF parameters, while maintaining high current.

US Patent:

20220380617, Dec 1, 2022

Filed:

Nov 9, 2020

Appl. No.:

17/763084

Inventors:

- St. Paul MN, US
Sean M. Sweetnam - Minneapolis MN, US
Jeffrey P. Kalish - St. Paul MN, US
Caitlin E. Meree - St. Paul MN, US
Badri Veeraraghavan - Woodbury MN, US
Matthew H. Frey - Cottage Grove MN, US

International Classification:

C09D 11/50
B41M 5/28

Abstract:

A PTSM-coated expandable microsphere comprises a polymer shell enclosing an interior volume containing at least one blowing agent. The polymer shell has an outer surface with photothermal susceptor material disposed on at least a portion thereof. If heated to at least one temperature greater than 25 C., each of the expandable microspheres expands, but does not rupture, the polymer shell by a sufficient amount to at least double the interior volume. A markable comprises a substrate and a viewable layer secured thereto. The viewable layer comprises a binder material retaining the PTSM-coated expandable microspheres. A method of marking a markable article comprises imagewise exposing the PTSM-coated expandable microspheres of the markable article to at least sufficient electromagnetic radiation to cause the PTSM-coated expandable microspheres to expand thereby creating a predetermined image. A marked article preparable according to the method is also disclosed.

US Patent:

20230065275, Mar 2, 2023

Filed:

Aug 9, 2022

Appl. No.:

17/818445

Inventors:

- St. Paul MN, US
Sean M. Sweetnam - Minneapolis MN, US
Daniel M. Pierpont - North St. Paul MN, US
Jiaying Ma - Cottage Grove MN, US
Dong-Wei Zhu - North Oaks MN, US
Nelson T. Rotto - Woodbury MN, US

International Classification:

C08K 9/06
C08K 3/013
H01B 3/44
H01B 7/02
H01B 7/17

Abstract:

A polymer coated conductive ribbon is described herein, wherein the polymer coated conductive ribbon consists essentially of a smooth conductive member having a defined width and thickness substantially enclosed in an insulating polymeric sheath, wherein the insulating polymeric sheath comprises a thermoplastic insulating polymer as a first storage modulus (G′) is above 0.2 MPa at 40 C. and a second storage modulus below 0.05 MPa at 160 C.

US Patent:

20230011730, Jan 12, 2023

Filed:

Dec 26, 2020

Appl. No.:

17/757121

Inventors:

- St. Paul MN, US
Sean M. Sweetnam - Minneapolis MN, US
Stephen P. Maki - North St. Paul MN, US

International Classification:

G02B 5/20
G02B 1/14
G02B 5/08
G02B 5/18
B32B 7/023
B32B 7/08
B32B 27/08
B32B 27/16
B32B 27/18
B32B 27/32

Abstract:

Ultraviolet-C (UV-C) radiation shielding films including a substrate made of a fluoropolymer, a multilayer optical film disposed on a major surface of the substrate, and a heat-sealable encapsulant layer disposed on a major surface of the multilayer optical film opposite the substrate. The multilayer optical film is made of at least a multiplicity of alternating first and second optical layers collectively reflecting at an incident light angle of at least one of 0, 30, 45, 60, or 75, at least 30 percent of incident ultraviolet light over at least a 30-nanometer wavelength reflection bandwidth in a wavelength range from at least 100 nanometers to 280 nanometers. The ultraviolet light shielding film may be applied to a major surface of a photovoltaic device, such as a component of a satellite or an unmanned aerial vehicle. Methods of making the UV-C radiation-protective films also are disclosed.

US Patent:

20210305452, Sep 30, 2021

Filed:

Jun 14, 2021

Appl. No.:

17/347314

Inventors:

- Rochester Hills MI, US
Sean SWEETNAM - Menlo Park CA, US
Brendan M. KAYES - Los Gatos CA, US
Melissa J. ARCHER - San Jose CA, US
Gang HE - Cupertino CA, US

International Classification:

H01L 33/00
H01L 31/0216
H01L 33/22
H01L 33/30
H01L 33/42
H01L 33/44
H01L 33/46
H01L 31/18
H01L 31/056
H01L 31/0236

Abstract:

A method is provided for preparing at least one textured layer in an optoelectronic device. The method includes epitaxially growing a semiconductor layer of the optoelectronic device over a growth substrate; exposing the semiconductor layer to an etching process to create the at least one textured surface on the semiconductor layer; and lifting the optoelectronic device from the growth substrate.

US Patent:

20170148930, May 25, 2017

Filed:

Feb 1, 2017

Appl. No.:

15/422218

Inventors:

- Sunnyvale CA, US
Sean SWEETNAM - Menlo Park CA, US
Brendan M. KAYES - Los Gatos CA, US
Melissa J. ARCHER - San Jose CA, US
Gang HE - Cupertino CA, US

International Classification:

H01L 31/0236
H01L 31/0224
H01L 31/0216
H01L 31/0232
H01L 33/00
H01L 33/30
H01L 33/42
H01L 33/44
H01L 33/46
H01L 31/18
H01L 31/0304
H01L 33/22

Abstract:

An optoelectronic device having a textured layer is described. In an aspect, a method may be used to produce the optoelectronic device, where the method includes epitaxially growing a semiconductor layer of the optoelectronic device on a growth substrate, and exposing the semiconductor layer to an etching process to create at least one textured surface in the semiconductor layer. The textured semiconductor layer can be referred to as a textured layer. The etching process is performed without the use of a template layer, or similar layer, configured as a mask to generate the texturing. The etching process can be done by one or more of a liquid or solution-based chemical etchant, gas etching, laser etching, plasma etching, or ion etching. The method can also include lifting the semiconductor layer of the optoelectronic device from the growth substrate by, for example, the use of an epitaxial lift off (ELO) process.